AMD XC2VP30-5FF896C

Overview

XC2VP30-5FF896C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, twelve Digital Clock Managers (DCMs), and 644 user I/Os in an FF896 flip-chip BGA package. It delivers high-bandwidth serial interconnect, embedded processing, and reconfigurable logic for telecom backplane interfaces and protocol-aware networking systems.

For engineers reviewing the XC2VP30-5FF896C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual-processor support, RocketIO transceiver count and speed grade (-5 = 3.125 Gb/s), DCM count, SelectRAM+ memory capacity (2,448 Kb), and FF896 package compatibility with high-density PCB layouts.

Technical Context

The XC2VP30-5FF896C implements a hardened architecture combining SRAM-based FPGA fabric with two embedded PowerPC 405 cores (300 MHz at -5 speed grade), eight RocketIO transceivers supporting 600 Mb/s to 3.125 Gb/s, and twelve DCMs for clock synthesis, de-skew, and phase shifting. Its IOBs support LVDS, SSTL, HSTL, and PCI-X with Digitally Controlled Impedance (DCI) termination.

It uses a 0.13 µm nine-layer copper process with 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Configuration is via Slave/Master SelectMAP or JTAG (IEEE 1532), with optional triple-DES bitstream encryption and readback capability for debug.

Key Specifications

Pinout & Package

XC2VP30-5FF896C is housed in an FF896 flip-chip fine-pitch BGA package with 896 balls arranged in a 31×31 mm array and 1.0 mm pitch. The package supports high-speed routing, low-inductance power delivery, and thermal management for sustained operation in telecom infrastructure equipment.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA with embedded processor applications.

Compared with XC2VP30-5FF896C, XC2VP40-5FF896C offers direct pin-compatible scalability in logic and transceiver count within the same FF896 footprint, while XC2VP50-5FF1152C trades package compatibility for significantly higher I/O and transceiver capacity-making XC2VP30-5FF896C the optimal balance of integration, density, and layout efficiency for mid-range telecom and networking platforms.

Availability

XC2VP30-5FF896C is available at Aetrix Electronics and suitable for telecom infrastructure, network security appliances, broadcast video equipment, and industrial automation systems requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP30-5FF896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute acceleration platforms.

The Virtex-II Pro family was designed for high-performance, system-level integration-combining FPGA fabric, embedded processors, and high-speed serial I/O to replace ASICs in telecom, aerospace, and test equipment.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP30-5FF896C?

The XC2VP30-5FF896C supports RocketIO transceivers operating at up to 3.125 Gb/s in full-duplex mode. This speed is guaranteed for the -5 speed grade under commercial temperature conditions and aligns with standards including XAUI, Gigabit Ethernet, and Fibre Channel. The device does not support RocketIO X transceivers (6.25 Gb/s), which are exclusive to XC2VPX-series parts.

Does XC2VP30-5FF896C include embedded processor cores?

Yes, XC2VP30-5FF896C integrates two IBM PowerPC 405 RISC processor blocks. Each core runs at up to 300 MHz in the -5 speed grade and includes 16 KB instruction cache, 16 KB data cache, MMU, and CoreConnect bus interface. These cores enable embedded software execution alongside FPGA logic, supporting real-time OS, protocol stacks, and control plane processing.

What package type and pin count does XC2VP30-5FF896C use?

XC2VP30-5FF896C uses the FF896 flip-chip fine-pitch BGA package with 896 balls arranged in a 31×31 mm array and 1.0 mm pitch. This package delivers superior thermal performance and signal integrity over wire-bond alternatives and supports 644 user I/Os plus dedicated configuration, clock, and power pins.

Can XC2VP30-5FF896C be configured via JTAG?

Yes, XC2VP30-5FF896C supports IEEE 1149.1-compliant JTAG boundary-scan configuration through TCK, TMS, TDI, and TDO pins. It also supports IEEE 1532 standard programming and allows partial reconfiguration, readback of configuration memory and flip-flop states, and integration with ChipScope ILA for in-system debug-all accessible via the JTAG interface.

Is XC2VP30-5FF896C recommended for new designs?

No, XC2VP30-5FF896C is marked "Product Not Recommended For New Designs" per Xilinx DS083 (v5.0). It remains available for legacy support, repair, and obsolescence mitigation, but Xilinx recommends Virtex-5 or newer families for new development due to enhanced performance, lower power, and extended toolchain support.