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AMD XC2VP2-7FGG256C

Part No.:
XC2VP2-7FGG256C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
256-BGA
Datasheet:
AetrixXC2VP2-7FGG256C.pdf
Description:
IC FPGA 140 I/O 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,361

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Product details

Overview

XC2VP2-7FGG256C from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max), and no embedded PowerPC processor block. It uses a 0.13 µm copper process, 1.5 V core supply, and supports SelectIO-Ultra I/O standards including LVDS, SSTL, and HSTL. It targets high-speed serial interconnect in telecom and datacom systems requiring reconfigurable logic with integrated SERDES.

For engineers reviewing the XC2VP2-7FGG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its 4-channel 2.5 Gb/s RocketIO transceiver capability, 204 user I/Os in FGG256 package, DCI-enabled single-ended termination, and absence of PowerPC cores-making it suitable for non-processor-based high-bandwidth interface bridging and protocol adaptation.

Technical Context

The XC2VP2-7FGG256C implements a SRAM-based configurable logic fabric with Configurable Logic Blocks (CLBs), 18 Kb Block SelectRAM+ memory modules, and dedicated 18×18 multipliers. Its routing architecture uses Active Interconnect Technology with hierarchical switch matrices and predictable delay independent of fanout.

It integrates four RocketIO transceivers supporting full-duplex operation at up to 2.5 Gb/s (wire-bond packages), 8B/10B encoding, programmable pre-emphasis, on-chip 50 Ω termination, and internal loopback modes. Clock management is handled by up to twelve Digital Clock Managers (DCMs) offering phase shifting, frequency synthesis, and deskew.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells 3,168 - defines maximum combinational + sequential logic capacity for custom RTL implementation
RocketIO Transceivers 4 × 2.5 Gb/s - enables four independent high-speed serial links (e.g., Gigabit Ethernet, Fibre Channel)
User I/O Pins 204 - supports wide parallel buses or multiple differential interfaces (LVDS, SSTL, HSTL)
Block RAM 12 × 18 Kb SelectRAM+ - provides 216 KB true dual-port embedded memory for FIFOs or buffering
Digital Clock Managers 4 DCMs - deliver jitter-tolerant clock synthesis, phase alignment, and deskew across logic domains
I/O Standards LVDS, SSTL-2/18, HSTL-I/II/III/IV, LVTTL, LVCMOS - ensures compatibility with DDR memory, PCI-X, and backplane interfaces
Core Voltage 1.5 V VCCINT - defines power delivery requirements and thermal budget for system-level design

Pinout & Package

XC2VP2-7FGG256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.0 mm pitch, wire-bond construction, and Pb-free finish. The package supports 204 user I/Os plus configuration, clock, and power pins.

Pin/Terminal Circuit Role Design Meaning
CCLK Configuration Clock Input Drives internal configuration shift register during master serial or SelectMAP programming
DONE Configuration Status Output Open-drain signal indicating successful bitstream loading and device initialization
M0–M2 Mode Selection Inputs Set configuration mode (e.g., slave serial, master SelectMAP) at power-up
PROG_B Program Initiate Input Active-low signal triggering full reconfiguration and clearing internal configuration memory
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface Enables IEEE 1149.1-compliant testing, debugging, and partial reconfiguration
DXP/DXN Differential Clock Input Pair Accepts low-jitter differential reference clock for DCMs and RocketIO transceivers
GCLK0–GCLK15 Global Clock Inputs Drive dedicated global clock networks with minimal skew across the entire FPGA fabric

Key Features

Feature Design Value
Digitally Controlled Impedance (DCI) On-chip series/parallel termination for single-ended I/O standards eliminates external resistors and improves signal integrity
RocketIO Transceivers Four 2.5 Gb/s full-duplex SERDES channels with 8B/10B encoding, channel bonding, and internal loopback for validation
SelectIO-Ultra I/O Support for 22 single-ended and 10 differential standards-including LVDS (840 Mb/s), SSTL, and HSTL-with programmable drive strength
Block SelectRAM+ 12 × 18 Kb true dual-port RAM blocks enabling independent read/write access for high-throughput buffering and memory-mapped peripherals
Digital Clock Manager (DCM) Four fully digital DCMs providing precise phase shifting (1/256 period resolution), frequency synthesis, and zero-delay buffer functionality

Applications

Telecom Line Card Interface Data Center Backplane Bridge

Use Scenario: Aggregating multiple T1/E1 or STM-1 streams into a common high-speed serial bus for central switching.

IC Role / Device Role / Timing Role: Protocol translation and serialization/deserialization using RocketIO transceivers and CLB-based framing logic.

Use Value: Eliminates discrete PHYs and glue logic; leverages 2.5 Gb/s transceivers and 204 I/Os to consolidate legacy interfaces onto a single reconfigurable platform.

Use Scenario: Bridging between proprietary parallel backplane protocols and standardized serial interconnects like XAUI or Aurora.

IC Role / Device Role / Timing Role: High-fanout I/O translation and clock domain crossing between asynchronous subsystems.

Use Value: Uses SelectIO-Ultra with DCI and 12 DCMs to maintain timing closure across mixed-voltage, multi-standard interfaces without external termination or clock buffers.

