AMD XC2VP30-6FF896C

Overview

XC2VP30-6FF896C from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, twelve Digital Clock Managers (DCMs), and 644 user I/Os in an FF896 flip-chip BGA package. It delivers embedded processing, high-speed serial connectivity, and reconfigurable logic for telecom backplane interfaces, network packet processors, and video-over-IP systems.

For engineers reviewing the XC2VP30-6FF896C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, 3.125 Gb/s transceiver compliance with XAUI/Fibre Channel, DCM-based clock deskew and phase shifting, and FF896 package I/O count and thermal performance.

Technical Context

The XC2VP30-6FF896C implements a hardened architecture combining SRAM-based FPGA fabric with two embedded PowerPC 405 cores operating up to 350 MHz (–6 speed grade), eight RocketIO transceivers supporting 600 Mb/s to 3.125 Gb/s full-duplex operation, and twelve DCMs enabling precise clock de-skew, integer/fractional frequency synthesis, and ±1/256-cycle phase adjustment.

Its IOBs support 22 single-ended and 10 differential I/O standards-including LVDS, SSTL, HSTL, and PCI-X-with programmable drive strength (2–24 mA) and Digitally Controlled Impedance (DCI) for on-die termination. The device uses a 0.13 µm nine-layer copper process with 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and configurable I/O supply (VCCO).

Key Specifications

Pinout & Package

XC2VP30-6FF896C is housed in a 31 mm × 31 mm FF896 flip-chip fine-pitch BGA package with 1.00 mm ball pitch, designed for high I/O density and superior thermal dissipation. Pin definitions are documented across 302 pages in DS083 Module 4, covering all 896 balls including power, ground, configuration, JTAG, PowerPC debug, RocketIO differential pairs, and user-selectable I/O banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP30-6FF896C, XC2VP40-6FF896C offers 41% more logic and flexible transceiver count but increases power and cost; XC2VP20-6FF896C retains identical I/O and serial interface capability while reducing fabric capacity by 32%, easing timing closure and lowering static power.

Availability

XC2VP30-6FF896C is available at Aetrix Electronics and suitable for telecom infrastructure, network security appliances, broadcast video gateways, and industrial motion controllers requiring stable component supply across extended product lifecycles.

Supply support for XC2VP30-6FF896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding system-level integration.

The Virtex-II Pro product line was engineered to unify hard processor subsystems, multi-gigabit serial I/O, and configurable logic on a single die-targeting applications where software-defined functionality, real-time processing, and high-bandwidth interconnect converge.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-6FF896C?

The XC2VP30-6FF896C –6 speed grade supports PowerPC 405 cores operating up to 350 MHz in commercial temperature range. This rating assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-core timing closure. The actual achievable frequency depends on cache hit rate, bus contention, and peripheral clock domain interactions within the XC2VP30-6FF896C design.

Does XC2VP30-6FF896C support IEEE 1149.1 boundary-scan testing?

Yes, XC2VP30-6FF896C fully complies with IEEE 1149.1 (JTAG) and IEEE 1532 standards. Its Test Access Port (TAP) supports BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions. Boundary-scan testing can verify solder joints, interconnect integrity, and configuration memory contents without requiring functional operation of the XC2VP30-6FF896C logic fabric or processor cores.

Can XC2VP30-6FF896C perform partial reconfiguration in-system?

Yes, XC2VP30-6FF896C supports partial reconfiguration via SelectMAP or JTAG interfaces. This allows dynamic swapping of logic modules-such as protocol engines or filter coefficients-without resetting the PowerPC cores or disrupting active RocketIO links. Implementation requires careful floorplanning, configuration frame addressing, and use of Xilinx's PlanAhead or ISE tools to generate compatible partial bitstreams for the XC2VP30-6FF896C device.

What I/O standards are supported by XC2VP30-6FF896C with on-chip termination?

XC2VP30-6FF896C supports on-chip termination for 22 single-ended standards (including LVTTL, LVCMOS 1.5/1.8/2.5/3.3 V, PCI-X, GTL) via Digitally Controlled Impedance (DCI), and for four differential standards (LVDS, BLVDS, ULVDS, LDT) using programmable on-die 100 Ω differential termination. Termination values are calibrated dynamically against external reference resistors connected to VRN/VRP pins.

Is XC2VP30-6FF896C still recommended for new designs?

No-XC2VP30-6FF896C is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). While fully functional and supported for legacy program continuity, Xilinx recommends migrating to 7-series or UltraScale FPGAs for new development due to enhanced performance, lower power, integrated transceivers (GTH/GTP), and modern toolchain support. Aetrix Electronics maintains inventory and lifecycle support for existing XC2VP30-6FF896C deployments.