AMD XC2VP30-6FGG676C

Overview

XC2VP30-6FGG676C from Xilinx is a Virtex-II Pro platform FPGA integrating dual PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (2.5 Gb/s max per channel), and 30,816 logic cells in a 676-pin fine-pitch wire-bond BGA package. It delivers embedded processing, high-speed serial I/O, and programmable logic for telecom backplane interfaces, wireless baseband processing, and video transport systems.

For engineers reviewing the XC2VP30-6FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include verified dual-processor support at 350 MHz, RocketIO transceiver compliance with Gigabit Ethernet and Fibre Channel, DCI-enabled I/O termination, and DCM-based clock management with ±1% jitter tolerance.

Technical Context

The XC2VP30-6FGG676C implements two independent PowerPC 405 cores with 16 KB instruction and 16 KB data caches, MMU support, and CoreConnect bus interface - enabling real-time embedded software execution alongside hardware acceleration. Its eight RocketIO transceivers operate at up to 2.5 Gb/s (wire-bond package limit) with 8B/10B encoding, on-chip 50 Ω/75 Ω termination, and per-channel loopback for protocol validation.

Logic fabric includes 136 CLBs with distributed SelectRAM+, 136 18×18 multipliers, and twelve Digital Clock Managers (DCMs) supporting phase shifting in 1/256-clock increments, frequency synthesis, and deskew across 16 global clock nets. The device uses a 0.13 µm nine-layer copper process with 1.5 V core supply and supports IEEE 1149.1 boundary scan.

Key Specifications

Pinout & Package

XC2VP30-6FGG676C is housed in a 676-ball fine-pitch wire-bond BGA (FGG676) with 1.0 mm pitch, Pb-free finish, and thermal pad. Pin definitions follow Xilinx DS083 Module 4, covering user I/O, configuration, JTAG, power, and transceiver-specific balls.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP30-6FGG676C, XC2VP40-6FF672C trades transceiver capability for higher logic density in a smaller footprint, while XC2VP50-6FF896C extends both logic capacity and transceiver speed - making it suitable for scaling bandwidth-intensive applications where wire-bond limitations constrain performance.

Availability

XC2VP30-6FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, wireless baseband, broadcast video, and industrial imaging applications requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP30-6FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic devices, delivering FPGAs, adaptive SoCs, and design tools for high-performance computing and embedded systems.

The Virtex-II Pro family was designed to integrate hard processor cores and high-speed serial transceivers into a single FPGA platform, targeting communications infrastructure and signal processing applications demanding both software flexibility and hardware acceleration.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-6FGG676C?

The XC2VP30-6FGG676C supports dual PowerPC 405 cores running at up to 350 MHz in -6 speed grade Commercial temperature devices. This rating assumes proper thermal management and adherence to XAPP755 guidelines for dual-processor clock macro implementation. The XC2VP30-6FGG676C datasheet specifies this limit under DC and switching characteristics for the -6 grade.

Does XC2VP30-6FGG676C support 3.125 Gb/s RocketIO operation?

No, XC2VP30-6FGG676C does not support 3.125 Gb/s RocketIO operation. As confirmed in DS083 Table 4, wire-bond packages like FGG676 are limited to 2.5 Gb/s for RocketIO transceivers. The 3.125 Gb/s rate is only achievable in flip-chip packages (e.g., FF672, FF896) per the same specification. XC2VP30-6FGG676C operates its eight RocketIO channels at up to 2.5 Gb/s.

What I/O standards are supported by XC2VP30-6FGG676C with DCI enabled?

XC2VP30-6FGG676C supports Digitally Controlled Impedance (DCI) for LVCMOS (1.5V, 1.8V, 2.5V, 3.3V), SSTL (1.8V, 2.5V), and HSTL (1.5V, 1.8V) single-ended standards. DCI provides automatic on-die series or parallel termination matching to PCB trace impedance without external resistors. This capability is documented in DS083 Module 1 and applies directly to the XC2VP30-6FGG676C device in FGG676 packaging.

How many Digital Clock Managers (DCMs) are available in XC2VP30-6FGG676C?

XC2VP30-6FGG676C contains twelve Digital Clock Managers (DCMs), each providing fully digital clock deskew, frequency synthesis, and fine-grained phase shifting in 1/256-clock increments. These DCMs are distributed across the die and support independent configuration per clock domain. This count is specified in DS083 Table 1 and applies identically to all XC2VP30 variants, including XC2VP30-6FGG676C.

Is XC2VP30-6FGG676C pin-compatible with other Virtex-II Pro devices in the FGG676 package?

No, XC2VP30-6FGG676C is not pin-compatible with other Virtex-II Pro devices in the FGG676 package. While the FGG676 mechanical footprint is shared, ball assignments differ across devices due to varying resource counts (e.g., transceiver pins, I/O banks, power/ground distribution). DS083 Module 4 explicitly lists unique pin definitions per device/package combination. Pin compatibility must be verified per XC2VP30-6FGG676C's dedicated pinout table, not assumed from package code alone.