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AMD XC2VP30-7FF896C

Part No.:
XC2VP30-7FF896C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
896-BBGA, FCBGA
Datasheet:
AetrixXC2VP30-7FF896C.pdf
Description:
IC FPGA 556 I/O 896FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,698

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Product details

Overview

XC2VP30-7FF896C from Xilinx is a Virtex-II Pro platform FPGA integrating two 400 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, 136 18×18 multipliers, and 2,448 Kb block RAM - deployed in high-speed telecom backplane interfaces requiring embedded processing and serial connectivity.

For engineers reviewing the XC2VP30-7FF896C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, FF896 flip-chip BGA package mapping, RocketIO/PowerPC co-design constraints, and validated alternative FPGAs for legacy system sustainment and migration paths.

Technical Context

The XC2VP30-7FF896C implements dual PowerPC 405 cores with 16 KB instruction and data caches, MMU, and CoreConnect bus interface - enabling real-time embedded software execution alongside programmable logic. Its eight RocketIO transceivers support full-duplex 3.125 Gb/s operation with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

FPGA fabric includes 13,696 CLB slices, 136 dedicated 18×18 multipliers, 8 DCMs for clock deskew/multiplication/phase shift, and SelectIO-Ultra I/O supporting LVDS, SSTL, HSTL, and PCI-X - all built on a 0.13 µm copper process with 1.5 V core and 2.5 V I/O supplies.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells 30,816 - determines maximum combinational logic density and register count for RTL implementation
PowerPC Cores 2 × 400 MHz PowerPC 405 - enables dual-threaded embedded control with cache/MMU for OS support
RocketIO Transceivers 8 × 3.125 Gb/s full-duplex - provides 25 Gb/s aggregate serial bandwidth with 8B/10B encoding
Block RAM 2,448 Kb (136 × 18 Kb) - supports large FIFOs, frame buffers, or protocol stacks within FPGA fabric
Multipliers 136 × 18-bit × 18-bit - accelerates DSP filtering, FFT, and math-intensive algorithms without LUT overhead
DCMs 8 Digital Clock Managers - deliver jitter-tolerant clock synthesis, phase alignment, and frequency translation
I/O Pins 644 user I/Os in FF896 package - supports high-pin-count parallel buses, DDR memory interfaces, and mixed-standard I/O

Pinout & Package

XC2VP30-7FF896C is housed in an FF896 flip-chip fine-pitch BGA package with 1.0 mm pitch, 31 mm × 31 mm body size, and 896 balls. The package supports thermal dissipation for sustained 400 MHz CPU and 3.125 Gb/s transceiver operation.

Pin/Terminal Circuit Role Design Meaning
CCLK Configuration Clock Input Drives internal configuration logic during master serial or SelectMAP programming
DONE Configuration Status Output Signals completion of bitstream loading and initialization of I/Os and logic
M0–M2 Mode Selection Inputs Set configuration mode (slave serial, master serial, slave SelectMAP, etc.) at power-up
PROG_B Program Initiate Input Resets configuration memory and initiates reconfiguration sequence
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface Enables IEEE 1149.1-compliant testing, debugging, and partial reconfiguration
DXP/DXN Differential Transceiver Reference Provides low-jitter reference clock input for RocketIO CDR circuitry
VCCINT Core Power Supply 1.5 V supply powering CLBs, DCMs, Block RAM, and PowerPC core logic
VCCAUX Auxiliary Power Supply 2.5 V supply for configuration logic, JTAG, DCMs, and transceiver analog circuitry
VCCO I/O Power Supply Configurable 1.5 V / 1.8 V / 2.5 V / 3.3 V supply per bank for SelectIO-Ultra standards

Key Features

Feature Design Value
Dual PowerPC 405 Cores Enables symmetric multiprocessing or asymmetric control + signal processing partitioning with hardware cache coherency support
RocketIO Transceivers Eliminates external SERDES and clock recovery ICs - reduces board area and power by integrating 3.125 Gb/s PHY + MAC-layer functions
SelectIO-Ultra I/O Supports simultaneous LVDS, SSTL-2, and PCI-X signaling in same device - simplifies mixed-interface board design without level shifters
Digital Clock Manager (DCM) Provides zero-delay buffer, ±150 ps phase shift resolution, and 2×–16× frequency synthesis - replaces external PLLs for clock domain crossing
Block SelectRAM+ Memory Delivers true dual-port 18 Kb RAM blocks with read-during-write capability - enables pipelined memory access for video frame buffering

Applications

Telecom Line Card Medical Imaging Backend

Use Scenario: High-density packet aggregation in OC-48/STM-16 line cards with integrated control plane and data path.

IC Role / Device Role / Timing Role: XC2VP30-7FF896C serves as the central packet processor and SerDes bridge between backplane (XAUI) and line-side optics (Fibre Channel).

Use Value: Dual PowerPC cores run routing protocols while RocketIO handles 8× 3.125 Gb/s line rates - eliminating need for discrete network processors and PHYs.

Use Scenario: Real-time image reconstruction pipeline in MRI/PET systems requiring deterministic latency and high memory bandwidth.

IC Role / Device Role / Timing Role: XC2VP30-7FF896C acts as the compute accelerator interfacing ADCs, DDR2 memory, and display controllers via dedicated high-speed I/O banks.

Use Value: 2,448 Kb block RAM + 136 multipliers enable parallel FFT and back-projection kernels - achieving sub-100 µs latency per frame slice.

Avionics Data Concentrator Industrial Protocol Gateway

Use Scenario: ARINC 664 (AFDX) end-system aggregating sensor data across multiple LRUs in fly-by-wire platforms.

