AMD XC2VP40-5FFG1152C

Overview

XC2VP40-5FFG1152C from Xilinx is a Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, 3,456 Kb of Block SelectRAM+ memory, and up to 12 RocketIO multi-gigabit transceivers - configured here with 0 transceivers bonded out in the FF1152 flip-chip BGA package. It targets high-performance embedded computing, telecom line-card processing, and protocol-aware reconfigurable systems requiring deterministic real-time control and hardware acceleration.

For engineers reviewing the XC2VP40-5FFG1152C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, confirmed I/O count (804 user I/Os), DCM timing parameters, DCI-enabled SelectIO-Ultra interface behavior, and validated alternatives for legacy system sustainment and redesign.

Technical Context

The XC2VP40-5FFG1152C implements a dual-core PowerPC 405 subsystem operating at up to 300 MHz (−5 speed grade), each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface. Its FPGA fabric includes 192 Digital Clock Manager (DCM) modules supporting precise phase shifting (1/256 period resolution), frequency synthesis, and clock deskew across 16 global clock nets.

This device uses a 0.13 µm nine-layer copper process with 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and programmable I/O supply (VCCO). The FF1152 package provides 1152 balls, 804 user I/Os, and zero bonded RocketIO transceivers - enabling maximum I/O density for parallel bus interfacing, DDR memory controllers, and high-pin-count peripheral bridging without serial transceiver overhead.

Key Specifications

Pinout & Package

XC2VP40-5FFG1152C is housed in a 1152-ball Flip-Chip Fine-Pitch BGA (FF1152) package with 1.0 mm pitch, 35 mm × 35 mm body size, and no bonded RocketIO transceiver pins - maximizing available I/O count to 804 user-accessible signals. Thermal and power delivery are optimized via dedicated VCCINT/VCCAUX/VCCO ball arrays and thermal vias beneath the die.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processor applications.

Compared with XC2VP40-5FFG1152C, the −6 variant trades thermal headroom for higher deterministic CPU frequency, while the XC2VP50-5FFG1152C retains identical footprint and I/O but adds 22% more logic and memory resources - making it suitable for incremental feature expansion without board redesign.

Availability

XC2VP40-5FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial control, medical imaging, and defense electronics requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP40-5FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and defined the platform FPGA category with integrated processors, transceivers, and hardened IP.

The Virtex-II Pro family - including XC2VP40-5FFG1152C - was engineered for high-reliability embedded systems demanding both programmable logic density and deterministic software execution in a single chip.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP40-5FFG1152C?

The XC2VP40-5FFG1152C is rated for 300 MHz PowerPC 405 operation under commercial temperature conditions (0°C to 85°C) per DS083 v5.0. This speed grade (−5) applies to both cores simultaneously and assumes proper decoupling, thermal management, and VCCINT regulation at 1.5 V ±3%. Higher frequencies require the −6 or −7 variants.

Does XC2VP40-5FFG1152C include RocketIO transceivers, and if so, how many are functional?

No - the XC2VP40-5FFG1152C uses the FF1152 package variant with zero RocketIO transceivers bonded out, as confirmed in Table 3 of DS083. All 1152 balls are allocated to power, ground, configuration, JTAG, and 804 user I/Os. RocketIO capability exists in the silicon but is not electrically accessible in this specific ordering option.

Can XC2VP40-5FFG1152C be configured via JTAG, and what standards does it support?

Yes, XC2VP40-5FFG1152C supports IEEE 1149.1 boundary-scan testing and IEEE 1532 configuration through its dedicated TCK/TMS/TDI/TDO pins. It implements BYPASS, PRELOAD, SAMPLE, IDCODE, USERCODE, EXTEST, INTEST, and HIGHZ instructions - enabling full visibility into I/O states and secure bitstream loading without requiring external configuration PROMs.

What memory resources are available on-chip for the PowerPC cores in XC2VP40-5FFG1152C?

Each PowerPC 405 core in XC2VP40-5FFG1152C has 16 KB two-way set-associative instruction cache and 16 KB two-way set-associative data cache. Additionally, the device provides 3,456 Kb of Block SelectRAM+ memory (192 × 18 Kb blocks), accessible by both PPC cores via the OCM controller for low-latency scratchpad or buffer memory.

Is XC2VP40-5FFG1152C supported by modern Xilinx design tools like Vivado?

No - XC2VP40-5FFG1152C is a Virtex-II Pro device requiring Xilinx ISE 14.7 or earlier toolchains. Vivado does not support this architecture. Legacy ISE WebPACK editions remain available for download from AMD's archived tools portal, and ChipScope Pro Analyzer is required for in-system debug of both FPGA logic and PPC405 execution.