AMD XC2VP2-7FGG256C
- Part No.:
- XC2VP2-7FGG256C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 256-BGA
- Datasheet:
-
XC2VP2-7FGG256C.pdf
- Description:
- IC FPGA 140 I/O 256FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC2VP2-7FGG256C from Xilinx is a Virtex-II Pro platform FPGA featuring 3,168 logic cells, 4 RocketIO multi-gigabit transceivers (2.5 Gb/s max), and no embedded PowerPC processor block. It uses a 0.13 µm copper process, 1.5 V core supply, and supports SelectIO-Ultra I/O standards including LVDS, SSTL, and HSTL. It targets high-speed serial interconnect in telecom and datacom systems requiring reconfigurable logic with integrated SERDES.
For engineers reviewing the XC2VP2-7FGG256C datasheet, pinout, applications, or equivalent options, key selection criteria include its 4-channel 2.5 Gb/s RocketIO transceiver capability, 204 user I/Os in FGG256 package, DCI-enabled single-ended termination, and absence of PowerPC cores-making it suitable for non-processor-based high-bandwidth interface bridging and protocol adaptation.
Technical Context
The XC2VP2-7FGG256C implements a SRAM-based configurable logic fabric with Configurable Logic Blocks (CLBs), 18 Kb Block SelectRAM+ memory modules, and dedicated 18×18 multipliers. Its routing architecture uses Active Interconnect Technology with hierarchical switch matrices and predictable delay independent of fanout.
It integrates four RocketIO transceivers supporting full-duplex operation at up to 2.5 Gb/s (wire-bond packages), 8B/10B encoding, programmable pre-emphasis, on-chip 50 Ω termination, and internal loopback modes. Clock management is handled by up to twelve Digital Clock Managers (DCMs) offering phase shifting, frequency synthesis, and deskew.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 3,168 - defines maximum combinational + sequential logic capacity for custom RTL implementation |
| RocketIO Transceivers | 4 × 2.5 Gb/s - enables four independent high-speed serial links (e.g., Gigabit Ethernet, Fibre Channel) |
| User I/O Pins | 204 - supports wide parallel buses or multiple differential interfaces (LVDS, SSTL, HSTL) |
| Block RAM | 12 × 18 Kb SelectRAM+ - provides 216 KB true dual-port embedded memory for FIFOs or buffering |
| Digital Clock Managers | 4 DCMs - deliver jitter-tolerant clock synthesis, phase alignment, and deskew across logic domains |
| I/O Standards | LVDS, SSTL-2/18, HSTL-I/II/III/IV, LVTTL, LVCMOS - ensures compatibility with DDR memory, PCI-X, and backplane interfaces |
| Core Voltage | 1.5 V VCCINT - defines power delivery requirements and thermal budget for system-level design |
Pinout & Package
XC2VP2-7FGG256C is housed in a 256-ball Fine-Pitch Ball Grid Array (FGG256) package with 1.0 mm pitch, wire-bond construction, and Pb-free finish. The package supports 204 user I/Os plus configuration, clock, and power pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration shift register during master serial or SelectMAP programming |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading and device initialization |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., slave serial, master SelectMAP) at power-up |
| PROG_B | Program Initiate Input | Active-low signal triggering full reconfiguration and clearing internal configuration memory |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant testing, debugging, and partial reconfiguration |
| DXP/DXN | Differential Clock Input Pair | Accepts low-jitter differential reference clock for DCMs and RocketIO transceivers |
| GCLK0–GCLK15 | Global Clock Inputs | Drive dedicated global clock networks with minimal skew across the entire FPGA fabric |
Key Features
| Feature | Design Value |
|---|---|
| Digitally Controlled Impedance (DCI) | On-chip series/parallel termination for single-ended I/O standards eliminates external resistors and improves signal integrity |
| RocketIO Transceivers | Four 2.5 Gb/s full-duplex SERDES channels with 8B/10B encoding, channel bonding, and internal loopback for validation |
| SelectIO-Ultra I/O | Support for 22 single-ended and 10 differential standards-including LVDS (840 Mb/s), SSTL, and HSTL-with programmable drive strength |
| Block SelectRAM+ | 12 × 18 Kb true dual-port RAM blocks enabling independent read/write access for high-throughput buffering and memory-mapped peripherals |
| Digital Clock Manager (DCM) | Four fully digital DCMs providing precise phase shifting (1/256 period resolution), frequency synthesis, and zero-delay buffer functionality |
Applications
| Telecom Line Card Interface | Data Center Backplane Bridge |
|---|---|
|
Use Scenario: Aggregating multiple T1/E1 or STM-1 streams into a common high-speed serial bus for central switching. IC Role / Device Role / Timing Role: Protocol translation and serialization/deserialization using RocketIO transceivers and CLB-based framing logic. Use Value: Eliminates discrete PHYs and glue logic; leverages 2.5 Gb/s transceivers and 204 I/Os to consolidate legacy interfaces onto a single reconfigurable platform. |
Use Scenario: Bridging between proprietary parallel backplane protocols and standardized serial interconnects like XAUI or Aurora. IC Role / Device Role / Timing Role: High-fanout I/O translation and clock domain crossing between asynchronous subsystems. Use Value: Uses SelectIO-Ultra with DCI and 12 DCMs to maintain timing closure across mixed-voltage, multi-standard interfaces without external termination or clock buffers. |
| Industrial Video Transport | Test Equipment Pattern Generator |
|
