AMD XC2VP30-5FF896I

Overview

XC2VP30-5FF896I from Xilinx is a Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.0 Gb/s max), 30,816 logic cells, 136 18×18 multipliers, and 2,448 Kb of Block SelectRAM+ memory in an FF896 flip-chip BGA package. It targets high-bandwidth telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP30-5FF896I datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-5 = 2.0 Gb/s), I/O count (644 user I/Os), DCM count (8), and FF896 package thermal/mechanical constraints.

Technical Context

The XC2VP30-5FF896I implements a hybrid architecture combining SRAM-based configurable logic fabric with hard IP: dual PowerPC 405 cores (32-bit Harvard, MMU, 16 KB I/D caches), eight RocketIO transceivers (full-duplex SERDES, 8B/10B encode/decode, channel bonding), and twelve Digital Clock Managers (DCMs) for phase-shifting and frequency synthesis.

Its routing uses Active Interconnect Technology with hierarchical segmented resources - 24 long lines per row/column, 120 hex lines, and dedicated global clock networks - enabling predictable timing closure at system frequencies up to 300 MHz for processor operation and 2.0 Gb/s for transceiver links under -5 speed grade conditions.

Key Specifications

Pinout & Package

XC2VP30-5FF896I uses the FF896 flip-chip fine-pitch BGA package (31 mm × 31 mm, 1.0 mm pitch, 896 balls). This thermally enhanced construction supports higher I/O density and improved power delivery versus wire-bond alternatives.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP30-5FF896I, XC2VP40-5FF896I offers greater scalability for multi-protocol systems, while XC2VP30-6FF896I enables higher-speed serial interconnects - both maintain pin compatibility and thermal envelope but differ in performance ceiling and cost.

Availability

XC2VP30-5FF896I is available at Aetrix Electronics and suitable for telecom line cards, wireless baseband units, industrial video transport systems, and defense radar modules requiring stable component supply across extended product lifecycles.

Supply support for XC2VP30-5FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded hard IP and system-level integration.

The Virtex-II Pro family was designed for high-performance embedded systems requiring integrated processing, high-speed serial I/O, and flexible logic - targeting telecom infrastructure, aerospace, and high-end instrumentation markets.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP30-5FF896I?

The XC2VP30-5FF896I supports RocketIO transceivers at up to 2.0 Gb/s per channel, as defined by its -5 speed grade rating for flip-chip packages. This applies to all eight transceivers and is validated under industrial temperature conditions. The XC2VP30-5FF896I does not support RocketIO X cores or higher baud rates like 3.125 Gb/s, which require -6 or -7 speed grades.

Does XC2VP30-5FF896I include embedded processor cores?

Yes, XC2VP30-5FF896I integrates two hardened IBM PowerPC 405 RISC processor cores, each running at up to 300 MHz in the -5 speed grade. These cores include 16 KB instruction and data caches, MMU with 64-entry TLB, and CoreConnect bus interface - enabling full embedded Linux or real-time OS deployment without external microprocessors.

What package type and pin count does XC2VP30-5FF896I use?

XC2VP30-5FF896I uses the FF896 flip-chip fine-pitch BGA package with 896 balls and a 1.0 mm pitch. It provides 644 user I/O pads, excluding configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG signals, and power/ground balls. Thermal and electrical performance exceeds wire-bond alternatives due to shorter interconnects and superior heat dissipation.

How many Digital Clock Managers (DCMs) are available in XC2VP30-5FF896I?

XC2VP30-5FF896I contains eight Digital Clock Managers (DCMs), each capable of zero-delay buffering, frequency synthesis (integer or fractional), and fine-grained phase shifting (1/256 of period resolution). These DCMs drive global clock networks and support independent timing domains for processor, transceiver, and logic fabric subsystems.

Is XC2VP30-5FF896I recommended for new designs?

No, XC2VP30-5FF896I is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). It remains available for legacy support, obsolescence mitigation, and maintenance of deployed systems, but Xilinx recommends Virtex-5 or newer families for new development due to process, power, and feature advantages.