AMD XC2VP30-5FFG896C

Overview

XC2VP30-5FFG896C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, twelve Digital Clock Managers (DCMs), and 644 user I/Os in an 896-pin flip-chip fine-pitch BGA package. It targets high-bandwidth embedded systems requiring on-chip processing, serial interconnect, and reconfigurable logic - such as telecom line cards and network packet processors.

For engineers reviewing the XC2VP30-5FFG896C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-5 = 3.125 Gb/s), DCM count for clock domain management, I/O voltage flexibility (1.5V/1.8V/2.5V/3.3V), and FF896 package thermal/power delivery characteristics.

Technical Context

The XC2VP30-5FFG896C implements a hardened dual-core PowerPC 405 subsystem with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - enabling real-time embedded software execution alongside programmable logic. Its eight RocketIO transceivers operate at up to 3.125 Gb/s full-duplex with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

FPGA fabric includes 136 CLBs with 18 × 18-bit multipliers, 136 Block SelectRAM+ modules (18 Kb each), distributed RAM, SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X, plus twelve DCMs for jitter-tolerant clock synthesis, phase shifting, and deskew across multiple domains.

Key Specifications

Pinout & Package

XC2VP30-5FFG896C uses the FF896 flip-chip fine-pitch BGA package (31 mm × 31 mm, 1.0 mm pitch), optimized for high I/O count and thermal dissipation. Pin definitions are documented in DS083 Module 4 (Pinout Information), with dedicated banks for VCCO (I/O supply), VCCAUX (auxiliary), VCCINT (core), configuration (M0–M2, CCLK, DONE), JTAG (TCK/TMS/TDI/TDO), and transceiver-specific pins (RXN/RXP, TXN/TXP).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP30-5FFG896C, XC2VP40-5FF896C offers greater scalability for future feature expansion but increases power and cooling demands, while XC2VP7-6FG676C reduces footprint and cost at the expense of logic capacity and thermal performance headroom.

Availability

XC2VP30-5FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and medical imaging systems requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP30-5FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration platforms since 1984.

The Virtex-II Pro family was designed for high-performance embedded systems integrating processor cores, high-speed serial I/O, and reconfigurable logic - targeting applications where ASIC development cost and time-to-market are prohibitive.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP30-5FFG896C?

The XC2VP30-5FFG896C supports RocketIO transceivers rated at 3.125 Gb/s full-duplex (speed grade -5). This is confirmed in DS083 Table 4, which specifies 3.125 Gb/s for -5 grade flip-chip devices. The XC2VP30-5FFG896C does not include RocketIO X transceivers, which are exclusive to XC2VPX-series parts.

Does XC2VP30-5FFG896C include PowerPC processor cores?

Yes, XC2VP30-5FFG896C integrates two IBM PowerPC 405 RISC processor blocks, each with 16 KB instruction cache, 16 KB data cache, MMU, and OCM interface. This is explicitly listed in Table 1 of DS083 and confirmed in the General Description section.

What package type and pin count does XC2VP30-5FFG896C use?

XC2VP30-5FFG896C uses the FF896 flip-chip fine-pitch BGA package with 896 balls (31 mm × 31 mm, 1.0 mm pitch). This is indicated by the "FFG896" suffix and verified in Table 3 of DS083, which lists XC2VP30 with 644 user I/Os in the FF896 package.

Can XC2VP30-5FFG896C be configured via JTAG?

Yes, XC2VP30-5FFG896C supports IEEE 1149.1-compliant boundary-scan configuration via JTAG using TCK, TMS, TDI, and TDO pins. DS083 Module 1 confirms JTAG support in the Boundary Scan section and lists BYPASS, EXTEST, and INTEST instructions as implemented.

Is XC2VP30-5FFG896C recommended for new designs?

No - XC2VP30-5FFG896C is marked "Product Not Recommended For New Designs" in DS083 (v5.0, June 2011). This status reflects its end-of-life position within Xilinx's product lifecycle; however, it remains available for legacy system maintenance and long-term industrial deployments.