Use Scenario: Real-time conversion of parallel CMOS image sensor output to serialized LVDS or embedded clock video streams. IC Role / Device Role / Timing Role: Pixel-rate synchronization, parallel-to-serial conversion, and jitter-cleaned clock generation via DCMs. Use Value: Achieves sub-nanosecond skew control across 204 I/Os and uses 18×18 multipliers for real-time color space transformation before serialization. |
Use Scenario: Generating high-fidelity, multi-channel digital stimulus patterns synchronized to external clocks in ATE systems. IC Role / Device Role / Timing Role: Deterministic pattern storage in Block SelectRAM+, precise edge placement via DCM phase shift, and LVDS output driving. Use Value: Delivers <100 ps output jitter and supports 840 Mb/s LVDS signaling-meeting JEDEC JESD65B timing compliance for high-speed digital test vectors. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based high-speed interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP4-7FGG456C | 6,768 logic cells, 1 embedded PowerPC 405 core, 4 RocketIO transceivers, 348 user I/Os | Supports soft-core processor integration and larger logic density; requires larger FGG456 package | Choose when adding embedded firmware control or expanding logic capacity beyond XC2VP2 limits |
| XC3S1600E-4FGG456C | Spartan-3E FPGA, no transceivers, 1600K system gates, 304 I/Os, 1.2 V core | Lacks high-speed serial I/O; suited for cost-sensitive, non-serial applications only | Choose only if serial transceivers are unnecessary and lower power/cost outweighs performance loss |
Compared with XC2VP2-7FGG256C, XC2VP4-7FGG456C adds processor capability and logic resources but increases board area and BOM cost; XC3S1600E-4FGG456C offers lower unit price and power but cannot replace RocketIO functionality-making it unsuitable for any application requiring >1 Gb/s serial links.
Availability
XC2VP2-7FGG256C is available at Aetrix Electronics and suitable for telecom line cards, industrial video transport systems, and test equipment requiring stable component supply and long-term obsolescence management.
Supply support for XC2VP2-7FGG256C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.
The Virtex-II Pro family was designed for high-performance, system-level integration-combining FPGA fabric, multi-gigabit transceivers, and embedded processors to replace ASICs in telecom, networking, and DSP applications.
FAQ
Is XC2VP2-7FGG256C still recommended for new designs?
No, XC2VP2-7FGG256C is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0. It remains available for legacy support and obsolescence mitigation, but newer Virtex-4, Virtex-5, or Kintex families are advised for new projects due to improved performance, lower power, and extended lifecycle support.
What is the maximum data rate supported by the RocketIO transceivers in XC2VP2-7FGG256C?
The XC2VP2-7FGG256C supports RocketIO transceivers rated at up to 2.5 Gb/s per channel in wire-bond packages like FGG256. This is confirmed in Table 4 of DS083 for -7 speed grade devices using FG/FGG packages, and applies specifically to XC2VP2-not the higher-rate RocketIO X variants found in XC2VPX devices.
Does XC2VP2-7FGG256C include an embedded PowerPC processor?
No, XC2VP2-7FGG256C contains zero PowerPC 405 processor blocks. As shown in Table 1 of DS083, only XC2VP4 and higher Virtex-II Pro devices include one or two PowerPC cores; XC2VP2 is optimized for pure logic + transceiver applications without embedded processing.
Which I/O standards are supported by XC2VP2-7FGG256C with on-chip termination?
XC2VP2-7FGG256C supports Digitally Controlled Impedance (DCI) for single-ended standards including LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL-2, SSTL-18, HSTL Class I–IV, and PCI/PCI-X. DCI provides automatic on-die series or parallel termination-no external resistors required for impedance matching.
Can XC2VP2-7FGG256C be configured via JTAG boundary scan?
Yes, XC2VP2-7FGG256C fully supports IEEE 1149.1 JTAG boundary-scan through dedicated TCK, TMS, TDI, and TDO pins. It implements BYPASS, SAMPLE, EXTEST, INTEST, and USERCODE instructions, enabling in-system programming, verification, and debug without requiring additional configuration PROMs.
XC2VP2-7FGG256C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 256-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 352
- Number of Logic Elements/Cells:
- 3168
- Total RAM Bits:
- 221184
- Number of I/O:
- 140
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 256-FBGA (17x17)
XC2VP2-7FGG256C FAQ
1.How can I place an order for XC2VP2-7FGG256C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP2-7FGG256C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP2-7FGG256C reliable?
The price and inventory of XC2VP2-7FGG256C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP2-7FGG256C is usually 5 days.
3.What payment methods are accepted for XC2VP2-7FGG256C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP2-7FGG256C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP2-7FGG256C?
XC2VP2-7FGG256C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP2-7FGG256C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP2-7FGG256C?
For technical support, including XC2VP2-7FGG256C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP2-7FGG256C requirements.
6.How does Aetrix verify that XC2VP2-7FGG256C is sourced from the original manufacturer or authorized distributors?
All XC2VP2-7FGG256C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP2-7FGG256C meets industry standards.
7.What is the process for return or replacement of XC2VP2-7FGG256C?
All XC2VP2-7FGG256C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP2-7FGG256C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP2-7FGG256C part is unused and in its original packaging.
Return procedure for XC2VP2-7FGG256C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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