AMD XC2VP30-6FFG1152C

Overview

XC2VP30-6FFG1152C from Xilinx is a Virtex-II Pro platform FPGA integrating two 350 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, 136 18×18-bit multipliers, and 2,448 Kb of Block SelectRAM+ memory in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth telecom backplane interfaces with embedded processing.

For engineers reviewing the XC2VP30-6FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-6), I/O count (644 user I/Os), DCM count (8), and FF1152 package thermal/power delivery characteristics.

Technical Context

The XC2VP30-6FFG1152C implements a hardened architecture combining FPGA fabric with embedded processor subsystems and serial transceivers. Its dual PowerPC 405 cores operate at up to 350 MHz (speed grade -6), each with 16 KB instruction and data caches, MMU, and OCM interface. The eight RocketIO transceivers support full-duplex operation from 600 Mb/s to 3.125 Gb/s with 8B/10B encoding, channel bonding, and programmable pre-emphasis.

FPGA resources include 13,696 CLB slices, 136 dedicated 18×18-bit multipliers, 136 Block SelectRAM+ modules (18 Kb each), eight Digital Clock Managers (DCMs) for phase-shifting and frequency synthesis, and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X with digitally controlled impedance (DCI). Routing uses Active Interconnect Technology with hierarchical segmented structure and predictable delay.

Key Specifications

Pinout & Package

XC2VP30-6FFG1152C uses the FF1152 flip-chip fine-pitch BGA package (35×35 mm, 1.0 mm pitch), with 1152 balls arranged in a grid. Pin definitions are documented across 302 pages in DS083 Module 4, covering ball assignments for configuration, power, ground, I/O banks, JTAG, RocketIO differential pairs (TXP/TXN, RXP/RXN), DCM inputs/outputs, and PowerPC bus signals (PLB, OPB, DCR).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP30-6FFG1152C, XC2VP40-6FFG1152C adds 43% more logic and 50% more transceivers within identical mechanical and thermal constraints, while XC2VP70-6FFG1152C doubles logic capacity and supports 2.5× higher serial bandwidth-making both viable upgrades for scalable system architectures without board redesign.

Availability

XC2VP30-6FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, wireless base station, industrial imaging, defense radar, and high-performance computing applications requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP30-6FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA technology and advanced system-on-chip solutions for high-performance computing and adaptive hardware.

The Virtex-II Pro family, including XC2VP30-6FFG1152C, was designed for embedded systems requiring integrated processing, high-speed serial I/O, and reconfigurable logic-targeting telecom, aerospace, and instrumentation markets where ASIC-level performance meets FPGA flexibility.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-6FFG1152C?

The XC2VP30-6FFG1152C PowerPC 405 cores operate at up to 350 MHz under speed grade -6 conditions, as confirmed in Table 4 of DS083. This rating assumes proper thermal management, 1.5 V VCCINT supply, and adherence to timing closure requirements for the processor's PLB interface. The XC2VP30-6FFG1152C datasheet specifies this limit applies to commercial-grade operation; industrial-grade variants are rated at 300 MHz.

Does XC2VP30-6FFG1152C support 64B/66B encoding in its RocketIO transceivers?

No, XC2VP30-6FFG1152C does not support 64B/66B encoding. Its eight RocketIO transceivers implement only 8B/10B encoding, as stated in the "RocketIO Transceiver Features" section of DS083 Module 1. 64B/66B encoding is exclusive to Virtex-II Pro X devices (e.g., XC2VPX20, XC2VPX70) equipped with RocketIO X cores, which XC2VP30-6FFG1152C lacks.

What is the total Block SelectRAM+ capacity in XC2VP30-6FFG1152C?

The XC2VP30-6FFG1152C contains 136 Block SelectRAM+ modules, each 18 Kb, yielding 2,448 Kb (2.4 Mb) of true dual-port RAM. This is explicitly listed in Table 1 of DS083 under "Block SelectRAM+" for XC2VP30. Each block is configurable from 16K×1 to 512×36 bits and supports three read-during-write modes, making XC2VP30-6FFG1152C suitable for deep packet buffering and coefficient storage.

Can XC2VP30-6FFG1152C be configured via JTAG boundary scan?

Yes, XC2VP30-6FFG1152C supports IEEE 1149.1-compliant JTAG boundary-scan configuration through TCK, TMS, TDI, and TDO pins. The device implements EXTEST, INTEST, and HIGHZ instructions, and allows configuration bitstream loading via the JTAG port in accordance with IEEE 1532. This capability is documented in the "Boundary Scan" section of DS083 Module 1 and enables in-system programming and test without dedicated configuration pins.

Is XC2VP30-6FFG1152C pin-compatible with other Virtex-II Pro devices in the FF1152 package?

No, XC2VP30-6FFG1152C is not fully pin-compatible with other Virtex-II Pro devices in the FF1152 package. While the FF1152 mechanical footprint is shared, ball assignments differ significantly across devices due to varying I/O counts, RocketIO channel allocations, and PowerPC bus signal requirements. DS083 Module 4 confirms distinct pinout tables per device; for example, XC2VP40-6FFG1152C allocates additional balls to RocketIO lanes, whereas XC2VP30-6FFG1152C dedicates more to general-purpose I/O.