AMD XC2VP30-6FFG896C

Overview

XC2VP30-6FFG896C from Xilinx is a Virtex-II Pro platform FPGA integrating two 350 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, and 644 user I/Os in an 896-pin flip-chip fine-pitch BGA package. It delivers embedded processing, high-speed serial connectivity, and programmable logic for telecom backplane interfaces, wireless baseband processing, and video-over-IP systems.

For engineers reviewing the XC2VP30-6FFG896C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-6 = 3.125 Gb/s), DCM-based clock management, SelectIO-Ultra I/O flexibility, and FF896 package thermal/power delivery characteristics.

Technical Context

The XC2VP30-6FFG896C implements a hardened architecture combining SRAM-based FPGA fabric with two embedded PowerPC 405 cores and eight RocketIO transceivers. Its DCM modules provide precise clock de-skew, integer/fractional frequency synthesis, and ±1/256-cycle phase shifting - critical for synchronous multi-protocol serial links.

Each RocketIO channel supports 8/16/32-bit parallel FPGA interface, 8B/10B encoding, channel bonding (2–20 channels), and on-chip 50Ω/75Ω termination. The IOBs deliver programmable LVCMOS drive strength (2–24 mA), XCITE digitally controlled impedance (DCI), and native LVDS/BLVDS differential signaling up to 840 Mb/s.

Key Specifications

Pinout & Package

XC2VP30-6FFG896C uses the FF896 flip-chip fine-pitch BGA package (31 mm × 31 mm, 1.0 mm pitch), optimized for thermal dissipation and high I/O count. Pin definitions are documented across 302 pages in DS083 Module 4, with dedicated banks for VCCINT (1.5 V), VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V), and transceiver-specific power/ground pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP30-6FFG896C, XC2VP40-6FF896C offers greater scalability for future feature expansion, while XC2VP7-6FG676C reduces BOM cost and simplifies PCB layout at the expense of dual-core capability and transceiver count.

Availability

XC2VP30-6FFG896C is available at Aetrix Electronics and suitable for telecom infrastructure, wireless base station development, and industrial video processing requiring stable component supply across extended product lifecycles.

Supply support for XC2VP30-6FFG896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding system-level integration.

The Virtex-II Pro product line was engineered to unify embedded processing, high-speed serial I/O, and configurable logic in a single device - targeting applications where ASIC-like performance meets FPGA flexibility.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-6FFG896C?

The XC2VP30-6FFG896C is rated for 350 MHz PowerPC 405 core operation under Commercial (-6) speed grade conditions. This assumes proper thermal management and adherence to voltage specifications (VCCINT = 1.5 V ±3%). Operation above 350 MHz requires implementation of the clock macro described in XAPP755, which is not applicable to the -6 grade.

Does XC2VP30-6FFG896C support partial reconfiguration?

Yes, XC2VP30-6FFG896C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic swapping of functional modules in runtime without resetting the entire device or interrupting active PowerPC execution or RocketIO links.

What I/O standards are supported by the SelectIO-Ultra blocks in XC2VP30-6FFG896C?

XC2VP30-6FFG896C supports 22 single-ended standards (including LVTTL, LVCMOS at 1.5/1.8/2.5/3.3 V, PCI, PCI-X, GTL, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LDT, LVPECL). Each I/O bank has independent VCCO and programmable drive strength (2–24 mA).

Is XC2VP30-6FFG896C compatible with JTAG boundary-scan testing?

Yes, XC2VP30-6FFG896C fully complies with IEEE 1149.1 and supports standard JTAG instructions (EXTEST, INTEST, SAMPLE, PRELOAD, BYPASS, IDCODE). Its TAP controller enables board-level interconnect testing, in-system programming, and real-time debug access to internal registers and memory.

What is the role of the Digital Clock Manager (DCM) in XC2VP30-6FFG896C?

The DCM in XC2VP30-6FFG896C provides fully digital clock deskew, frequency synthesis (integer/fractional multiplication/division), and fine-grained phase shifting (±1/256 cycle resolution). It stabilizes clock distribution across large logic arrays and enables precise timing alignment for RocketIO transceivers and DDR memory interfaces.