AMD XC2VP30-5FF1152I

Overview

XC2VP30-5FF1152I from Xilinx is a Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, 136 18×18 multipliers, and 2,448 Kb of Block SelectRAM+ memory in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth embedded systems requiring integrated processing, serial connectivity, and programmable logic - such as telecom line cards and video processing subsystems.

For engineers reviewing the XC2VP30-5FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-5 = 3.125 Gb/s), I/O count (644 user I/Os), DCM count (8), and FF1152 package compatibility with industrial temperature range (–40°C to +100°C).

Technical Context

The XC2VP30-5FF1152I implements a hardened architecture combining SRAM-based FPGA fabric with embedded PowerPC 405 cores and RocketIO transceivers. Its dual PowerPC blocks operate at up to 300 MHz (speed grade -5), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. The eight RocketIO transceivers support full-duplex operation at 3.125 Gb/s with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

Digital Clock Manager (DCM) resources include eight fully digital clock management units supporting precise deskew, frequency synthesis (integer/fractional), and phase shifting (90°/180°/270° plus fine-grained 1/256-period steps). The device uses a 0.13 µm nine-layer copper process with 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and configurable I/O supply (VCCO) domains.

Key Specifications

Pinout & Package

XC2VP30-5FF1152I is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.0 mm pitch, 35 mm × 35 mm body size, and industrial temperature rating (–40°C to +100°C). The package supports 644 user I/Os plus dedicated configuration, JTAG, power, and transceiver pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP30-5FF1152I, XC2VP40-5FF1152I offers scalable logic and memory headroom within identical I/O and transceiver constraints, while XC2VP70-5FF1152I trades increased transceiver count and fabric size for higher power and thermal requirements - both retain pin-compatible placement but require revised timing closure and power delivery design.

Availability

XC2VP30-5FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and defense electronics requiring stable component supply across long product lifecycles and extended temperature operation.

Supply support for XC2VP30-5FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute solutions targeting high-performance embedded and datacenter applications.

The Virtex-II Pro family was engineered to unify hard processor subsystems with high-speed serial I/O and flexible logic fabric - enabling complete system-on-chip implementations in aerospace, wired communications, and real-time signal processing.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-5FF1152I?

The XC2VP30-5FF1152I speed grade -5 supports PowerPC 405 cores up to 300 MHz under industrial temperature conditions (–40°C to +100°C). This rating assumes proper PCB layout, power delivery, and thermal management per Xilinx DS083 specifications. Higher frequencies require speed grade -6 or -7 devices, which are not offered in industrial grade for dual-core configurations.

Does XC2VP30-5FF1152I support partial reconfiguration?

Yes, XC2VP30-5FF1152I supports partial reconfiguration through its SRAM-based configuration architecture and SelectMAP interface. Users can dynamically reload specific CLB or Block RAM regions without resetting the entire device or halting PowerPC execution - enabling runtime adaptation of communication protocols or DSP filters in deployed systems.

What I/O standards are supported by XC2VP30-5FF1152I with on-chip termination?

XC2VP30-5FF1152I supports on-chip Digitally Controlled Impedance (DCI) termination for LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL (1.8V/2.5V), and HSTL (1.5V/1.8V) single-ended standards. For differential I/O, it provides on-chip 50 Ω termination for LVDS, BLVDS, ULVDS, and LDT standards - eliminating external resistors and improving signal integrity.

Can XC2VP30-5FF1152I be configured via JTAG boundary-scan?

Yes, XC2VP30-5FF1152I supports IEEE 1149.1-compliant boundary-scan configuration through its TCK/TMS/TDI/TDO pins. This enables in-system programming, readback of configuration memory and register states, and debugging via ChipScope ILA - all without requiring dedicated configuration PROMs or microcontrollers.

Is XC2VP30-5FF1152I recommended for new designs?

No, XC2VP30-5FF1152I is marked "Product Not Recommended For New Designs" per Xilinx DS083 (v5.0, June 2011). While fully functional and supported for legacy program continuity, new designs should consider modern alternatives such as Xilinx Kintex-7 or AMD Versal ACAP families for improved performance, power efficiency, and long-term supply assurance.