AMD XC2VP40-5FF1152C

Overview

XC2VP40-5FF1152C from Xilinx is a Virtex-II Pro platform FPGA with dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, and up to 12 RocketIO transceivers (configurable per package). It features 804 user I/Os in the FF1152 flip-chip BGA package, 12 Digital Clock Managers (DCMs), and supports 3.125 Gb/s serial transceivers for high-speed backplane and telecom interfaces.

For engineers reviewing the XC2VP40-5FF1152C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O configuration constraints, DCM timing behavior, PowerPC 405 cache and MMU specifications, and package-specific transceiver availability - all critical for legacy system sustainment, requalification, and FPGA-based protocol bridging designs.

Technical Context

The XC2VP40-5FF1152C implements a hybrid architecture integrating two independent PowerPC 405 cores (each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface) alongside programmable FPGA fabric. Its RocketIO transceivers operate at up to 3.125 Gb/s in full-duplex mode with 8B/10B encoding, on-chip 50 Ω termination, and channel bonding support for multi-lane protocols like XAUI and Fibre Channel.

Logic resources include 19,392 CLB slices, 3,456 Kb distributed RAM, 8 × 18 Kb Block SelectRAM+ modules (total 1,440 Kb), and 192 dedicated 18×18-bit multipliers. Clocking uses twelve DCMs supporting precise phase shifting (1/256 period resolution), frequency synthesis, and deskew across 16 global clock nets - enabling deterministic timing for DDR memory interfaces and synchronous serial links.

Key Specifications

Pinout & Package

XC2VP40-5FF1152C is housed in a 35 mm × 35 mm flip-chip fine-pitch BGA package (FF1152) with 1152 balls and 1.0 mm pitch. The package supports 804 user I/Os plus dedicated configuration, clock, and power pins. RocketIO transceivers are bonded out and available in this configuration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-5FF1152C, XC2VP50-5FF1152C offers scalable logic and I/O headroom within identical mechanical and thermal constraints, whereas XC4VLX60-11FF668C trades integrated processing for advanced process benefits and higher performance - making it viable only when PowerPC functionality can be replaced by MicroBlaze or external microcontroller.

Availability

XC2VP40-5FF1152C is available at Aetrix Electronics and suitable for telecom infrastructure upgrades, industrial protocol gateways, and medical imaging subsystems requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP40-5FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and software tools for high-performance computing, networking, and embedded systems.

The Virtex-II Pro family was engineered for high-integration embedded applications requiring both programmable logic and hardened processor subsystems - targeting telecom, defense, and industrial systems where hardware/software co-design and protocol flexibility are essential.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP40-5FF1152C?

The XC2VP40-5FF1152C is rated for 300 MHz operation of its dual PowerPC 405 cores at the –5 speed grade under commercial temperature conditions. This rating assumes proper PCB layout, decoupling, and thermal management per Xilinx DS083 specification. The XC2VP40-5FF1152C does not support the higher 350 MHz or 400 MHz ratings available in –6 or –7 speed grades.

Does XC2VP40-5FF1152C support JTAG boundary-scan testing?

Yes, XC2VP40-5FF1152C fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements EXTEST, INTEST, and HIGHZ instructions, enabling board-level interconnect verification, in-system programming, and configuration readback - all documented in Module 1 of DS083.

Can XC2VP40-5FF1152C be configured using SPI flash memory?

No, XC2VP40-5FF1152C does not support native SPI flash configuration. It supports Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 JTAG modes only. SPI boot requires external microcontroller or CPLD-based configuration controller - a capability not integrated into the XC2VP40-5FF1152C silicon.

What is the purpose of the VBATT pin on XC2VP40-5FF1152C?

The VBATT pin on XC2VP40-5FF1152C supplies backup power to retain configuration memory contents during main power loss. When connected to a 3.3 V battery or supercapacitor, it maintains the FPGA's programmed state for up to several hours - enabling fast recovery without reconfiguration. This feature is explicitly defined in DS083 Section "Configuration" and applies only to certain Virtex-II Pro packages including FF1152.

Is XC2VP40-5FF1152C RoHS compliant?

Yes, XC2VP40-5FF1152C is RoHS compliant and available in lead-free packaging. Xilinx confirms Pb-free status for FF1152 flip-chip packages per its "Pb-Free Packaging" documentation (www.xilinx.com/pbfree), with JEDEC-standard solder reflow profiles and material declarations available upon request.