AMD XC2VP30-6FF896I

Overview

XC2VP30-6FF896I from Xilinx is a Virtex-II Pro platform FPGA integrating two PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, twelve Digital Clock Managers (DCMs), and 644 user I/Os in an FF896 flip-chip BGA package. It delivers embedded processing, high-speed serial connectivity, and programmable logic for telecom backplane interfaces, network packet processors, and video-over-IP systems.

For engineers reviewing the XC2VP30-6FF896I datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC 405 core support, 3.125 Gb/s RocketIO transceiver performance at -6 speed grade, FF896 package I/O count (644), DCM count (12), and compatibility with XAUI, Fibre Channel, and Gigabit Ethernet protocols.

Technical Context

The XC2VP30-6FF896I implements a hardened architecture combining SRAM-based FPGA fabric with two embedded PowerPC 405 cores (350 MHz max at -6 grade), eight RocketIO transceivers (full-duplex SERDES, 8/16/32-bit parallel interface, 8B/10B encoding), and twelve DCMs for clock synthesis, de-skew, and phase shifting. Its SelectIO-Ultra I/O supports 22 single-ended and 10 differential standards including LVDS, SSTL, and HSTL.

It uses a 0.13 µm nine-layer copper process with 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). Configuration is via Slave/Master SelectMAP or JTAG (IEEE 1532), with optional triple-DES bitstream encryption and readback capability for debug.

Key Specifications

Pinout & Package

XC2VP30-6FF896I is housed in an FF896 flip-chip fine-pitch BGA package (31 mm × 31 mm, 1.0 mm pitch) with 896 balls. The package supports 644 user I/Os, 15 dedicated configuration and boundary-scan pins (CCLK, DONE, M0–M2, PROG_B, PWRDWN_B, TCK/TDI/TDO/TMS, HSWAP_EN, DXN/DXP, RSVD), VBATT, and 8 RocketIO transceiver banks (each with TXP/TXN/RXP/RXN, reference clocks, and power/ground).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP30-6FF896I, XC2VP40-6FF896I offers higher logic and transceiver count in identical packaging-ideal for incremental upgrades-while XC2VP70-6FF1152I delivers significantly greater resources but mandates new PCB design, thermal management, and power delivery planning.

Availability

XC2VP30-6FF896I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial automation, and broadcast video systems requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP30-6FF896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering programmable logic company acquired by AMD in 2022, known for FPGA, SoC, and adaptive compute solutions targeting high-performance computing and embedded systems.

The Virtex-II Pro family was designed to integrate hard processor cores and high-speed serial transceivers into SRAM-based FPGA fabric-enabling complete system-on-chip implementations without discrete microprocessors or PHYs.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-6FF896I?

The XC2VP30-6FF896I supports a maximum PowerPC 405 core clock frequency of 350 MHz under industrial temperature conditions (-40°C to +100°C) at the -6 speed grade. This rating assumes proper decoupling, thermal management, and adherence to VCCINT = 1.5 V ±3% and VCCAUX = 2.5 V ±3%. Performance beyond 350 MHz requires implementation of the clock macro described in XAPP755.

Does XC2VP30-6FF896I support JTAG boundary-scan testing?

Yes, XC2VP30-6FF896I fully supports IEEE 1149.1 boundary-scan testing via its dedicated TCK, TMS, TDI, and TDO pins. The device implements standard instructions including EXTEST, INTEST, SAMPLE, PRELOAD, and BYPASS, enabling board-level interconnect verification, in-system programming, and real-time debug access without requiring functional I/O pins.

What transceiver protocols are supported by the RocketIO blocks in XC2VP30-6FF896I?

The RocketIO transceivers in XC2VP30-6FF896I support Fibre Channel (1.0625/2.125 Gb/s), Gigabit Ethernet (1.25 Gb/s), 10G Attachment Unit Interface (XAUI at 3.125 Gb/s), InfiniBand, and PCI Express Gen1 (2.5 Gb/s). Protocol compliance is achieved through integrated 8B/10B encoding, channel bonding, and programmable pre-emphasis-no external PHY required.

Can XC2VP30-6FF896I be configured using SPI flash memory?

No, XC2VP30-6FF896I does not support native SPI flash configuration. It requires configuration via Master/Slave SelectMAP (parallel x8/x16), JTAG (IEEE 1532), or Slave Serial modes. To use SPI flash, an external microcontroller or CPLD must manage the bitstream loading sequence into XC2VP30-6FF896I's configuration port-Xilinx does not provide built-in SPI boot support for this device.

Is XC2VP30-6FF896I pin-compatible with other Virtex-II Pro devices in FF896 packaging?

XC2VP30-6FF896I shares the FF896 package footprint and ball map with XC2VP20-6FF896I and XC2VP40-6FF896I, but I/O function assignment differs across devices due to varying resource allocation (e.g., RocketIO placement, DCM routing, and SelectIO bank distribution). While mechanical mounting is identical, PCB design must be verified per device-specific pinout tables in DS083 Module 4.