AMD XC2VP30-5FGG676I

Overview

XC2VP30-5FGG676I from Xilinx is a Virtex-II Pro platform FPGA integrating two 300 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max in wire-bond packages), 30,816 logic cells, and 644 user I/Os in a 676-pin Fine-Pitch BGA (FGG676) package. It targets high-bandwidth telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP30-5FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include verified dual PowerPC 405 core operation at 300 MHz, RocketIO transceiver compliance with Fibre Channel and Gigabit Ethernet, DCI-enabled I/O termination, and DCM-based clock management for deterministic timing closure.

Technical Context

The XC2VP30-5FGG676I implements a heterogeneous architecture combining hard PowerPC 405 cores with programmable FPGA fabric. Its RocketIO transceivers support full-duplex operation from 600 Mb/s to 2.5 Gb/s (per channel, limited by -5 speed grade and FGG676 wire-bond package), with 8B/10B encoding, on-chip 50 Ω termination, and per-channel loopback modes.

Each PowerPC 405 block includes 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and dedicated OCM interface. The FPGA fabric delivers 136 18×18 multipliers, 136 Block SelectRAM+ modules (18 Kb each), twelve Digital Clock Managers (DCMs), and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X standards with digitally controlled impedance (DCI).

Key Specifications

Pinout & Package

XC2VP30-5FGG676I uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.0 mm pitch, wire-bond interconnect, and industrial temperature range (–40°C to +100°C). Pin definitions are documented across 302 pages in DS083 Module 4, covering ball assignments, I/O bank groupings, voltage supply domains (VCCINT, VCCAUX, VCCO), configuration pins (M0–M2, CCLK, DONE), JTAG boundary-scan signals (TCK/TMS/TDI/TDO), and dedicated RocketIO transceiver pairs (TXP/TXN, RXP/RXN).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP30-5FGG676I, XC2VP40-5FF672I offers greater logic capacity but no RocketIO in its FF672 configuration, while XC2VP7-6FG456C reduces cost and complexity at the expense of dual-core processing and transceiver count-making XC2VP30-5FGG676I optimal for balanced high-performance embedded systems requiring both compute and serial I/O.

Availability

XC2VP30-5FGG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, medical imaging subsystems, and defense radar signal processing requiring stable component supply across extended lifecycle programs.

Supply support for XC2VP30-5FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded hard IP.

The Virtex-II Pro family was designed to integrate high-performance FPGA fabric with hardened PowerPC processor cores and multi-gigabit transceivers for system-on-chip solutions in networking, wireless, and video applications.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP30-5FGG676I?

The XC2VP30-5FGG676I supports RocketIO transceivers up to 2.5 Gb/s per channel, as confirmed by DS083 Table 4 for -5 speed grade wire-bond packages (FG/FGG). This rate applies to standards including Gigabit Ethernet and Fibre Channel. The XC2VP30-5FGG676I does not support RocketIO X transceivers, which require Virtex-II Pro X devices like XC2VPX20 or XC2VPX70.

Does XC2VP30-5FGG676I include hard PowerPC processor cores?

Yes, XC2VP30-5FGG676I integrates two hard PowerPC 405 RISC processor blocks operating at up to 300 MHz in the -5 speed grade. Each core features 16 KB instruction and 16 KB data caches, MMU with 64-entry TLB, and dedicated OCM interface-enabling real-time embedded software execution without soft-core overhead.

What I/O standards are supported by XC2VP30-5FGG676I with on-chip termination?

XC2VP30-5FGG676I supports on-chip digitally controlled impedance (DCI) termination for LVTTL, LVCMOS (1.5 V–3.3 V), SSTL, and HSTL single-ended I/O standards. Differential standards including LVDS, BLVDS, and ULVDS also benefit from on-chip 50 Ω termination, eliminating external resistors and improving signal integrity.

Is XC2VP30-5FGG676I suitable for new designs?

No, XC2VP30-5FGG676I is marked "Product Not Recommended For New Designs" per DS083 v5.0. It remains available for legacy support and existing production programs but is not recommended for new architectures due to obsolescence and lack of long-term roadmap support from AMD/Xilinx.

What configuration modes does XC2VP30-5FGG676I support?

XC2VP30-5FGG676I supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 Boundary-Scan. Mode selection is controlled by M0–M2 pins, and configuration bitstreams can be encrypted using on-chip DES/3DES decryptors for IP protection.