AMD XC2VP30-5FGG676C

Overview

XC2VP30-5FGG676C from Xilinx is a Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond packages), 30,816 logic cells, 136 18×18 multipliers, and 644 user I/Os in a 676-pin Fine-Pitch BGA (FGG676) package. It targets high-bandwidth telecom backplane interfaces, embedded video processing systems, and reconfigurable DSP subsystems requiring on-chip processing and serial connectivity.

For engineers reviewing the XC2VP30-5FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual PowerPC 405 core support, RocketIO transceiver count and speed grade (-5 = 2.5 Gb/s for FG/FGG packages), DCM count (12), Block RAM capacity (8 Mb), and compatibility with SelectIO-Ultra I/O standards including LVDS, SSTL, and DCI termination.

Technical Context

The XC2VP30-5FGG676C implements a hardened architecture combining FPGA fabric with embedded processor subsystems and SERDES. Its two PowerPC 405 cores operate at up to 300 MHz (speed grade -5), each with 16 KB instruction and data caches, MMU, and OCM interface. The eight RocketIO transceivers are full-duplex SERDES supporting 600 Mb/s to 2.5 Gb/s per channel in this wire-bond package variant.

Digital Clock Manager (DCM) modules provide phase-shifting, frequency synthesis, and deskew; 12 DCMs are available. The FPGA fabric includes Configurable Logic Blocks (CLBs), 18 Kb Block SelectRAM+ memory (8 Mb total), and dedicated 18×18 multipliers - all interconnected via Active Interconnect routing with predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2VP30-5FGG676C uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.0 mm pitch, wire-bond interconnect, and Pb-free construction. Pin definitions follow Xilinx DS083 Module 4, covering I/O banks, configuration pins (CCLK, DONE, M0–M2, PROG_B), JTAG TAP (TCK/TDI/TDO/TMS), power (VCCINT=1.5V, VCCAUX=2.5V, VCCO), and RocketIO differential pairs (RXN/RXP, TXN/TXP).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP30-5FGG676C, XC2VP40-5FF672C trades transceiver integration for higher logic density and thermal headroom in flip-chip packaging, while XC2VP7-6FG456C offers a scaled-down, single-core alternative with identical transceiver speed but reduced I/O and memory resources - making it suitable for entry-level reconfigurable controllers.

Availability

XC2VP30-5FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure upgrades, industrial protocol gateways, and embedded video processing systems requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP30-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA technology and advanced system-on-chip architectures for high-performance digital design.

The Virtex-II Pro family, including XC2VP30-5FGG676C, was engineered to integrate hard processor cores and high-speed serial transceivers into FPGA fabric - targeting applications demanding both programmable logic flexibility and deterministic embedded processing in networking, aerospace, and broadcast equipment.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-5FGG676C?

The XC2VP30-5FGG676C features two PowerPC 405 RISC processor blocks rated for 300 MHz operation under speed grade -5 conditions. This rating assumes proper PCB layout, decoupling, and thermal management per Xilinx DS083 specifications. The actual sustained frequency depends on cache hit rate, bus contention, and peripheral access patterns - but the silicon is characterized and guaranteed to function correctly at 300 MHz in commercial temperature range.

Does XC2VP30-5FGG676C support partial reconfiguration?

Yes, XC2VP30-5FGG676C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. Using Xilinx ISE tools and appropriate HDL constraints, users can dynamically reload specific regions of the FPGA fabric without resetting the entire device or halting PowerPC execution. This capability is documented in DS083 Module 3 and enabled via the SelectMAP interface or JTAG boundary-scan controller.

What I/O standards are supported by XC2VP30-5FGG676C's SelectIO-Ultra blocks?

XC2VP30-5FGG676C supports 22 single-ended I/O standards including LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL (1.8V/2.5V), HSTL (1.5V/1.8V), PCI/PCI-X, and GTL/GTLP. It also supports ten differential standards: LVDS, BLVDS, ULVDS, LVPECL, and LDT. All I/O banks feature programmable drive strength (2–24 mA), slew rate control, and Digitally Controlled Impedance (DCI) for automatic on-die termination matching.

Is XC2VP30-5FGG676C pin-compatible with other Virtex-II Pro devices in the FGG676 package?

No, XC2VP30-5FGG676C is not pin-compatible with other Virtex-II Pro devices in the FGG676 package. While all FGG676 variants share the same mechanical footprint and ball map, I/O bank assignments, voltage requirements, and RocketIO pin allocations differ across device densities. For example, XC2VP20-5FGG676C allocates different balls for VCCAUX and I/O standards than XC2VP30-5FGG676C. Migration requires PCB redesign and I/O constraint verification per DS083 Table 3.

What is the purpose of the VBATT pin on XC2VP30-5FGG676C?

VBATT on XC2VP30-5FGG676C supplies backup power to the internal configuration memory retention circuitry. When main power (VCCINT/VCCAUX) is removed, a 2.5 V battery connected to VBATT preserves the contents of the configuration memory for up to 24 hours - enabling fast wake-up without reloading the bitstream. This feature is optional and disabled by default; it requires external battery circuitry and is documented in DS083 Module 1 Section "Configuration".