AMD XC2VP40-5FFG1148I

Overview

XC2VP40-5FFG1148I from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, and 3,456 Kb of Block SelectRAM+ memory. It integrates no RocketIO transceivers in the FF1148 flip-chip package (per Table 3), supports up to 804 user I/Os, and operates at -5 speed grade with 1.5 V core voltage. It targets high-reliability embedded computing in industrial control and communications infrastructure.

For engineers reviewing the XC2VP40-5FFG1148I datasheet, pinout, applications, or equivalent options, key selection considerations include confirmed absence of MGTs in this package variant, dual-processor capability, DCM-based clock management, DCI-enabled I/O termination, and compatibility with IEEE 1149.1 boundary-scan and partial reconfiguration workflows.

Technical Context

This device implements a hardened dual-core PowerPC 405 subsystem with 16 KB instruction and 16 KB data caches, MMU support for 1 KB–16 MB page sizes, and dedicated OCM interfaces. Its FPGA fabric includes 192 Digital Clock Manager (DCM) modules supporting precise phase shifting (1/256 period resolution), frequency synthesis, and deskew - all operating on a 0.13 µm nine-layer copper process with 1.5 V VCCINT supply.

The XC2VP40-5FFG1148I uses SelectIO-Ultra I/O banks supporting 22 single-ended (LVCMOS 1.5/1.8/2.5/3.3 V, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, LVPECL), with Digitally Controlled Impedance (DCI) enabling on-die termination without external resistors. All 804 user I/Os are accessible in the FF1148 package, which excludes RocketIO pins per Xilinx DS083 Table 3.

Key Specifications

Pinout & Package

XC2VP40-5FFG1148I is housed in a 1148-pin flip-chip fine-pitch BGA (FF1148) package with 1.0 mm ball pitch, optimized for thermal dissipation and signal integrity in high-density industrial systems. Per DS083 Module 4, this package provides 804 user I/Os plus dedicated configuration, JTAG, and power/ground pins - with RocketIO transceiver pins omitted entirely (Table 3).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processor applications.

Compared with XC2VP40-5FFG1148I, the -6 speed grade alternative offers higher timing margin without layout change, while the XC2VP50-5FFG1152I delivers greater resource headroom at the cost of mechanical incompatibility - making the former ideal for performance tuning and the latter for functional scaling.

Availability

XC2VP40-5FFG1148I is available at Aetrix Electronics and suitable for industrial motion control, medical imaging systems, avionics data concentrators, and secure communications gateways requiring stable component supply across extended product lifecycles.

Supply support for XC2VP40-5FFG1148I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and software tools for high-performance digital system design since 1984.

The Virtex-II Pro family was engineered to integrate hard processor subsystems with high-density programmable logic, targeting embedded applications where real-time processing, I/O flexibility, and long-term availability are critical - such as defense, aerospace, and industrial automation.

FAQ

Does XC2VP40-5FFG1148I include RocketIO transceivers?

No, XC2VP40-5FFG1148I does not include functional RocketIO transceivers. Per Xilinx DS083 Table 3, the FF1148 package variant of XC2VP40 has zero bonded-out RocketIO blocks - all 1148 balls are allocated to user I/O, power, ground, and configuration signals. This configuration maximizes I/O count (804) at the expense of serial transceiver capability.

What is the maximum operating frequency of the PowerPC cores in XC2VP40-5FFG1148I?

The XC2VP40-5FFG1148I is rated for 300 MHz PowerPC operation under Industrial temperature conditions (-40°C to +100°C), as specified in DS083 Table 4 for -5 speed grade. This assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor timing closure.

Can XC2VP40-5FFG1148I perform partial reconfiguration in the field?

Yes, XC2VP40-5FFG1148I supports partial reconfiguration via SelectMAP interface, allowing dynamic replacement of logic modules without resetting the PowerPC cores or external interfaces. This capability is documented in DS083 Module 1 and requires Xilinx ISE 12.4 or earlier toolchain support.

What I/O standards are supported by XC2VP40-5FFG1148I with on-chip termination?

XC2VP40-5FFG1148I supports Digitally Controlled Impedance (DCI) for LVCMOS (1.5/1.8/2.5/3.3 V), HSTL (Class I/II/III/IV), and SSTL (1.8/2.5 V Class I/II) standards - enabling precise 25–75 Ω on-die termination without external resistors. Differential standards like LVDS use fixed on-chip 100 Ω termination.

Is bitstream encryption available on XC2VP40-5FFG1148I?

Yes, XC2VP40-5FFG1148I includes an on-chip Triple-DES decryptor that secures configuration bitstreams. One or two DES key sets can be programmed into the device, preventing unauthorized readback or cloning - a feature confirmed in DS083 Module 1 section on configuration security.