AMD XC2VP30-5FG676I

Overview

XC2VP30-5FG676I from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond FG676 package), 30,816 logic cells, twelve Digital Clock Managers (DCMs), and 644 user I/Os in a 676-pin Fine-Pitch BGA (FG676) package. It targets high-bandwidth telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP30-5FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include verified dual-processor support at 300 MHz (Industrial grade), RocketIO transceiver count and speed grade compatibility (-5), DCI-enabled I/O termination, and FG676 package routing constraints for high-speed SERDES layout.

Technical Context

The XC2VP30-5FG676I implements a hardened architecture combining SRAM-based FPGA fabric with two embedded PowerPC 405 cores and eight RocketIO transceivers. Its DCMs provide phase-shifted, multiplied, and deskewed clocks with fine-grained (1/256 period) adjustment, while SelectIO-Ultra I/O supports LVDS, SSTL, HSTL, and PCI-X standards with programmable drive strength and Digitally Controlled Impedance (DCI).

RocketIO transceivers operate at up to 2.5 Gb/s in the FG676 wire-bond package per channel, with monolithic clock recovery, 8B/10B encoding, channel bonding (2–20 channels), and internal loopback modes. The PowerPC 405 blocks deliver 300 MHz operation in Industrial grade (-5I), featuring 16 KB instruction and data caches, MMU with 64-entry TLB, and OCM interface for low-latency memory access.

Key Specifications

Pinout & Package

XC2VP30-5FG676I uses the FG676 wire-bond Fine-Pitch BGA package (26 mm × 26 mm, 1.0 mm pitch), supporting 644 user I/Os plus dedicated configuration, power, and transceiver pins. Pin definitions are fully documented in DS083 Module 4 (Pinout Information), with distinct banks for SelectIO-Ultra I/O, RocketIO differential pairs, PowerPC JTAG/debug, and global clock resources.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP30-5FG676I, XC2VP40-5FF672I trades transceiver availability for higher logic density in a larger flip-chip package, whereas XC2VP50-5FF896I extends both transceiver count and I/O resources within the same speed grade-making it a direct scalability path for bandwidth-intensive designs.

Availability

XC2VP30-5FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, avionics data concentrators, and medical imaging controllers requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC2VP30-5FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded hard IP and system-level integration.

The Virtex-II Pro family, including XC2VP30-5FG676I, was designed for high-performance embedded systems requiring tightly coupled processing, high-speed serial I/O, and reconfigurable logic in a single device-targeting telecom, aerospace, and medical applications.

FAQ

What is the maximum RocketIO transceiver speed supported by XC2VP30-5FG676I?

The XC2VP30-5FG676I supports RocketIO transceivers operating at up to 2.5 Gb/s in the FG676 wire-bond package, as confirmed in DS083 Table 4 for -5 speed grade devices. This speed applies to all eight transceivers and is validated under Industrial temperature conditions (-40°C to +100°C). Higher speeds (e.g., 3.125 Gb/s) require -6 or -7 speed grades not offered in Industrial grade for this package.

Does XC2VP30-5FG676I include on-chip termination for I/O standards?

Yes, XC2VP30-5FG676I includes Digitally Controlled Impedance (DCI) circuitry that provides programmable on-chip series and parallel termination for single-ended I/O standards such as LVCMOS, SSTL, and HSTL. DCI eliminates the need for external resistors by calibrating against VRP/VRN reference pins, supporting impedance values like 50 Ω, 60 Ω, and 75 Ω per I/O bank.

Can both PowerPC 405 cores in XC2VP30-5FG676I operate simultaneously at 300 MHz?

Yes, XC2VP30-5FG676I is rated for dual PowerPC 405 core operation at 300 MHz in Industrial grade (-5I), as specified in DS083 Table 4. This performance is guaranteed across the full temperature range without requiring special clock macro implementations, unlike higher-speed grades (-6/-7) which mandate XAPP755 for dual-core timing closure above 300 MHz.

What configuration modes does XC2VP30-5FG676I support?

XC2VP30-5FG676I supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. These modes allow flexible integration with microcontrollers, flash memory, JTAG programmers, or system-level test infrastructure. Configuration bitstreams can be encrypted using on-chip DES decryptor for IP protection.

Is XC2VP30-5FG676I recommended for new designs?

No, XC2VP30-5FG676I is marked "Product Not Recommended For New Designs" in DS083 (v5.0, June 2011). While fully functional and supported for existing programs, Xilinx advises migration to newer families (e.g., Kintex-7, Virtex-7) for new projects due to obsolescence planning, enhanced features, and long-term supply assurance.