AMD XC2VP30-6FF1152C

Overview

XC2VP30-6FF1152C from Xilinx is a Virtex-II Pro platform FPGA integrating two 350 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, 136 18×18 multipliers, and 2,448 Kb of Block SelectRAM+ memory in an FF1152 flip-chip BGA package with 644 user I/Os. It targets high-bandwidth embedded systems requiring integrated processing, serial connectivity, and reconfigurable logic - such as telecom line cards and video processing subsystems.

For engineers reviewing the XC2VP30-6FF1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-6 = 3.125 Gb/s), DCM-based clock management, DCI-enabled I/O termination, and FF1152 package compatibility with high-pin-count board layouts.

Technical Context

The XC2VP30-6FF1152C implements a hardened architecture combining SRAM-based FPGA fabric with two embedded PowerPC 405 cores and eight RocketIO transceivers. Its clocking system uses up to twelve Digital Clock Managers (DCMs) for deskew, multiplication, division, and fine-grained phase shifting (1/256 period resolution), while Active Interconnect routing ensures predictable timing independent of fanout.

I/O functionality includes SelectIO-Ultra blocks supporting 22 single-ended and 10 differential standards (LVDS, SSTL, HSTL), with Digitally Controlled Impedance (DCI) for on-die termination and built-in DDR register support. Configuration occurs via Slave/Master SelectMAP or JTAG (IEEE 1532), with optional Triple-DES bitstream encryption.

Key Specifications

Pinout & Package

XC2VP30-6FF1152C is housed in a 35 mm × 35 mm FF1152 flip-chip fine-pitch BGA package with 1152 balls and 1.0 mm pitch. The package supports high-speed signal integrity via low-inductance flip-chip interconnect and dedicated power/ground ball arrays.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP30-6FF1152C, XC2VP40-6FF1152C offers greater scalability within the same footprint, while XC2VP7-7FF676C trades density and I/O for reduced size and cost - making the XC2VP30-6FF1152C optimal for balanced embedded systems needing dual processors, moderate logic, and high I/O count in a standard 35×35 mm BGA.

Availability

XC2VP30-6FF1152C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial gateways, and defense electronics requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP30-6FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding system-level applications.

The Virtex-II Pro product line was engineered to unify programmable logic, embedded processors, and high-speed serial I/O in a single device - targeting applications where ASIC-level performance meets FPGA-level flexibility.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP30-6FF1152C?

The XC2VP30-6FF1152C supports RocketIO transceivers rated at 3.125 Gb/s (full-duplex) under the -6 speed grade. This rate complies with Gigabit Ethernet, Fibre Channel, and XAUI standards. The device does not include RocketIO X transceivers, which are exclusive to XC2VPX-series parts and support higher rates up to 6.25 Gb/s. Performance is validated per DS083 Module 3 switching characteristics.

Does XC2VP30-6FF1152C support bitstream encryption?

Yes, XC2VP30-6FF1152C includes an on-chip Triple-DES decryptor enabling encrypted configuration bitstreams. Up to two independent DES key sets can be stored in non-volatile memory. Encryption is applied during bitstream generation using Xilinx ISE tools and activated via configuration mode pins. This feature protects intellectual property against unauthorized readback or cloning.

Can XC2VP30-6FF1152C operate with only one PowerPC core enabled?

Yes, XC2VP30-6FF1152C allows runtime disabling of either PowerPC 405 core via software reset or configuration bitstream customization. Both cores are physically present and functional, but system firmware may initialize only one - freeing the other for failover, debug monitoring, or low-power sleep states. Cache coherency is not maintained between cores; inter-core communication requires shared memory or mailbox registers implemented in FPGA fabric.

What I/O standards are supported by XC2VP30-6FF1152C's SelectIO-Ultra blocks?

XC2VP30-6FF1152C supports 22 single-ended standards (including LVTTL, LVCMOS 3.3V/2.5V/1.8V/1.5V, PCI/PCI-X, SSTL, HSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Each I/O bank is independently configurable for voltage (1.5V–3.3V) and drive strength (2–24 mA), with Digitally Controlled Impedance (DCI) providing automatic on-die termination matching.

Is XC2VP30-6FF1152C recommended for new designs?

No - XC2VP30-6FF1152C is marked "Product Not Recommended For New Designs" per Xilinx DS083 (v5.0, June 2011). It remains available for legacy support, repair, and obsolescence mitigation, but Xilinx recommends Virtex-5 or newer families (e.g., Kintex-7) for new development due to superior performance, lower power, and ongoing toolchain support. Aetrix Electronics maintains inventory and lifecycle coordination for continued production use.