Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

AMD XC2VP40-5FG676C

Part No.:
XC2VP40-5FG676C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BGA
Datasheet:
AetrixXC2VP40-5FG676C.pdf
Description:
IC FPGA 416 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,895

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

XC2VP40-5FG676C from Xilinx is a Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, 3,456 Kb of Block SelectRAM+ memory, and up to 12 RocketIO multi-gigabit transceivers - deployed in high-throughput telecom and networking systems requiring integrated processing and serial I/O.

For engineers reviewing the XC2VP40-5FG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, package-mapped I/O counts, DCM timing constraints, RocketIO transceiver baud rate limits, and PowerPC 405 cache/MMU configuration details essential for legacy system sustainment and requalification.

Technical Context

The XC2VP40-5FG676C implements a dual-processor FPGA architecture with two independent PowerPC 405 cores, each with 16 KB instruction and 16 KB data caches, MMU support, and CoreConnect bus interface - enabling tightly coupled hardware/software co-design. Its fabric includes 192 dedicated 18×18-bit signed multipliers and 192 Block SelectRAM+ modules (18 Kb each), supporting high-performance DSP and packet-processing pipelines.

This device uses a 0.13 µm nine-layer copper process with 1.5 V core supply (VCCINT), 2.5 V auxiliary supply (VCCAUX), and programmable I/O banks (VCCO) supporting LVDS, SSTL, HSTL, and PCI-X standards. The -5 speed grade guarantees 300 MHz PowerPC operation and 2.0 Gb/s RocketIO transceiver performance in wire-bond FG676 packaging.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells 43,632 - determines maximum combinational/sequential logic capacity for custom IP integration
PowerPC Blocks 2 × PPC405 - enables dual-core real-time control, boot-from-Flash, and hardware-accelerated firmware execution
RocketIO Transceivers Up to 12 - supports 2.0 Gb/s full-duplex serial links per channel; no RocketIO X capability in this variant
Block SelectRAM+ 3,456 Kb (192 × 18 Kb) - provides true dual-port embedded memory for packet buffering and lookup tables
Digital Clock Managers 8 × DCM - delivers deskewed, multiplied, divided, and phase-shifted clocks with ±100 ps jitter tolerance
User I/O Pads 692 - configurable across 22 single-ended and 10 differential standards including LVDS and PCI-X
Speed Grade -5 - specifies guaranteed 300 MHz PowerPC clocking and 2.0 Gb/s RocketIO operation at commercial temperature range

Pinout & Package

XC2VP40-5FG676C is packaged in a 676-ball Fine-Pitch Ball Grid Array (FG676) with 1.0 mm pitch, wire-bond interconnect, and Pb-free option (FGG676). This package supports 692 user I/Os plus dedicated configuration, JTAG, and power pins - optimized for thermal dissipation and signal integrity in dense backplane applications.

Pin/Terminal Circuit Role Design Meaning
CCLK Configuration Clock Input Drives internal configuration shift register during master/slave serial or SelectMAP programming
DONE Configuration Status Output Open-drain signal indicating successful bitstream loading and initialization completion
M0–M2 Mode Selection Inputs Set configuration mode (e.g., slave-serial, master-SelectMAP) at power-up
TCK/TMS/TDI/TDO JTAG Boundary-Scan Interface Enables IEEE 1149.1-compliant testing, debug access, and partial reconfiguration
DXP/DXN Differential Clock Input Pair Accepts LVDS or LVPECL reference clocks for DCM input or RocketIO reference clocking
VCCINT Core Supply Voltage 1.5 V ±3% supply powering CLBs, DCMs, and internal routing - requires low-noise regulation
VCCAUX Auxiliary Supply Voltage 2.5 V ±5% supply for configuration logic, JTAG, and DCM analog circuitry
VCCO_0–VCCO_n I/O Bank Supply Programmable per-bank voltage (1.5 V to 3.3 V) setting I/O standard compliance and drive strength

