AMD XC2VP40-5FFG1152I

Overview

XC2VP40-5FFG1152I from Xilinx is a Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, 3,456 Kb of Block SelectRAM+ memory, and up to 12 RocketIO multi-gigabit transceivers (configurable per package). It operates at -5 speed grade with industrial temperature range (–40°C to +100°C) and uses a 1.5V core supply. It targets high-performance embedded computing in telecom backplanes and protocol-aware networking systems.

For engineers reviewing the XC2VP40-5FFG1152I datasheet, pinout, applications, or equivalent options, key selection considerations include confirmed RocketIO channel count (0 in FF1152 package), dual PowerPC 405 clocking constraints at 300 MHz (–5I grade), DCM phase-shifting resolution (1/256 period), and FF1152 flip-chip BGA mechanical compatibility with 1152-ball 1.0 mm pitch layout.

Technical Context

This device implements a heterogeneous architecture integrating hard IP blocks-two PowerPC 405 cores with 16 KB instruction and data caches, MMU, and OCM interface-alongside programmable fabric including CLBs with dual 4-LUTs/slice, distributed RAM, and 18×18 multipliers. Its routing uses Active Interconnect Technology with hierarchical segmented resources and predictable delay independent of fanout.

The XC2VP40-5FFG1152I variant uses the FF1152 flip-chip BGA package with no bonded-out RocketIO transceivers (per Table 3), allocating all I/O pins to SelectIO-Ultra banks supporting LVDS, SSTL, HSTL, and PCI-X. Its Digital Clock Managers provide integer/fractional frequency synthesis, ±180° coarse phase shift, and fine-grained 1/256-period adjustment per output clock.

Key Specifications

Pinout & Package

XC2VP40-5FFG1152I uses the FF1152 flip-chip fine-pitch BGA package: 1152 balls, 1.0 mm pitch, 35 mm × 35 mm body size, RoHS-compliant, with no bonded-out RocketIO transceivers. All I/Os are routed to SelectIO-Ultra banks supporting programmable drive strength (2–24 mA), DCI termination, and differential standards.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-5FFG1152I, the -6 variant trades industrial temperature support and marginal timing headroom for lower cost, while the XC2VP50-5FFG1152I delivers scalable capacity within identical mechanical and thermal constraints-enabling design reuse without PCB revision.

Availability

XC2VP40-5FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, avionics data concentrators, and industrial video processing systems requiring stable component supply across extended lifecycle programs.

Supply support for XC2VP40-5FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family for high-end system-on-chip applications demanding performance, integration, and reliability.

The Virtex-II Pro product line was engineered to unify programmable logic with embedded processors and high-speed serial I/O-targeting communications infrastructure, defense systems, and high-performance computing where hardware-software co-design is essential.

FAQ

Does XC2VP40-5FFG1152I include RocketIO transceivers?

No, the XC2VP40-5FFG1152I uses the FF1152 flip-chip package with zero bonded-out RocketIO transceivers, as confirmed in Table 3 of DS083. All 1152 balls are allocated to power, ground, configuration, JTAG, and 804 user I/Os. RocketIO capability is only available in FG/FF packages with MGT pins explicitly enabled-this variant prioritizes maximum I/O count and embedded processor throughput over serial transceiver integration.

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP40-5FFG1152I?

The XC2VP40-5FFG1152I is rated for 300 MHz PowerPC 405 operation under industrial conditions (–40°C to +100°C), per Table 4 in DS083. This is the guaranteed maximum frequency for dual-processor configurations at -5 speed grade. Exceeding this requires adherence to XAPP755 guidelines, which are not applicable to the -5I grade due to thermal and voltage constraints.

Can XC2VP40-5FFG1152I support DDR SDRAM interfaces?

Yes, XC2VP40-5FFG1152I supports DDR SDRAM through its SelectIO-Ultra I/O banks with built-in DDR input and output registers, as documented in Module 1. It implements source-synchronous capture using DCM-generated phase-aligned clocks and supports SSTL-2 and SSTL-18 standards. Timing closure requires careful PCB layout and DCM configuration per DS083 switching characteristics.

Is XC2VP40-5FFG1152I pin-compatible with other Virtex-II Pro devices in FF1152 package?

XC2VP40-5FFG1152I shares the FF1152 mechanical footprint and ball map with XC2VP50-5FFG1152I and XC2VP100-5FFG1152I, but electrical compatibility depends on I/O bank voltage assignments and configuration pin usage. While ball-to-ball mapping is identical, higher-density variants may assign additional power/ground balls-requiring schematic review before drop-in replacement.

What configuration modes does XC2VP40-5FFG1152I support?

XC2VP40-5FFG1152I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by M0–M2 pins at PROG_B assertion. Master SelectMAP enables fast parallel loading from external PROM, while boundary-scan allows in-circuit programming and verification without dedicated configuration hardware.