AMD XC2VP30-7FFG1152C

Overview

XC2VP30-7FFG1152C from Xilinx is a Virtex-II Pro platform FPGA integrating two 300–400 MHz PowerPC 405 RISC processor blocks, eight RocketIO multi-gigabit transceivers (3.125 Gb/s), 30,816 logic cells, twelve Digital Clock Managers (DCMs), and 644 user I/Os in an 1152-pin flip-chip fine-pitch BGA package. It targets high-bandwidth telecom backplane interfaces with embedded processing and deterministic serial connectivity.

For engineers reviewing the XC2VP30-7FFG1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual PowerPC core support, RocketIO transceiver count and speed grade (-7), DCM count for clock domain management, SelectRAM+ memory capacity (8 Mb), and FF1152 package I/O routing density.

Technical Context

The XC2VP30-7FFG1152C implements a hardened architecture combining SRAM-based FPGA fabric with two independent PowerPC 405 cores, each featuring 16 KB instruction and 16 KB data caches, MMU, and CoreConnect bus interface. Its eight RocketIO transceivers operate at up to 3.125 Gb/s with monolithic CDR, 8B/10B encoding, and per-channel loopback - all fully integrated without external PLLs or terminations.

Logic resources include 13,696 CLB slices, 428 dedicated 18×18 multipliers, and 136 Block SelectRAM+ modules (18 Kb each) supporting true dual-port configurations from 512×36 to 16K×1. Clocking uses twelve DCMs with ±1% frequency accuracy, 90/180/270° phase shifts, and fine-grained 1/256-period adjustment - enabling precise deskew across high-speed I/O banks and processor subsystems.

Key Specifications

Pinout & Package

XC2VP30-7FFG1152C is housed in a 1152-ball flip-chip fine-pitch BGA (FF1152) with 1.0 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high-power-density applications. The package supports 644 user I/Os plus dedicated configuration, JTAG, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP40-7FFG1152C and XC2VP70-7FFG1152C, the XC2VP30-7FFG1152C delivers optimal balance of dual PowerPC processing, 8 transceivers, and 30k logic cells in the FF1152 footprint - making it ideal for cost- and power-constrained line cards where scaling beyond 8 serial lanes is unnecessary.

Availability

XC2VP30-7FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, avionics data concentrators, and industrial protocol gateways requiring stable component supply across extended production lifecycles.

Supply support for XC2VP30-7FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-performance FPGAs for demanding system-level applications.

The Virtex-II Pro product line was designed to integrate hard processor cores and multi-gigabit transceivers into FPGA fabric - targeting applications needing both programmable logic and embedded processing in a single die.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP30-7FFG1152C?

The XC2VP30-7FFG1152C supports PowerPC 405 cores up to 400 MHz in -7 speed grade under commercial temperature conditions. This assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-core timing closure. At 350 MHz, operation is guaranteed across industrial temperature range without additional macro constraints.

Does XC2VP30-7FFG1152C support partial reconfiguration?

Yes, XC2VP30-7FFG1152C supports partial reconfiguration via its SRAM-based configuration architecture. Users can dynamically reload specific logic regions without resetting the entire device or interrupting PowerPC execution - enabling runtime adaptation of communication protocols or DSP filters while maintaining system uptime.

What I/O standards are supported by XC2VP30-7FFG1152C's SelectIO-Ultra blocks?

XC2VP30-7FFG1152C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, PCI-X, GTL, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, HyperTransport). On-chip DCI provides automatic impedance matching for single-ended I/Os, eliminating external termination resistors.

Can XC2VP30-7FFG1152C achieve 3.125 Gb/s transceiver performance in all packages?

No - 3.125 Gb/s RocketIO operation is guaranteed only in flip-chip packages (e.g., FF1152) at -7 speed grade. Wire-bond packages (FG/FGG) for XC2VP30 are limited to 2.5 Gb/s. The XC2VP30-7FFG1152C leverages FF1152's superior signal integrity and shorter interconnect to meet the full 3.125 Gb/s specification.

Is XC2VP30-7FFG1152C compatible with Xilinx ISE 14.7 design tools?

XC2VP30-7FFG1152C is fully supported in Xilinx ISE Design Suite versions 6.3 through 14.7. However, ISE 14.7 is the final release with official Virtex-II Pro device support; newer tools like Vivado do not support this architecture. Legacy projects must remain on ISE for synthesis, implementation, and bitstream generation of XC2VP30-7FFG1152C designs.