AMD XC2VP40-5FF1152I

Overview

XC2VP40-5FF1152I from Xilinx is a Virtex-II Pro platform FPGA with dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, and up to 12 RocketIO transceivers (configurable per package). It operates at −5 speed grade (300 MHz PowerPC, 2.0 Gb/s transceivers) in Industrial temperature range (−40°C to +100°C), packaged in 1152-pin Flip-Chip Fine-Pitch BGA (FF1152). It targets high-reliability telecom backplane interfaces and embedded signal processing systems.

For engineers reviewing the XC2VP40-5FF1152I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual-processor support, FF1152 package I/O count (804 user I/Os), RocketIO transceiver count (0 in this package variant), DCM count (12), and industrial-grade thermal performance.

Technical Context

This device implements a hardened dual-core PowerPC 405 subsystem with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - all operating at up to 300 MHz in −5 Industrial grade. Its FPGA fabric includes 192 dedicated 18×18-bit signed multipliers and 192 Block SelectRAM+ modules (each 18 Kb), enabling efficient DSP filter and matrix operations.

The FF1152 package variant of XC2VP40 omits bonded-out RocketIO transceivers (0 MGTs), reallocating pins to maximize user I/O count (804) and DCI-enabled SelectIO-Ultra banks. Clock management uses twelve Digital Clock Manager (DCM) modules supporting precise phase shifting (1/256 period resolution), frequency synthesis, and deskew across 16 global clock nets.

Key Specifications

Pinout & Package

XC2VP40-5FF1152I is housed in a 1152-ball Flip-Chip Fine-Pitch BGA (FF1152) with 1.0 mm pitch, 35 mm × 35 mm body size, and Pb-free finish. The package supports 804 user I/Os plus dedicated configuration, JTAG, and power/ground balls. RocketIO transceivers are not bonded out in this variant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-5FF1152I, the −6 variant trades thermal margin for higher clock rates, while the XC2VP50-5FF1152I offers scalable logic and I/O headroom without changing package or thermal profile - both retain identical dual-PPC405 architecture and industrial qualification.

Availability

XC2VP40-5FF1152I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, and avionics systems requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for XC2VP40-5FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed transceivers.

The Virtex-II Pro family, including XC2VP40-5FF1152I, was designed for high-performance embedded systems integrating soft/hard processors, DSP acceleration, and high-speed I/O - targeting applications where ASIC-level integration is needed without mask costs or long lead times.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP40-5FF1152I?

The XC2VP40-5FF1152I is rated for 300 MHz PowerPC 405 operation under Industrial temperature conditions (−40°C to +100°C) at −5 speed grade. This is confirmed in Table 4 of DS083 (v5.0), which specifies 300 MHz for −5 Industrial grade dual-processor devices. The XC2VP40-5FF1152I meets this specification with full timing closure assurance across voltage and process corners.

Does XC2VP40-5FF1152I include RocketIO transceivers, and if so, how many are usable?

No - the XC2VP40-5FF1152I variant has zero bonded RocketIO transceivers. As stated in Table 3 of DS083, the FF1152 package for XC2VP40 provides "804 / 0" user I/Os and RocketIO count, meaning all 12 available transceiver blocks are disabled and pins reassigned to I/O. This configuration maximizes parallel interface capability at the expense of serial connectivity.

What I/O standards are supported by XC2VP40-5FF1152I, and how is termination handled?

XC2VP40-5FF1152I supports 22 single-ended (LVCMOS, SSTL, HSTL, PCI) and 10 differential (LVDS, LVPECL, BLVDS, LDT) I/O standards. Termination is managed via Digitally Controlled Impedance (DCI) for single-ended standards - automatically calibrating on-die series resistors to match line impedance - and on-chip differential termination (50 Ω) for LVDS and related standards, eliminating external resistors.

How many Digital Clock Manager (DCM) modules does XC2VP40-5FF1152I contain, and what are their key timing capabilities?

XC2VP40-5FF1152I contains 12 Digital Clock Manager (DCM) modules. Each supports precise deskew (±150 ps resolution), integer/fractional frequency synthesis, and coarse/fine phase shifting (including 90°, 180°, 270° and 1/256-period increments). These DCMs enable robust clock domain crossing, jitter reduction, and multi-synchronous system design without external PLLs.

Is XC2VP40-5FF1152I suitable for new designs, and what is its lifecycle status?

No - XC2VP40-5FF1152I is marked "Product Not Recommended For New Designs" per DS083 (v5.0) cover page and Module 1. It remains available for legacy support and obsolescence management, but Xilinx recommends Virtex-5 or newer families for new projects. Aetrix Electronics maintains inventory and provides long-term supply planning for existing deployments.