AMD XC2VP30-5FG676C

Overview

XC2VP30-5FG676C from Xilinx is a Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond FG676 package), 30,816 logic cells, and 644 user I/Os in a 676-pin fine-pitch BGA. It targets high-bandwidth telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP30-5FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual PowerPC 405 support, RocketIO transceiver count and speed grade (-5 = 2.5 Gb/s for FG packages), 1.5V core voltage, and FG676 wire-bond BGA mechanical compatibility.

Technical Context

This device implements a hybrid architecture combining hard IP (dual PowerPC 405 cores with 16 KB instruction/data caches and MMU) with programmable fabric (CLBs, Block SelectRAM+, 18×18 multipliers). The RocketIO transceivers operate at up to 2.5 Gb/s in the FG676 package and use monolithic CDR with 8B/10B encoding.

DCM modules provide digital clock management including frequency synthesis, phase shifting (1/256 period resolution), and deskew; SelectIO-Ultra I/O supports 22 single-ended and 10 differential standards with digitally controlled impedance (DCI) and on-chip termination for LVDS, SSTL, and HSTL.

Key Specifications

Pinout & Package

XC2VP30-5FG676C uses a 676-ball fine-pitch wire-bond BGA (FG676) with 1.0 mm pitch, 26 mm × 26 mm body size, and Pb-free option (FGG676). Pin definitions are documented across 302 pages in DS083 Module 4, covering dedicated configuration, JTAG, PowerPC debug, RocketIO differential pairs, and bank-specific I/O voltage domains.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-5FF672C and XC2VP7-6FG456C, XC2VP30-5FG676C uniquely balances transceiver count, dual-processor capability, and I/O density in a wire-bond BGA-making it optimal for mid-tier telecom infrastructure where PCB layout simplicity and signal integrity outweigh raw logic capacity.

Availability

XC2VP30-5FG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video transport, wireless baseband processing, and Gigabit Ethernet line card designs requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP30-5FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and platform devices with embedded processors and high-speed transceivers.

The Virtex-II Pro family was designed specifically for systems demanding tightly coupled hardware/software co-design-targeting telecom, networking, and video infrastructure where integration of processing, serial I/O, and programmable logic reduces system complexity.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP30-5FG676C?

The XC2VP30-5FG676C supports RocketIO transceivers operating at up to 2.5 Gb/s in the FG676 wire-bond package, as specified in Table 4 of DS083 (v5.0). This speed applies to all eight transceiver channels and is validated for Fibre Channel, Gigabit Ethernet, and XAUI protocols. The -5 speed grade denotes this 2.5 Gb/s performance ceiling for FG-series packages; RocketIO X variants (e.g., XC2VPX20) are not applicable to XC2VP30-5FG676C.

Does XC2VP30-5FG676C include embedded processor cores?

Yes, XC2VP30-5FG676C integrates two IBM PowerPC 405 RISC processor blocks, each running at up to 300 MHz in the -5 speed grade. These cores include 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and dedicated OCM controllers for low-latency access to Block SelectRAM+. The dual-core configuration enables real-time control plane processing alongside FPGA fabric-based data plane acceleration.

What package type and pin count does XC2VP30-5FG676C use?

XC2VP30-5FG676C uses the FG676 wire-bond fine-pitch BGA package with 676 balls arranged in a 26 mm × 26 mm body and 1.0 mm pitch. This package supports 644 user I/O pins plus dedicated configuration, JTAG, PowerPC debug, and RocketIO reference signals. Pb-free variants are designated FGG676 and share identical mechanical and electrical characteristics.

Can XC2VP30-5FG676C perform partial reconfiguration?

Yes, XC2VP30-5FG676C supports partial reconfiguration as documented in DS083 Module 1. This capability allows dynamic replacement of specific logic modules while the rest of the design remains operational-enabling protocol adaptation in telecom systems or runtime feature activation in industrial controllers. Configuration is performed via SelectMAP or JTAG interfaces using Xilinx BitGen tools with region-based bitstream generation.

What I/O standards are supported by XC2VP30-5FG676C?

XC2VP30-5FG676C supports 22 single-ended I/O standards-including LVTTL, LVCMOS (1.5V/1.8V/2.5V/3.3V), PCI/PCI-X, GTL, HSTL, and SSTL-and 10 differential standards such as LVDS, BLVDS, ULVDS, LVPECL, and LDT. Each I/O bank has independent VCCO and supports Digitally Controlled Impedance (DCI) for automatic on-chip termination calibration against external 50 Ω references.