AMD XC2VP30-5FFG1152C

Overview

XC2VP30-5FFG1152C from Xilinx is a Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (up to 3.125 Gb/s), 30,816 logic cells, and 644 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth embedded systems requiring on-chip processing, serial interconnect, and reconfigurable logic - such as telecom line cards and network packet processors.

For engineers reviewing the XC2VP30-5FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-5 = 3.125 Gb/s max), DCM-based clock management, SelectIO-Ultra I/O flexibility, and FF1152 package thermal/mechanical constraints.

Technical Context

The XC2VP30-5FFG1152C implements a hardened architecture combining SRAM-based FPGA fabric with embedded processor subsystems and SERDES transceivers. Its two PowerPC 405 cores operate at up to 300 MHz (speed grade -5), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. The eight RocketIO transceivers support full-duplex operation from 600 Mb/s to 3.125 Gb/s with 8B/10B encoding, channel bonding, and programmable pre-emphasis.

Logic resources include 13,696 CLB slices, 428 dedicated 18×18 multipliers, 2,448 Kb distributed RAM, and eight 18-Kb Block SelectRAM+ modules (totaling 644 Kb). Clocking uses up to twelve Digital Clock Managers (DCMs) for deskew, multiplication, division, and phase shifting - all feeding 16 global clock buffers routed across four quadrants.

Key Specifications

Pinout & Package

XC2VP30-5FFG1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FFG1152) package with 1.0 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction. Pin definitions follow Xilinx DS083 Module 4, where balls are organized into I/O banks, power/ground rings, configuration pins (M0–M2, CCLK, DONE, PROG_B), JTAG boundary-scan (TCK/TMS/TDI/TDO), and dedicated RocketIO differential pairs (RXN/RXP, TXN/TXP).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP30-5FFG1152C, XC2VP40-5FFG1152C offers higher transceiver count and logic capacity for future-proofing, while XC2VP20-5FFG1152C trades one PowerPC core and logic density for lower BOM cost - both retain identical FF1152 mechanical fit and -5 speed grade timing.

Availability

XC2VP30-5FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, network security appliances, and broadcast video equipment requiring stable component supply across extended product lifecycles.

Supply support for XC2VP30-5FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding system-level applications.

The Virtex-II Pro family, including XC2VP30-5FFG1152C, was designed to integrate hard processor cores and multi-gigabit transceivers into reconfigurable logic - enabling complete system-on-chip solutions for communications and embedded computing.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-5FFG1152C?

The XC2VP30-5FFG1152C speed grade -5 supports PowerPC 405 cores running at up to 300 MHz under commercial temperature conditions. This rating assumes proper decoupling, thermal management, and adherence to voltage specifications (1.5 V VCCINT, 2.5 V VCCAUX). Performance validation requires timing closure in Xilinx ISE using the -5 speed file; actual sustained frequency depends on cache hit rate and bus contention.

Does XC2VP30-5FFG1152C support JTAG boundary-scan testing after configuration?

Yes, XC2VP30-5FFG1152C maintains full IEEE 1149.1 boundary-scan capability regardless of configuration state. The TAP controller operates independently of the FPGA fabric, allowing in-system test, programming, and debug access even when the device is fully configured and running user logic. All 1152 balls - including I/O, power, and dedicated JTAG pins - are accessible through the boundary-scan chain per DS083 Module 1.

Can XC2VP30-5FFG1152C implement PCI-X 133 MHz interfaces?

Yes, XC2VP30-5FFG1152C supports PCI-X 133 MHz through its SelectIO-Ultra I/O banks, which include native PCI-X compliant signaling (3.3 V, 133 MHz) with programmable drive strength and on-chip termination. Implementation requires correct bank voltage assignment (VCCO = 3.3 V), proper timing constraints in ISE, and adherence to PCI-X slot loading rules - verified in XAPP653 application note.

What clocking resources does XC2VP30-5FFG1152C provide for synchronizing RocketIO transceivers?

XC2VP30-5FFG1152C uses dedicated PLL-based clock synthesis within each RocketIO transceiver block, independent of the main FPGA DCMs. Each transceiver includes a monolithic CDR circuit that locks to incoming serial data, eliminating need for external reference clocks. For parallel interface clocking, up to eight DCMs can generate phase-aligned clocks for the 8-/16-/32-bit bus widths connecting to RocketIO cores.

Is XC2VP30-5FFG1152C compatible with modern Xilinx development tools?

XC2VP30-5FFG1152C is supported exclusively by legacy Xilinx ISE Design Suite (v14.7 and earlier); it is not compatible with Vivado. Toolchain support includes synthesis, place-and-route, timing analysis, and ChipScope ILA debugging. Bitstream generation requires the Virtex-II Pro device libraries and speed files shipped with ISE - no migration path exists to current AMD/Xilinx toolflows.