Industrial Video Transport Test Equipment Pattern Generator

Use Scenario: Real-time conversion of parallel CMOS image sensor output to serialized LVDS or embedded clock video streams.

IC Role / Device Role / Timing Role: Pixel-rate synchronization, parallel-to-serial conversion, and jitter-cleaned clock generation via DCMs.

Use Value: Achieves sub-nanosecond skew control across 204 I/Os and uses 18×18 multipliers for real-time color space transformation before serialization.

Use Scenario: Generating high-fidelity, multi-channel digital stimulus patterns synchronized to external clocks in ATE systems.

IC Role / Device Role / Timing Role: Deterministic pattern storage in Block SelectRAM+, precise edge placement via DCM phase shift, and LVDS output driving.

Use Value: Delivers <100 ps output jitter and supports 840 Mb/s LVDS signaling-meeting JEDEC JESD65B timing compliance for high-speed digital test vectors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based high-speed interface applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2VP4-7FGG456C 6,768 logic cells, 1 embedded PowerPC 405 core, 4 RocketIO transceivers, 348 user I/Os Supports soft-core processor integration and larger logic density; requires larger FGG456 package Choose when adding embedded firmware control or expanding logic capacity beyond XC2VP2 limits
XC3S1600E-4FGG456C Spartan-3E FPGA, no transceivers, 1600K system gates, 304 I/Os, 1.2 V core Lacks high-speed serial I/O; suited for cost-sensitive, non-serial applications only Choose only if serial transceivers are unnecessary and lower power/cost outweighs performance loss

Compared with XC2VP2-7FGG256C, XC2VP4-7FGG456C adds processor capability and logic resources but increases board area and BOM cost; XC3S1600E-4FGG456C offers lower unit price and power but cannot replace RocketIO functionality-making it unsuitable for any application requiring >1 Gb/s serial links.

Availability

XC2VP2-7FGG256C is available at Aetrix Electronics and suitable for telecom line cards, industrial video transport systems, and test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP2-7FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-II Pro family was designed for high-performance, system-level integration-combining FPGA fabric, multi-gigabit transceivers, and embedded processors to replace ASICs in telecom, networking, and DSP applications.

FAQ

Is XC2VP2-7FGG256C still recommended for new designs?

No, XC2VP2-7FGG256C is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0. It remains available for legacy support and obsolescence mitigation, but newer Virtex-4, Virtex-5, or Kintex families are advised for new projects due to improved performance, lower power, and extended lifecycle support.

What is the maximum data rate supported by the RocketIO transceivers in XC2VP2-7FGG256C?

The XC2VP2-7FGG256C supports RocketIO transceivers rated at up to 2.5 Gb/s per channel in wire-bond packages like FGG256. This is confirmed in Table 4 of DS083 for -7 speed grade devices using FG/FGG packages, and applies specifically to XC2VP2-not the higher-rate RocketIO X variants found in XC2VPX devices.

Does XC2VP2-7FGG256C include an embedded PowerPC processor?

No, XC2VP2-7FGG256C contains zero PowerPC 405 processor blocks. As shown in Table 1 of DS083, only XC2VP4 and higher Virtex-II Pro devices include one or two PowerPC cores; XC2VP2 is optimized for pure logic + transceiver applications without embedded processing.

Which I/O standards are supported by XC2VP2-7FGG256C with on-chip termination?

XC2VP2-7FGG256C supports Digitally Controlled Impedance (DCI) for single-ended standards including LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL-2, SSTL-18, HSTL Class I–IV, and PCI/PCI-X. DCI provides automatic on-die series or parallel termination-no external resistors required for impedance matching.

Can XC2VP2-7FGG256C be configured via JTAG boundary scan?

Yes, XC2VP2-7FGG256C fully supports IEEE 1149.1 JTAG boundary-scan through dedicated TCK, TMS, TDI, and TDO pins. It implements BYPASS, SAMPLE, EXTEST, INTEST, and USERCODE instructions, enabling in-system programming, verification, and debug without requiring additional configuration PROMs.

XC2VP2-7FGG256C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II Pro
Package/Case:
256-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
352
Number of Logic Elements/Cells:
3168
Total RAM Bits:
221184
Number of I/O:
140
Number of Gates:
-
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
256-FBGA (17x17)

XC2VP2-7FGG256C FAQ

1.How can I place an order for XC2VP2-7FGG256C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2VP2-7FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2VP2-7FGG256C reliable?

The price and inventory of XC2VP2-7FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP2-7FGG256C is usually 5 days.

3.What payment methods are accepted for XC2VP2-7FGG256C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP2-7FGG256C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2VP2-7FGG256C?

XC2VP2-7FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2VP2-7FGG256C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2VP2-7FGG256C?

For technical support, including XC2VP2-7FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP2-7FGG256C requirements.

6.How does Aetrix verify that XC2VP2-7FGG256C is sourced from the original manufacturer or authorized distributors?

All XC2VP2-7FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP2-7FGG256C meets industry standards.

7.What is the process for return or replacement of XC2VP2-7FGG256C?

All XC2VP2-7FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP2-7FGG256C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2VP2-7FGG256C part is unused and in its original packaging.

Return procedure for XC2VP2-7FGG256C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2VP2-7FGG256C Tags

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