IC Role / Device Role / Timing Role: XC2VP30-7FF896C implements time-triggered AFDX endpoint with redundant Ethernet MACs and deterministic scheduling logic.

Use Value: On-chip DCMs generate jitter-free 100 MHz clocks synchronized to aircraft master timing - meeting DO-254 Level A timing certification requirements.

Use Scenario: Fieldbus-to-Ethernet gateway bridging PROFIBUS DP, CANopen, and Modbus TCP in factory automation PLCs.

IC Role / Device Role / Timing Role: XC2VP30-7FF896C hosts dual protocol stacks with PowerPC handling TCP/IP stack and FPGA fabric managing cyclic fieldbus I/O scanning.

Use Value: 644 I/O pins support simultaneous RS-485, CAN, and Ethernet PHY interfaces - reducing BOM cost versus multi-chip gateway solutions.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2VP40-7FF1152C Higher logic density (43,632 cells), 12 RocketIO transceivers, 804 I/Os, FF1152 package (35×35 mm) Required for designs needing >30K logic cells or >8 transceivers - e.g., 10G Ethernet switch fabric with full line-rate forwarding Choose when XC2VP30-7FF896C resource utilization exceeds 90% or transceiver count is insufficient
XC2VP7-7FF456C Lower logic count (11,088 cells), 8 RocketIO transceivers, 396 I/Os, FG456 package (23×23 mm) Suitable for cost-sensitive, space-constrained applications like remote radio heads with single PowerPC core and reduced memory footprint Choose when XC2VP30-7FF896C resources are significantly over-provisioned and thermal/power envelope is tighter

Compared with XC2VP30-7FF896C, XC2VP40-7FF1152C offers scalable transceiver count and logic capacity for next-generation throughput, while XC2VP7-7FF456C provides a smaller-footprint, lower-power entry point for functionally similar but less demanding implementations - both maintain identical RocketIO and PowerPC architectural compatibility.

Availability

XC2VP30-7FF896C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and avionics data concentrators requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP30-7FF896C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed transceivers.

The Virtex-II Pro family was designed for high-performance embedded systems integrating soft/hard IP, serial connectivity, and real-time processing - targeting telecom, defense, and scientific instrumentation markets.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-7FF896C?

The XC2VP30-7FF896C supports dual PowerPC 405 cores running at up to 400 MHz in -7 speed grade under commercial temperature conditions. This performance requires adherence to XAPP755 clock macro guidelines when both cores operate above 350 MHz. The XC2VP30-7FF896C datasheet specifies timing closure constraints for cache coherency and bus arbitration at this frequency.

Does XC2VP30-7FF896C support 10 Gigabit Ethernet (10GbE) physical layer interfaces?

Yes, XC2VP30-7FF896C supports 10GbE via its eight RocketIO transceivers configured for XAUI compliance (3.125 Gb/s per lane, 4-lane aggregate). The transceivers implement 8B/10B encoding, channel bonding, and elastic buffers required for XAUI - enabling direct connection to 10GbE PHYs without external retimers. The XC2VP30-7FF896C pinout allocates dedicated differential pairs for this purpose.

What I/O standards are supported by XC2VP30-7FF896C in the FF896 package?

XC2VP30-7FF896C supports LVDS, BLVDS, ULVDS, SSTL-18/25, HSTL-I/II/III/IV, LVTTL, LVCMOS (1.5V/1.8V/2.5V/3.3V), PCI-X (133 MHz), and GTL/GTLP - all implemented through SelectIO-Ultra banks. Each I/O bank accepts independent VCCO voltage, allowing mixed-voltage operation across the 644-user I/O pins in the FF896 package.

Is XC2VP30-7FF896C compatible with partial reconfiguration workflows?

Yes, XC2VP30-7FF896C supports partial reconfiguration using Xilinx Foundation and Alliance Series tools. The device's SRAM-based configuration memory allows dynamic loading of logic modules into designated CLB regions without resetting the PowerPC cores or RocketIO transceivers. This capability is documented in the XC2VP30-7FF896C Functional Description module and requires specific bitstream generation flow.

What is the significance of "Product Not Recommended For New Designs" status for XC2VP30-7FF896C?

"Product Not Recommended For New Designs" indicates Xilinx discontinued marketing XC2VP30-7FF896C for new projects after 2011, though it remains available for legacy system repair and sustainment. Aetrix Electronics maintains inventory and provides lifecycle coordination - including last-time-buy planning and cross-reference guidance - specifically for customers maintaining deployed XC2VP30-7FF896C-based equipment.

XC2VP30-7FF896C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II Pro
Package/Case:
896-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
3424
Number of Logic Elements/Cells:
30816
Total RAM Bits:
2506752
Number of I/O:
556
Number of Gates:
-
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
896-FCBGA (31x31)

XC2VP30-7FF896C FAQ

1.How can I place an order for XC2VP30-7FF896C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2VP30-7FF896C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2VP30-7FF896C reliable?

The price and inventory of XC2VP30-7FF896C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP30-7FF896C is usually 5 days.

3.What payment methods are accepted for XC2VP30-7FF896C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP30-7FF896C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2VP30-7FF896C?

XC2VP30-7FF896C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2VP30-7FF896C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2VP30-7FF896C?

For technical support, including XC2VP30-7FF896C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP30-7FF896C requirements.

6.How does Aetrix verify that XC2VP30-7FF896C is sourced from the original manufacturer or authorized distributors?

All XC2VP30-7FF896C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP30-7FF896C meets industry standards.

7.What is the process for return or replacement of XC2VP30-7FF896C?

All XC2VP30-7FF896C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP30-7FF896C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2VP30-7FF896C part is unused and in its original packaging.

Return procedure for XC2VP30-7FF896C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2VP30-7FF896C Tags

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