AMD XC2VP30-6FG676C

Overview

XC2VP30-6FG676C from Xilinx is a Virtex-II Pro platform FPGA integrating two 350 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s per channel), 30,816 logic cells, 136 18×18-bit multipliers, and 2,448 Kb of Block SelectRAM+ memory in a 676-pin fine-pitch wire-bond BGA package. It targets high-bandwidth telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP30-6FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-6), I/O count (644 user I/Os), DCM count (8), and FG676 package compatibility with legacy PCB layouts.

Technical Context

The XC2VP30-6FG676C implements a hardened architecture combining FPGA fabric with embedded processor subsystems and SERDES. Its two PowerPC 405 cores operate at up to 350 MHz (speed grade -6), each with 16 KB instruction and data caches, MMU, and OCM interface. The eight RocketIO transceivers support full-duplex operation from 600 Mb/s to 2.5 Gb/s with 8B/10B encoding, on-chip 50 Ω termination, and per-channel loopback.

FPGA resources include 13,696 CLB slices, 136 dedicated 18×18-bit multipliers, 8 Digital Clock Managers (DCMs) for phase-shifting and frequency synthesis, and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X standards with digitally controlled impedance (DCI). Configuration uses SRAM-based bitstream loading via SelectMAP or JTAG.

Key Specifications

Pinout & Package

XC2VP30-6FG676C uses the FG676 wire-bond fine-pitch BGA package (26×26 mm, 1.0 mm pitch), supporting 644 user I/Os plus dedicated configuration, clock, and power pins. Pin definitions are documented across 302 pages in DS083 Module 4, with FG676-specific pinout tables covering all signal groups including MGTs, PowerPC bus signals, DCM inputs/outputs, SelectIO banks, and configuration interfaces.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA with embedded processor applications.

Compared with XC2VP30-6FG676C, XC2VP40-6FF672C trades embedded processing for higher serial I/O count and logic density in a different package, while XC2VP70-6FF896C extends both logic capacity and transceiver count within the same dual-core architecture-making it a direct upgrade path for bandwidth-constrained applications.

Availability

XC2VP30-6FG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial gateways, medical imaging systems, and defense electronics requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP30-6FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA technology and advanced platform solutions for high-performance computing and embedded systems.

The Virtex-II Pro family was designed to integrate hard IP-including PowerPC processors and RocketIO transceivers-into high-density FPGAs for applications demanding both programmable logic and embedded processing in a single die.

FAQ

What is the maximum operating frequency of the PowerPC cores in XC2VP30-6FG676C?

The XC2VP30-6FG676C features two PowerPC 405 cores rated for 350 MHz operation under speed grade -6 at commercial temperature range. This frequency is achievable with proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor timing closure. The XC2VP30-6FG676C datasheet specifies this limit in Table 4 of DS083.

Does XC2VP30-6FG676C support partial reconfiguration?

Yes, XC2VP30-6FG676C supports partial reconfiguration through its SRAM-based configuration architecture. Users can dynamically reload specific logic regions while keeping PowerPC cores, RocketIO transceivers, and DCMs operational. This capability is documented in the Configuration section of DS083 and enabled via Xilinx ISE tools with appropriate floorplanning.

What I/O standards are supported by XC2VP30-6FG676C?

XC2VP30-6FG676C supports 22 single-ended standards (including LVTTL, LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, GTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, HSTL, SSTL). Its SelectIO-Ultra blocks implement XCITE Digitally Controlled Impedance for automatic on-die termination matching.

Is XC2VP30-6FG676C pin-compatible with other Virtex-II Pro devices in FG676 package?

No, XC2VP30-6FG676C is not fully pin-compatible with other Virtex-II Pro devices in the FG676 package. While mechanical footprint and power/ground pin locations align, I/O bank assignments, RocketIO pinouts, and PowerPC bus signals differ across device densities. Pin compatibility must be verified per DS083 Module 4 pinout tables for each specific part.

What configuration modes does XC2VP30-6FG676C support?

XC2VP30-6FG676C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Mode selection is controlled by M0–M2 pins at power-up. All modes use the same CCLK, DONE, and PROG_B signals, with SelectMAP supporting parallel 8-/16-bit loading for fast configuration.