AMD XC2VP2-6FGG256C

Overview

XC2VP2-6FGG256C from Xilinx is a Virtex-II Pro platform FPGA with 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max), and no embedded PowerPC processor block. It features 204 user I/Os in a 256-ball fine-pitch wire-bond BGA package (1.0 mm pitch), 12 DCM clock management units, and supports LVDS, SSTL, HSTL, and PCI-compliant I/O standards for high-speed serial and parallel interface applications in telecom and datacom systems.

For engineers reviewing the XC2VP2-6FGG256C datasheet, pinout, applications, or equivalent options, key selection considerations include its -6 speed grade timing performance, FG256/FGG256 package I/O count and ball map, RocketIO transceiver compliance with Fibre Channel and Gigabit Ethernet, and absence of PowerPC core - distinguishing it from higher-density Virtex-II Pro variants.

Technical Context

The XC2VP2-6FGG256C implements a SRAM-based, reprogrammable FPGA architecture built on a 0.13 µm nine-layer copper process with 1.5 V core voltage (VCCINT) and 2.5 V auxiliary I/O supply (VCCAUX). Its 4 RocketIO transceivers operate at up to 2.5 Gb/s in wire-bond packages and support 8B/10B encoding, channel bonding, and programmable pre-emphasis.

It contains 1,408 CLB slices, 44 18×18-bit multipliers, 12 Block SelectRAM+ modules (18 Kb each), and 12 Digital Clock Managers (DCMs) enabling precise phase shifting, frequency synthesis, and deskew - all routed via Active Interconnect Technology with hierarchical, predictable delay routing resources.

Key Specifications

Pinout & Package

XC2VP2-6FGG256C uses the FGG256 wire-bond fine-pitch BGA package: 256 balls, 1.0 mm pitch, 17 mm × 17 mm body size, Pb-free construction. Pin definitions follow Xilinx DS083 Module 4, with dedicated configuration pins (PROG_B, CCLK, DONE), JTAG TAP (TCK/TDI/TDO/TMS), 204 user I/Os grouped in banks with independent VCCO, and 4 RocketIO transceiver pairs occupying fixed ball positions.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based interface and logic acceleration applications.

Compared with XC2VP2-6FGG256C, XC2VP4-6FGG456C adds processor capability and logic density but increases board area and cost; XC3S1000-4FGG320C removes transceivers entirely and targets simpler logic-only roles - making XC2VP2-6FGG256C the optimal balance of serial I/O, logic capacity, and package size for mid-tier interface bridging.

Availability

XC2VP2-6FGG256C is available at Aetrix Electronics and suitable for telecom backplane interfaces, PCI-X bridge controllers, HD video pipelines, and secure configuration gatekeepers requiring stable component supply across extended product lifecycles.

Supply support for XC2VP2-6FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company founded in 1984 and acquired by AMD in 2022; it developed the first commercially successful FPGA and continues to lead in adaptive computing architectures.

The Virtex-II Pro family - including XC2VP2-6FGG256C - was engineered for high-performance system integration, combining FPGA fabric with hard IP blocks (RocketIO transceivers) to replace multi-chip solutions in networking, wireless infrastructure, and video processing.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP2-6FGG256C?

The XC2VP2-6FGG256C supports RocketIO transceivers operating at up to 2.5 Gb/s in wire-bond packages like FGG256. This rate complies with Gigabit Ethernet, Fibre Channel, and XAUI standards. The -6 speed grade ensures timing closure at this rate under commercial temperature conditions, and the transceivers include 8B/10B encoding, channel bonding, and programmable pre-emphasis - all confirmed in DS083 Module 2 and Table 4.

Does XC2VP2-6FGG256C include an embedded PowerPC processor core?

No, XC2VP2-6FGG256C does not contain a PowerPC 405 processor block. As shown in Table 1 of DS083, only Virtex-II Pro devices starting from XC2VP4 and above integrate PowerPC cores. XC2VP2-6FGG256C is optimized for pure logic and serial I/O acceleration, making it suitable for applications requiring transceivers and FPGA fabric without embedded processing overhead.

What package type and pin count does XC2VP2-6FGG256C use?

XC2VP2-6FGG256C uses the FGG256 package: a 256-ball fine-pitch wire-bond BGA with 1.0 mm pitch and 17 mm × 17 mm body size. It is Pb-free and RoHS-compliant. This package provides 204 user I/Os plus dedicated configuration, JTAG, and transceiver pins - documented in DS083 Module 4 Pinout Tables and Table 3 of the Introduction and Overview.

Can XC2VP2-6FGG256C be configured via JTAG boundary scan?

Yes, XC2VP2-6FGG256C supports IEEE 1149.1-compliant JTAG boundary scan using TCK, TMS, TDI, and TDO pins. It implements standard instructions including EXTEST, INTEST, SAMPLE, and BYPASS, enabling board-level interconnect testing and in-system programming. The TAP controller is fully integrated and verified per DS083 Module 1 Section "Boundary Scan" and Module 3 Electrical Characteristics.

What clock management resources are available in XC2VP2-6FGG256C?

XC2VP2-6FGG256C includes 12 Digital Clock Manager (DCM) modules. Each DCM provides digital deskew, frequency synthesis (integer/fractional multiplication/division), and coarse/fine phase shifting (down to 1/256 of period). These DCMs drive 16 global clock multiplexer buffers, enabling robust clock distribution across the FPGA fabric - specifications confirmed in DS083 Module 1 Architecture section and Module 3 Timing Parameters.