Key Features

Feature Design Value
Dual PowerPC 405 Cores Each with 16 KB instruction + 16 KB data cache, MMU, and CoreConnect interface - enables SMP-aware firmware and hardware offload
Digitally Controlled Impedance (DCI) On-chip series/parallel termination for LVCMOS/LVTTL I/Os - eliminates external resistors and improves signal integrity
SelectIO-Ultra Technology Supports 22 single-ended and 10 differential I/O standards including 840 Mb/s LVDS and PCI-X 133 MHz - simplifies mixed-voltage board design
Active Interconnect Routing Fourth-generation segmented matrix with predictable delay independent of fanout - ensures timing closure in high-speed designs
Triple-DES Bitstream Encryption On-chip decryptor with one or two key sets - protects intellectual property against unauthorized readback or cloning

Applications

Telecom Line Card Network Processor Accelerator

Use Scenario: High-density OC-48/STM-16 line interface card aggregating multiple TDM streams into packetized payloads.

IC Role / Device Role / Timing Role: FPGA fabric handles HDLC framing and CRC generation; PowerPC cores run control-plane software; RocketIO transceivers serialize/deserialize SONET/SDH data.

Use Value: Integrated transceivers eliminate external SERDES chips; dual PPC405 enables parallel protocol stack handling and dynamic bandwidth allocation.

Use Scenario: Offloading packet classification, deep packet inspection, and QoS scheduling from main CPU in enterprise routers.

IC Role / Device Role / Timing Role: Configurable logic implements TCAM-like match engines; Block RAM stores rule tables; DCMs synchronize DDR interfaces to external memory.

Use Value: 3,456 Kb on-chip RAM reduces external memory latency; 192 multipliers accelerate encryption and statistical analysis without external coprocessors.

Medical Imaging Backend Avionics Data Concentrator

Use Scenario: Real-time reconstruction pipeline in MRI/PET systems processing raw sensor data from ADC arrays.

IC Role / Device Role / Timing Role: CLBs implement FIR filters and FFT stages; PowerPC manages DICOM export and UI; SelectIO-Ultra interfaces to high-speed ADCs and display controllers.

Use Value: 43,632 logic cells support concurrent multi-algorithm execution; DCI-controlled I/O ensures clean sampling clock distribution to 16-bit ADCs.

Use Scenario: ARINC 664 (AFDX) end-system node consolidating sensor inputs and actuator commands across redundant networks.

IC Role / Device Role / Timing Role: RocketIO transceivers handle deterministic AFDX traffic; PowerPC executes DO-254-compliant health monitoring; DCMs generate jitter-free 100 MHz time-triggered clocks.

Use Value: Dual PPC405 allows separation of safety-critical and non-critical partitions; 8 DCMs provide independent clock domains for each AFDX port and CPU subsystem.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2VP50-5FF1152C Higher logic density (53,136 cells), 16 RocketIO transceivers, flip-chip FF1152 package (1152 balls), no DCI support Required for designs needing >692 I/Os or >12 transceivers; unsuitable where wire-bond reliability or DCI termination is mandatory Select when migrating to higher-bandwidth backplanes or adding additional protocol stacks beyond XC2VP40 capacity
XC4VLX60-11FF668C Virtex-4 architecture; 60K logic cells; 24 RocketIO GTPs (3.75 Gb/s); no embedded PowerPC; 668-pin flip-chip package Targets newer designs prioritizing transceiver count and speed over hard processor integration; lacks PPC405 for legacy firmware reuse Choose for green-field projects requiring higher serial bandwidth and modern toolchain support, but not for PPC405 code porting

Compared with XC2VP50-5FF1152C and XC4VLX60-11FF668C, the XC2VP40-5FG676C uniquely balances dual-processor capability, 12-channel serial I/O, and wire-bond package robustness - making it irreplaceable for sustaining deployed telecom and avionics systems where PPC405 firmware, FG676 footprint compatibility, and DCI-controlled I/O are design-critical.

Availability

XC2VP40-5FG676C is available at Aetrix Electronics and suitable for telecom infrastructure, network security appliances, and medical imaging equipment requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP40-5FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-end FPGAs for demanding system-on-chip applications.

