AMD XC2VP2-6FGG256I

Overview

XC2VP2-6FGG256I from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond packages), and 204 user I/Os in a 256-pin Fine-Pitch BGA (FGG256) package. It integrates SRAM-based configurable logic, Digital Clock Managers (DCMs), 18×18-bit multipliers, and SelectRAM+ memory blocks - designed for high-speed serial interconnect, telecom backplane interfaces, and embedded system-on-chip prototyping.

For engineers reviewing the XC2VP2-6FGG256I datasheet, pinout, applications, or equivalent options, key selection criteria include its -6 speed grade timing (350 MHz PowerPC clock support), industrial temperature rating (–40°C to +100°C), FGG256 Pb-free packaging, and absence of embedded PowerPC cores - making it suitable for cost-optimized, transceiver-centric designs without processor subsystems.

Technical Context

This device implements Xilinx's 0.13 µm nine-layer copper process with Active Interconnect routing, supporting up to 2.5 Gb/s per RocketIO channel in FG/FGG packages. Its architecture includes 1,408 CLB slices, 12 DCMs for clock deskew/multiplication/phase shift, and Digitally Controlled Impedance (DCI) for on-die termination across 22 single-ended and 10 differential I/O standards.

The XC2VP2-6FGG256I lacks PowerPC processor blocks (per Table 1) and RocketIO X transceivers (exclusive to XC2VPX variants), and uses only the standard RocketIO SERDES core with 8-/16-/32-bit parallel FPGA interface, 8B/10B encoding, and channel bonding support for up to 20 channels - all operating from dedicated 2.5 V transceiver supply rails.

Key Specifications

Pinout & Package

XC2VP2-6FGG256I is housed in a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.0 mm pitch, Pb-free finish, and wire-bond construction. It supports industrial temperature operation (–40°C to +100°C) and features dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG TAP signals (TCK/TDI/TDO/TMS), and 204 user-configurable I/O balls distributed across 12 banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based serial interconnect applications.

Compared with XC2VP2-6FGG256I, XC2VP4-6FGG456I adds processor capability and I/O count but increases cost and power; XC3S1600E-4FGG400C eliminates transceivers entirely, trading serial connectivity for lower gate count and price - making XC2VP2-6FGG256I the optimal balance for transceiver-reliant, processor-free embedded systems.

Availability

XC2VP2-6FGG256I is available at Aetrix Electronics and suitable for telecom line card development, industrial video bridge designs, and high-speed data acquisition systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC2VP2-6FGG256I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-II Pro family was engineered for high-performance system integration - combining FPGA fabric, multi-gigabit transceivers, and (in higher variants) embedded PowerPC cores to replace ASICs in telecom, networking, and DSP applications.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP2-6FGG256I?

The XC2VP2-6FGG256I supports RocketIO transceivers rated for up to 2.5 Gb/s in wire-bond packages like FGG256, as confirmed in Table 4 of DS083 (v5.0). This speed applies to protocols including Gigabit Ethernet and Fibre Channel. The device does not support RocketIO X transceivers (6.25 Gb/s), which are exclusive to XC2VPX-series parts.

Does XC2VP2-6FGG256I include an embedded PowerPC processor core?

No, XC2VP2-6FGG256I does not contain a PowerPC 405 processor block. Per Table 1 in DS083, only XC2VP4 and higher Virtex-II Pro devices integrate PowerPC cores. XC2VP2 is optimized for transceiver-intensive, logic-dense applications without embedded processing - reducing die area, power, and cost.

What package type and lead finish does XC2VP2-6FGG256I use?

XC2VP2-6FGG256I uses the FGG256 package: a 256-ball Fine-Pitch BGA with 1.0 mm pitch and Pb-free (RoHS-compliant) finish. The "FGG" prefix explicitly denotes the Pb-free variant of the standard FG256 wire-bond package, validated for industrial temperature operation (–40°C to +100°C).

How many Digital Clock Managers (DCMs) are available in XC2VP2-6FGG256I?

XC2VP2-6FGG256I contains 12 Digital Clock Managers (DCMs), as specified in Table 1 of DS083. Each DCM provides fully digital clock deskew, frequency synthesis (integer/fractional multiplication/division), and fine-grained phase shifting (1/256 period resolution) - critical for synchronizing multi-clock-domain designs such as video pipelines or DDR interfaces.

Is XC2VP2-6FGG256I recommended for new designs?

No, XC2VP2-6FGG256I is marked "Product Not Recommended For New Designs" in DS083 (v5.0). While fully functional and supported for existing production, Xilinx advises migration to newer families (e.g., Kintex-7 or Versal) for new projects due to obsolescence planning, limited toolchain updates, and absence of modern features like PCIe Gen3 or hardened ARM cores.