AMD XC2VP30-6FF1152I

Overview

XC2VP30-6FF1152I from Xilinx is a Virtex-II Pro platform FPGA integrating two 350 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, and 644 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP30-6FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor support, transceiver count and speed grade (-6), DCM count (8), SelectRAM+ capacity (2.448 Mb), and industrial temperature rating (–40°C to +100°C).

Technical Context

The XC2VP30-6FF1152I implements a hardened architecture combining FPGA fabric with two PowerPC 405 cores and eight RocketIO transceivers. Each transceiver supports full-duplex operation at up to 3.125 Gb/s with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

Its clocking subsystem includes eight Digital Clock Manager (DCM) modules supporting precise deskew, integer/fractional frequency synthesis, and phase shifting in 1/256-clock increments. The device uses a 0.13 µm nine-layer copper process with 1.5 V core voltage and dedicated 2.5 V VCCAUX/VCCO supplies.

Key Specifications

Pinout & Package

XC2VP30-6FF1152I is housed in a 35 mm × 35 mm FF1152 flip-chip fine-pitch BGA package with 1.0 mm ball pitch. This package supports high I/O count, low-inductance power delivery, and superior thermal dissipation versus wire-bond alternatives.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA with embedded processor applications.

Compared with XC2VP30-6FF1152I, XC2VP40-6FF1152I adds 41% more logic and up to 50% more transceivers in identical packaging, while XC2VP70-6FF1152I doubles logic resources and supports double the transceiver count-making both suitable for upward-compatible system evolution without PCB redesign.

Availability

XC2VP30-6FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial imaging, military communications, and medical equipment requiring stable component supply across extended lifecycles.

Supply support for XC2VP30-6FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed industry-defining FPGA architectures and embedded processor platforms.

The Virtex-II Pro family, including XC2VP30-6FF1152I, was engineered for high-performance system-on-chip integration-combining FPGA fabric, PowerPC processors, and multi-gigabit transceivers to replace ASICs in telecom, defense, and imaging applications.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-6FF1152I?

The XC2VP30-6FF1152I features two PowerPC 405 RISC processor blocks rated at 350 MHz for Industrial temperature grade (-6 speed grade). This frequency is guaranteed under worst-case voltage and temperature conditions, and requires adherence to XAPP755 guidelines when running above 300 MHz in dual-processor configurations.

Does XC2VP30-6FF1152I support JTAG boundary-scan testing?

Yes, XC2VP30-6FF1152I fully complies with IEEE 1149.1 and supports boundary-scan testing via its dedicated TCK, TMS, TDI, and TDO pins. The device implements standard instructions including EXTEST, INTEST, SAMPLE, and IDCODE, enabling board-level interconnect verification and in-system programming.

What transceiver protocols are supported by the RocketIO blocks in XC2VP30-6FF1152I?

The eight RocketIO transceivers in XC2VP30-6FF1152I support Fibre Channel, Gigabit Ethernet, 10G Fibre Channel, XAUI, InfiniBand, and OC-48 protocols. They operate at 600 Mb/s to 3.125 Gb/s with 8B/10B encoding, channel bonding, and programmable comma detection for protocol alignment.

Can XC2VP30-6FF1152I perform partial reconfiguration?

Yes, XC2VP30-6FF1152I supports partial reconfiguration through its SRAM-based configuration architecture. Users can dynamically reload specific logic regions without disrupting operation of the rest of the design, enabling adaptive hardware acceleration and field-upgradable functionality.

Is XC2VP30-6FF1152I qualified for industrial temperature operation?

Yes, the "I" suffix in XC2VP30-6FF1152I denotes Industrial temperature grade, specifying reliable operation from –40°C to +100°C. This qualification covers all embedded functions-including PowerPC cores, RocketIO transceivers, DCMs, and I/O banks-under full electrical load and thermal stress.