AMD XC2VP30-5FFG1152I

Overview

XC2VP30-5FFG1152I from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, and 644 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth telecom and networking systems requiring embedded processing, serial interconnect, and reconfigurable logic.

For engineers reviewing the XC2VP30-5FFG1152I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, transceiver timing limits, DCM clock management specs, I/O standard support (LVDS, SSTL, HSTL), and industrial-grade (-40°C to +100°C) operation under -5 speed grade.

Technical Context

The XC2VP30-5FFG1152I implements a hardened dual-PowerPC 405 subsystem with 16 KB instruction and data caches, MMU, and OCM interface, operating up to 300 MHz at -5 speed grade. Its eight RocketIO transceivers support full-duplex 600 Mb/s–3.125 Gb/s SERDES with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

Logic fabric includes 13,696 CLB slices, 428 dedicated 18×18 multipliers, 2,448 Kb block SelectRAM+ (18 Kb × 136), twelve Digital Clock Managers (DCMs) for phase shifting and frequency synthesis, and SelectIO-Ultra I/O supporting 22 single-ended and 10 differential standards-including LVDS at 840 Mb/s and PCI-X compliance.

Key Specifications

Pinout & Package

XC2VP30-5FFG1152I uses the FF1152 flip-chip fine-pitch BGA package (35 mm × 35 mm, 1.0 mm pitch), optimized for thermal dissipation and signal integrity in high-speed designs. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCINT (1.5 V), VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V), and transceiver reference clocks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP30-5FFG1152I, XC2VP40-5FF896I offers higher transceiver count and I/O in a smaller package but lacks the FF1152's thermal performance margin; XC2VP7-6FG676I trades logic capacity and package thermal capability for lower cost and footprint, limiting maximum PowerPC clock to 350 MHz only in commercial grade.

Availability

XC2VP30-5FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and industrial video systems requiring stable component supply, long-term lifecycle support, and industrial temperature operation.

Supply support for XC2VP30-5FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance FPGAs for demanding system-level integration.

The Virtex-II Pro product line was engineered to unify embedded processing, high-speed serial I/O, and flexible logic in a single device-targeting applications where ASIC development cost and time-to-market were prohibitive.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP30-5FFG1152I?

The XC2VP30-5FFG1152I is rated for 300 MHz PowerPC 405 operation under industrial temperature conditions (-40°C to +100°C) at -5 speed grade. This is confirmed in DS083 Table 4, which specifies 300 MHz as the maximum processor block frequency for -5 grade dual-processor devices in industrial grade. Higher frequencies require derating or commercial-grade variants.

Does XC2VP30-5FFG1152I support LVDS I/O at full data rate, and what is the maximum toggle rate?

Yes, XC2VP30-5FFG1152I supports LVDS I/O with 840 Mb/s toggle rate per pin, as stated in DS083 Module 1, Section "SelectIO-Ultra Technology". This enables use in high-speed video interfaces like HD-SDI and camera links, with on-chip differential termination eliminating external resistors and reducing PCB complexity.

Can XC2VP30-5FFG1152I be configured via JTAG, and what IEEE standards does it comply with?

Yes, XC2VP30-5FFG1152I supports IEEE 1149.1 boundary-scan and IEEE 1532 configuration through its JTAG TAP controller. The device implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions, enabling in-system programming, debugging, and manufacturing test without requiring additional configuration PROMs.

What is the purpose of the DCM modules in XC2VP30-5FFG1152I, and how many are available?

XC2VP30-5FFG1152I integrates twelve Digital Clock Manager (DCM) modules to provide fully digital clock deskew, frequency synthesis (multiplication/division), and coarse/fine phase shifting. Each DCM supports up to four output clocks, enabling precise synchronization across multiple clock domains-critical for interfacing with ADCs, DACs, and external memory controllers.

Is XC2VP30-5FFG1152I recommended for new designs, and what is its lifecycle status?

No-XC2VP30-5FFG1152I is marked "Product Not Recommended For New Designs" per DS083 v5.0 (June 2011). It remains available for legacy support and obsolescence management, but Xilinx recommends Virtex-5 or newer families for new projects due to improved performance, power efficiency, and toolchain support.