AMD XC2VP30-7FF1152C

Overview

XC2VP30-7FF1152C from Xilinx is a high-density Virtex-II Pro platform FPGA integrating two 300+ MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, 136 18×18-bit multipliers, and 2,448 Kb of Block SelectRAM+ memory in an FF1152 flip-chip BGA package. It targets high-throughput telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP30-7FF1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-7), I/O count (644 user I/Os), DCM count (8), and FF1152 package compatibility with high-speed PCB routing constraints.

Technical Context

The XC2VP30-7FF1152C implements a hardened architecture combining SRAM-based FPGA fabric with two independent PowerPC 405 cores, each featuring 16 KB instruction and 16 KB data caches, MMU, and OCM interface. Its eight RocketIO transceivers operate at up to 3.125 Gb/s full-duplex with 8B/10B encoding, on-chip 50Ω termination, and channel bonding support for multi-lane protocols like XAUI.

Digital Clock Manager (DCM) resources provide precise clock de-skew, integer/fractional frequency synthesis, and ±180° phase shifting across eight independent modules. The FF1152 package delivers 644 user I/Os with SelectIO-Ultra support for LVDS (840 Mb/s), SSTL, HSTL, PCI-X, and digitally controlled impedance (DCI) for single-ended standards.

Key Specifications

Pinout & Package

XC2VP30-7FF1152C uses the FF1152 flip-chip fine-pitch BGA package (35 mm × 35 mm, 1.0 mm pitch), optimized for thermal performance and signal integrity in high-speed designs. It contains 1152 balls with 644 user I/Os, 8 RocketIO transceiver pairs, dedicated configuration and JTAG pins, and separate power domains (VCCINT = 1.5 V, VCCAUX = 2.5 V, VCCO = 1.5–3.3 V).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-integration FPGA applications.

Compared with XC2VP40-7FF1152C and XC2VP20-7FF1152C, the XC2VP30-7FF1152C offers optimal balance of transceiver count, dual PowerPC capability, and logic resources for mid-scale telecom and defense systems-avoiding overdesign while maintaining upgrade path to XC2VP40.

Availability

XC2VP30-7FF1152C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for XC2VP30-7FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute solutions since 1984.

The Virtex-II Pro family-including XC2VP30-7FF1152C-was engineered for high-performance embedded systems demanding integrated processing, high-speed serial I/O, and reconfigurable logic in a single device.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-7FF1152C?

The XC2VP30-7FF1152C supports PowerPC 405 core operation at up to 300 MHz under Industrial temperature conditions and 400 MHz in Commercial grade with proper thermal design. The -7 speed grade guarantees timing closure at these frequencies when using recommended power delivery and cooling.

Does XC2VP30-7FF1152C support 10 Gigabit Ethernet physical layer interfaces?

Yes, XC2VP30-7FF1152C supports 10 Gigabit Ethernet via its eight RocketIO transceivers configured as four XAUI lanes (each 3.125 Gb/s). The transceivers include 8B/10B encoding, elastic buffers, and channel bonding required for XAUI compliance.

What package type and pin count does XC2VP30-7FF1152C use?

XC2VP30-7FF1152C uses the FF1152 flip-chip fine-pitch BGA package with 1152 solder balls. It provides 644 user I/O pins, eight RocketIO differential pairs, and dedicated configuration/JTAG pins-all arranged for optimal signal integrity in high-speed PCB layouts.

Can XC2VP30-7FF1152C perform real-time encryption/decryption in hardware?

XC2VP30-7FF1152C includes on-chip DES decryptor logic for secure bitstream loading, but no dedicated AES or SHA hardware engines. Real-time cryptographic operations require implementation in FPGA fabric or PowerPC software-verified reference designs exist for IPsec offload using CLBs and multipliers.

Is XC2VP30-7FF1152C compatible with modern Xilinx development tools?

XC2VP30-7FF1152C is supported exclusively by legacy Xilinx ISE Design Suite (v14.7 and earlier). It is not compatible with Vivado or newer toolchains. Design migration paths exist to Kintex-7 or Virtex-7 families, but require full RTL and constraint rework.