AMD XC2VP2-6FGG456C

Overview

XC2VP2-6FGG456C from Xilinx is a Virtex-II Pro platform FPGA with 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max), and no embedded PowerPC processor block. It features 12 DCMs, 216 I/O pins in a 456-ball fine-pitch BGA (FGG456), and operates at -6 speed grade (commercial temperature range). It targets high-speed serial interconnect applications such as Gigabit Ethernet and Fibre Channel edge interfaces.

For engineers reviewing the XC2VP2-6FGG456C datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver performance at 2.5 Gb/s, confirmed 456-ball FGG package pin mapping, DCI-enabled I/O termination support, and compatibility with Xilinx ISE 14.7 toolchain for legacy design maintenance.

Technical Context

The XC2VP2-6FGG456C implements a SRAM-based, 0.13 µm nine-layer copper FPGA architecture with dedicated 18×18-bit multipliers, Block SelectRAM+ (18 Kb dual-port RAM), and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X. Its 4 RocketIO transceivers are wire-bond variants rated up to 2.5 Gb/s (–6 speed grade) and include monolithic CDR, 8B/10B encoding, and per-channel loopback.

Digital Clock Manager (DCM) modules provide precise clock deskew, integer/fractional frequency synthesis, and ±180° phase shifting. The device uses Active Interconnect routing with hierarchical switch matrices and supports partial reconfiguration, bitstream encryption (DES), and IEEE 1149.1 boundary-scan - all validated for the FGG456 package configuration.

Key Specifications

Pinout & Package

XC2VP2-6FGG456C uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.0 mm pitch, wire-bond interconnect, and Pb-free finish. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V configurable), and transceiver reference clocks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based serial interface applications.

Compared with XC2VP4-6FGG456C, the XC2VP2-6FGG456C offers identical transceiver count and package but reduced logic and no processor - ideal for pure serial interface offload. Versus XC3S1600E-4FGG456C, it delivers essential multi-gigabit transceivers absent in Spartan-3E, making it irreplaceable for standards-compliant high-speed serial links.

Availability

XC2VP2-6FGG456C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, and legacy FPGA-based networking equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP2-6FGG456C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-II Pro family was engineered for high-performance, system-level integration - combining FPGA fabric, multi-gigabit transceivers, and embedded processors to replace ASICs in telecom, aerospace, and high-end instrumentation.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP2-6FGG456C?

The XC2VP2-6FGG456C supports RocketIO transceivers operating at up to 2.5 Gb/s in wire-bond FGG456 packaging at –6 speed grade, as specified in DS083 Table 4. This speed is validated for standards including Gigabit Ethernet (1.25 Gb/s), Fibre Channel (1.0625 Gb/s), and XAUI (3.125 Gb/s requires higher-grade devices). The XC2VP2-6FGG456C does not support RocketIO X cores or 4.25/6.25 Gb/s operation.

Does XC2VP2-6FGG456C include an embedded PowerPC processor?

No, the XC2VP2-6FGG456C contains zero PowerPC 405 processor blocks, as confirmed in DS083 Table 1. It belongs to the base Virtex-II Pro series (not Pro X) and is differentiated from XC2VP4 and higher variants by the absence of embedded RISC cores. All processing must be implemented in programmable logic or external controllers. The XC2VP2-6FGG456C retains full RocketIO transceiver functionality despite lacking the processor block.

Which development tools support XC2VP2-6FGG456C design and programming?

Xilinx ISE Design Suite 14.7 is the final officially supported toolchain for XC2VP2-6FGG456C, providing synthesis, implementation, and bitstream generation. Programming is performed via JTAG (IEEE 1149.1) using iMPACT or third-party boundary-scan tools. ChipScope ILA integration is fully supported for real-time debugging. The XC2VP2-6FGG456C is not compatible with Vivado, as it predates the 7-series architecture transition.

What package type and ball count does XC2VP2-6FGG456C use?

The XC2VP2-6FGG456C uses a 456-ball Fine-Pitch Ball Grid Array (FGG456) package with 1.0 mm pitch and Pb-free finish, as documented in DS083 Table 3. It is a wire-bond construction (not flip-chip), supporting 216 user I/O pins plus dedicated configuration, clock, and transceiver pins. Thermal and mechanical specifications align with Xilinx's FGG456 land pattern guidelines in UG079.

Is XC2VP2-6FGG456C recommended for new designs?

No - Xilinx explicitly marks XC2VP2-6FGG456C as "Product Not Recommended For New Designs" in DS083 v5.0. It remains available for legacy system repair, obsolescence mitigation, and long-life industrial deployments, but Xilinx advises migration to 7-series or UltraScale FPGAs for new projects. Aetrix Electronics maintains inventory and supply-chain continuity specifically for such end-of-life components.