AMD XC2VP30-6FG676I

Overview

XC2VP30-6FG676I from Xilinx is a Virtex-II Pro platform FPGA integrating two 350 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max per channel), 30,816 logic cells, and 644 user I/Os in a 676-pin fine-pitch wire-bond BGA package. It targets high-bandwidth embedded systems requiring on-chip processing, serial interconnect, and reconfigurable logic - such as telecom line cards and video-over-IP gateways.

For engineers reviewing the XC2VP30-6FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include verified dual-processor support at -6 speed grade, RocketIO transceiver compliance with Gigabit Ethernet and Fibre Channel, DCI-enabled I/O termination, and DCM-based clock management for deterministic timing closure.

Technical Context

The XC2VP30-6FG676I implements a hardened dual-PowerPC 405 subsystem with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - enabling real-time embedded software execution alongside programmable logic. Its eight RocketIO transceivers operate at up to 2.5 Gb/s (wire-bond FG676 package) with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

Logic fabric includes 136 CLBs with distributed SelectRAM+, 136 18×18 multipliers, and twelve Digital Clock Managers supporting phase shifting, frequency synthesis, and deskew. I/O supports 22 single-ended and 10 differential standards including LVDS, SSTL, and PCI-X, with Digitally Controlled Impedance (DCI) for dynamic on-die termination calibration.

Key Specifications

Pinout & Package

XC2VP30-6FG676I uses the FG676 wire-bond fine-pitch BGA package (26 mm × 26 mm, 1.0 mm pitch), with 676 balls arranged in a 26×26 array. Pin definitions follow Xilinx DS083 Module 4: Pinout Information, covering dedicated configuration, JTAG, power, ground, I/O banks, RocketIO transceiver pairs (TXP/TXN/RXP/RXN), and PowerPC-specific signals (e.g., PLB, DCR, OPB).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-6FF672I and XC2VP7-6FG456I, the XC2VP30-6FG676I delivers balanced integration of processing, serial I/O, and logic resources - making it optimal for mid-tier embedded systems where transceiver count, I/O flexibility, and dual-core software execution must coexist within a single wire-bond package.

Availability

XC2VP30-6FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial automation controllers, and defense signal processing systems requiring stable component supply across extended product lifecycles.

Supply support for XC2VP30-6FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, SoCs, and adaptive compute acceleration platforms since 1984.

The Virtex-II Pro family was designed to unify hard processor subsystems with high-density reconfigurable logic and multi-gigabit serial I/O - targeting applications demanding both software programmability and hardware acceleration in a single device.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-6FG676I?

The XC2VP30-6FG676I supports dual PowerPC 405 cores running at 350 MHz under the -6 speed grade, as confirmed in DS083 Table 4. This frequency is guaranteed for Industrial temperature grade (-40°C to +100°C) operation and requires adherence to XAPP755 guidelines when exceeding 300 MHz in dual-processor configurations. The XC2VP30-6FG676I achieves this performance using its 1.5 V core supply and optimized 0.13 µm copper process.

Does XC2VP30-6FG676I support JTAG boundary-scan testing?

Yes, XC2VP30-6FG676I fully supports IEEE 1149.1 boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements standard instructions including EXTEST, INTEST, SAMPLE, and BYPASS, enabling board-level interconnect verification and in-system programming. This capability is documented in DS083 Module 1 and applies directly to the FG676 package configuration of XC2VP30-6FG676I.

What I/O standards are supported by XC2VP30-6FG676I with Digitally Controlled Impedance (DCI)?

XC2VP30-6FG676I supports DCI for all major single-ended I/O standards including LVCMOS (1.5V, 1.8V, 2.5V, 3.3V), LVTTL, PCI, PCI-X, SSTL, and HSTL. DCI automatically calibrates on-die series or parallel termination to match trace impedance, eliminating external resistors. This feature is explicitly enabled per I/O bank and is validated for the FG676 package in DS083 Module 1.

Can XC2VP30-6FG676I perform partial reconfiguration?

Yes, XC2VP30-6FG676I supports partial reconfiguration through its SRAM-based configuration architecture and SelectMAP interface. Users can dynamically reload specific logic regions without resetting the entire device or halting PowerPC execution. This capability is defined in DS083 Module 1 and leverages the device's hierarchical configuration memory structure and dedicated configuration logic.

What is the RocketIO transceiver compliance for XC2VP30-6FG676I?

The XC2VP30-6FG676I integrates eight RocketIO transceivers compliant with Gigabit Ethernet (1.25 Gb/s), Fibre Channel (1.0625 Gb/s), and XAUI (3.125 Gb/s) protocols, as specified in DS083 Module 2. These transceivers support 8B/10B encoding, channel bonding, and on-chip 50 Ω termination - all verified for the FG676 wire-bond package at the -6 speed grade.