AMD XC2VP30-6FFG1152I

Overview

XC2VP30-6FFG1152I from Xilinx is a Virtex-II Pro platform FPGA integrating two 350 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, 136 18×18 multipliers, and 2,448 Kb block RAM - deployed in high-speed telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP30-6FFG1152I datasheet, pinout, applications, or equivalent options, this device serves as a complete system-on-chip solution for protocol-aware serial interconnects with real-time control, where deterministic clock management, on-chip memory hierarchy, and I/O flexibility are critical selection criteria.

Technical Context

The XC2VP30-6FFG1152I implements dual PowerPC 405 cores with 16 KB instruction and data caches, MMU support, and CoreConnect bus compatibility - enabling bare-metal or RTOS-based firmware execution directly on the FPGA fabric. Its eight RocketIO transceivers operate at up to 3.125 Gb/s with 8B/10B encoding, channel bonding, and programmable pre-emphasis - supporting Fibre Channel, Gigabit Ethernet, and XAUI protocols.

Internally, it uses a 0.13 µm nine-layer copper process with 1.5 V core supply, features twelve Digital Clock Managers (DCMs) for phase-shifting and frequency synthesis, and delivers 1,152 user I/Os across SelectIO-Ultra banks supporting LVDS, SSTL, HSTL, and PCI-X - all routed via Active Interconnect hierarchical routing with predictable timing.

Key Specifications

Pinout & Package

XC2VP30-6FFG1152I is housed in a 1.0 mm pitch FF1152 flip-chip fine-pitch BGA package with 1152 balls, optimized for thermal performance and signal integrity in high-density PCB layouts.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP40-6FF1152I and XC2VP70-6FF1152I, the XC2VP30-6FFG1152I offers optimal balance of embedded processing, serial I/O, and logic resources for mid-range telecom and video systems - avoiding overdesign while maintaining upgrade path scalability through shared package and architecture.

Availability

XC2VP30-6FFG1152I is available at Aetrix Electronics and suitable for telecom line cards, wireless baseband units, industrial video transport systems, and automated test equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP30-6FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022; it pioneered FPGA architectures with embedded hard IP and system-level integration.

The Virtex-II Pro family was designed to unify programmable logic, embedded processors, and high-speed serial I/O in a single die - targeting system architects needing hardware-software co-design capability for networking and signal processing.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-6FFG1152I?

The XC2VP30-6FFG1152I supports dual PowerPC 405 cores running at up to 350 MHz in the -6 speed grade. This rating assumes proper thermal management and adherence to voltage specifications (1.5 V core, 2.5 V auxiliary). The actual achievable frequency depends on design complexity, clock routing, and static timing closure - verified using Xilinx ISE tools and DS083 timing models.

Does XC2VP30-6FFG1152I support JTAG boundary-scan testing?

Yes, XC2VP30-6FFG1152I fully complies with IEEE 1149.1 and supports boundary-scan testing via TCK, TMS, TDI, and TDO pins. It implements SAMPLE, PRELOAD, EXTEST, INTEST, and HIGHZ instructions - enabling board-level interconnect verification, in-system programming, and real-time I/O monitoring without requiring external test fixtures.

Can XC2VP30-6FFG1152I be configured using SPI flash memory?

No, XC2VP30-6FFG1152I does not support native SPI flash configuration. It supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 (JTAG) modes. To use SPI flash, an external microcontroller or CPLD must implement a bridge that translates SPI commands into SelectMAP or serial configuration protocol - per XAPP380 guidelines.

What is the purpose of the DXN/DXP pins on XC2VP30-6FFG1152I?

The DXN/DXP pins on XC2VP30-6FFG1152I form differential pairs for RocketIO transceiver channels - carrying high-speed serial data at up to 3.125 Gb/s. Each pair supports AC-coupled transmission with on-chip 50 Ω termination, eliminating external resistors. They are assigned to specific transceiver quads and require strict PCB layout rules (length matching, impedance control) per DS083 layout guidelines.

Is XC2VP30-6FFG1152I recommended for new designs?

No, XC2VP30-6FFG1152I is marked "Product Not Recommended For New Designs" per Xilinx DS083 v5.0 (June 2011). It remains available for legacy support, repair, and continuity programs - but new designs should consider modern alternatives such as Kintex-7 or Versal ACAP families offering higher performance, lower power, and active technical support.