AMD XC2VP30-6FFG896I

Overview

XC2VP30-6FFG896I from Xilinx is a Virtex-II Pro platform FPGA integrating two 350 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, 136 18×18 multipliers, and 2,448 Kb block RAM - deployed in high-reliability telecom backplane interfaces requiring deterministic latency and embedded processing.

For engineers reviewing the XC2VP30-6FFG896I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specs, I/O banking constraints, DCM timing behavior, RocketIO transceiver compliance modes, and industrial-grade (-40°C to +100°C) thermal derating guidance per DS083 v5.0.

Technical Context

The XC2VP30-6FFG896I implements dual PowerPC 405 cores with 16 KB instruction and data caches, MMU support, and CoreConnect bus interface - each operating at 350 MHz under -6 speed grade. Its eight RocketIO transceivers support full-duplex 3.125 Gb/s operation with 8B/10B encoding, channel bonding (2–20 lanes), and programmable pre-emphasis (4 levels).

Logic fabric comprises 13,696 CLB slices with distributed RAM, 18 Kb Block SelectRAM+ modules (644 Kb total), and dedicated 18×18 multipliers. Clocking uses twelve Digital Clock Managers (DCMs) for deskew, multiplication/division, and ±180° phase shifting - all synchronized to 16 global clock buffers routed across four quadrants.

Key Specifications

Pinout & Package

XC2VP30-6FFG896I uses an 896-ball flip-chip fine-pitch BGA (FFG896) package with 1.0 mm pitch, 31 mm × 31 mm body size, and industrial temperature range (-40°C to +100°C). Ball map follows Xilinx's standard FF896 pinout layout with dedicated banks for VCCO, VCCAUX, configuration, JTAG, and RocketIO differential pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-6FF896I, the XC2VP30-6FFG896I offers optimized cost-per-MIPS for mid-tier telecom infrastructure; versus XC2VP7-6FG676I, it delivers 2.8× more logic cells and 2.8× more block RAM within the same transceiver count - enabling deeper pipeline stages and larger on-chip buffers without external memory.

Availability

XC2VP30-6FFG896I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, military radar systems, and medical imaging equipment requiring stable component supply across extended lifecycle programs.

Supply support for XC2VP30-6FFG896I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based platform FPGAs with integrated processors and high-speed transceivers - delivering programmable silicon for mission-critical communications and compute-intensive systems since 1984.

The Virtex-II Pro family was designed specifically for embedded systems requiring hard processor subsystems alongside configurable logic and serial I/O - targeting applications where ASIC development cost and time-to-market outweigh FPGA resource limitations.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-6FFG896I?

The XC2VP30-6FFG896I supports dual PowerPC 405 cores running at 350 MHz under the -6 speed grade, as confirmed in Table 4 of DS083 v5.0. This frequency assumes proper thermal management and compliant 1.5 V VCCINT supply. At industrial temperature range (-40°C to +100°C), sustained operation requires derating per Xilinx Application Note XAPP755 for dual-core timing closure.

Does XC2VP30-6FFG896I support IEEE 1532 boundary-scan configuration?

Yes, XC2VP30-6FFG896I fully supports IEEE 1532 boundary-scan configuration via its JTAG TAP controller. The device implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions - enabling in-system programming, interconnect testing, and real-time register access without requiring external configuration PROMs.

Can XC2VP30-6FFG896I achieve 3.125 Gb/s on all eight RocketIO transceivers simultaneously?

Yes, XC2VP30-6FFG896I is rated for simultaneous 3.125 Gb/s operation across all eight RocketIO transceivers under -6 speed grade, as specified in Module 2 of DS083 v5.0. This requires adherence to Xilinx's PCB layout guidelines for differential pair routing, AC coupling, and power plane decoupling - particularly for VTTX and VRX supplies.

What is the purpose of the VRP/VRN pins on XC2VP30-6FFG896I?

The VRP and VRN pins on XC2VP30-6FFG896I provide the precision reference voltage for Digitally Controlled Impedance (DCI) circuitry. They must be connected to a stable 1.25 V source to enable on-die termination matching for single-ended I/O standards like LVCMOS and SSTL - eliminating external resistors and improving signal integrity in high-speed memory interfaces.

Is XC2VP30-6FFG896I compatible with Xilinx ISE 14.7 design tools?

XC2VP30-6FFG896I is supported exclusively by Xilinx ISE Design Suite versions up to 14.7, as documented in the ISE 14.7 Release Notes. It is not supported in Vivado - users must maintain legacy ISE toolchains for synthesis, place-and-route, and bitstream generation. Device-specific libraries and timing models are included in ISE 14.7 Service Pack 5.