AMD XC2VP30-5FF1152C

Overview

XC2VP30-5FF1152C from Xilinx is a Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (up to 3.125 Gb/s), 30,816 logic cells, and 644 user I/Os in an FF1152 flip-chip BGA package. It delivers embedded processing, high-speed serial connectivity, and programmable logic for telecom backplane interfaces, network line cards, and video processing systems.

For engineers reviewing the XC2VP30-5FF1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-5 = 3.125 Gb/s), DCM-based clock management, SelectIO-Ultra I/O flexibility, and FF1152 package thermal/power delivery characteristics.

Technical Context

The XC2VP30-5FF1152C implements a hardened architecture combining SRAM-based FPGA fabric with two embedded PowerPC 405 cores and eight RocketIO transceivers. Its clocking subsystem uses up to twelve Digital Clock Managers (DCMs) for phase-shifting, multiplication, and deskew across 16 global clock nets.

I/O functionality is delivered via SelectIO-Ultra blocks supporting 22 single-ended and 10 differential standards-including LVDS, SSTL, HSTL-with Digitally Controlled Impedance (DCI) and on-chip differential termination. The device uses a 0.13 µm nine-layer copper process with 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and programmable I/O supply (VCCO).

Key Specifications

Pinout & Package

XC2VP30-5FF1152C is housed in a 35 mm × 35 mm FF1152 flip-chip fine-pitch BGA package with 1.00 mm ball pitch, optimized for thermal dissipation and signal integrity in high-density PCB layouts. This package supports all 644 user I/Os plus dedicated configuration, clock, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-5FF1152C and XC2VP20-5FF1152C, the XC2VP30-5FF1152C offers balanced logic, transceiver, and processor resources-making it optimal for mid-tier embedded systems needing dual PowerPC execution without over-provisioning silicon area or power consumption.

Availability

XC2VP30-5FF1152C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial protocol gateways, and defense radar subsystems requiring stable component supply across extended product lifecycles.

Supply support for XC2VP30-5FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, SoCs, and adaptive computing solutions since 1984.

The Virtex-II Pro family was designed to integrate embedded processors and high-speed serial I/O into a single programmable platform, targeting high-performance communications and signal processing applications.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-5FF1152C?

The XC2VP30-5FF1152C supports PowerPC 405 cores running at up to 300 MHz under the -5 speed grade, as confirmed in Table 4 of DS083 (v5.0). This rating assumes proper thermal management and adherence to VCCINT = 1.5 V and VCCAUX = 2.5 V supply conditions. The XC2VP30-5FF1152C datasheet specifies this performance for commercial temperature range operation.

Does XC2VP30-5FF1152C support partial reconfiguration?

Yes, XC2VP30-5FF1152C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This capability allows dynamic modification of specific FPGA regions without disrupting active logic elsewhere, enabling runtime adaptation in communication protocols or signal processing pipelines. The feature is documented in Module 1 of DS083 under "SRAM-Based In-System Configuration".

What I/O standards are supported by XC2VP30-5FF1152C's SelectIO-Ultra blocks?

XC2VP30-5FF1152C supports 22 single-ended standards (including LVTTL, LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, GTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, HSTL, SSTL). Each IOB includes programmable drive strength (2–24 mA), slew rate control, and Digitally Controlled Impedance (DCI) for on-chip termination-details appear in Module 1, Section "SelectIO-Ultra Technology".

Is XC2VP30-5FF1152C pin-compatible with other Virtex-II Pro devices in FF1152 packaging?

No, XC2VP30-5FF1152C is not fully pin-compatible with other Virtex-II Pro devices in FF1152 packages. While the FF1152 mechanical footprint is consistent, I/O assignment, power pin distribution, and transceiver pinout vary between devices (e.g., XC2VP40-5FF1152C allocates more balls to I/O, XC2VP20-5FF1152C has different VCCO bank groupings). Pin compatibility must be verified per device using Xilinx's official pinout tables in Module 4 of DS083.

What is the role of the Digital Clock Manager (DCM) in XC2VP30-5FF1152C?

The Digital Clock Manager (DCM) in XC2VP30-5FF1152C provides fully digital clock synthesis, deskew, multiplication, division, and fine-grained phase shifting (1/256 period resolution). Each of the eight DCMs operates independently to manage clock domains for PowerPC cores, RocketIO transceivers, and user logic-eliminating external clock ICs and improving timing predictability in high-speed designs.