The Virtex-II Pro product line was engineered to integrate hard processor cores and high-speed serial transceivers into a single FPGA fabric - targeting embedded computing, communications infrastructure, and real-time signal processing markets.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP40-5FG676C?

The XC2VP40-5FG676C -5 speed grade guarantees 300 MHz operation for both PowerPC 405 cores under commercial temperature conditions. This rating is confirmed in DS083 Table 4 and applies only when using the FG676 wire-bond package with proper VCCINT regulation and thermal management. Exceeding 300 MHz requires derating or migration to -6/-7 grades, which are not offered in FG676 for this device.

Does XC2VP40-5FG676C support RocketIO X transceivers?

No, XC2VP40-5FG676C does not support RocketIO X transceivers. According to DS083 Table 1 and Module 1, only XC2VPX20 and XC2VPX70 devices include RocketIO X cores. The XC2VP40 supports up to 12 standard RocketIO transceivers with a maximum baud rate of 2.0 Gb/s in the -5 speed grade, as specified in Table 4 for wire-bond packages.

How many Block SelectRAM+ modules are available in XC2VP40-5FG676C, and what is their total capacity?

The XC2VP40-5FG676C contains 192 Block SelectRAM+ modules, each providing 18 Kb of true dual-port RAM, for a total capacity of 3,456 Kb. This is explicitly stated in Table 1 of DS083 and enables large on-chip buffers for packet processing, video frame storage, or coefficient tables without external memory latency.

What I/O standards are supported by XC2VP40-5FG676C's SelectIO-Ultra technology?

XC2VP40-5FG676C supports 22 single-ended standards (including LVTTL, LVCMOS at 1.5 V/1.8 V/2.5 V/3.3 V, PCI-X, GTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LDT, LVPECL). These are documented in Module 1 Section "SelectIO-Ultra Technology" and validated for use with its 692-user-I/O FG676 package configuration.

Is XC2VP40-5FG676C suitable for new designs?

No - XC2VP40-5FG676C is marked "Product Not Recommended For New Designs" in DS083 v5.0. It remains available for legacy system support, repair, and obsolescence mitigation, but Xilinx recommends Virtex-4, Virtex-5, or newer families for new development due to enhanced performance, lower power, and ongoing toolchain support.

XC2VP40-5FG676C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II Pro
Package/Case:
676-BGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
4848
Number of Logic Elements/Cells:
43632
Total RAM Bits:
3538944
Number of I/O:
416
Number of Gates:
-
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FBGA (27x27)

XC2VP40-5FG676C FAQ

1.How can I place an order for XC2VP40-5FG676C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2VP40-5FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2VP40-5FG676C reliable?

The price and inventory of XC2VP40-5FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP40-5FG676C is usually 5 days.

3.What payment methods are accepted for XC2VP40-5FG676C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP40-5FG676C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2VP40-5FG676C?

XC2VP40-5FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2VP40-5FG676C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2VP40-5FG676C?

For technical support, including XC2VP40-5FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP40-5FG676C requirements.

6.How does Aetrix verify that XC2VP40-5FG676C is sourced from the original manufacturer or authorized distributors?

All XC2VP40-5FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP40-5FG676C meets industry standards.

7.What is the process for return or replacement of XC2VP40-5FG676C?

All XC2VP40-5FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP40-5FG676C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2VP40-5FG676C part is unused and in its original packaging.

Return procedure for XC2VP40-5FG676C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2VP40-5FG676C Tags

  • XC2VP40-5FG676C
  • XC2VP40-5FG676C PDF
  • XC2VP40-5FG676C Datasheet
  • XC2VP40-5FG676C Specifications
  • XC2VP40-5FG676C Images
  • AMD
  • AMD XC2VP40-5FG676C
  • Buy XC2VP40-5FG676C
  • XC2VP40-5FG676C Price
  • XC2VP40-5FG676C Distributor
  • XC2VP40-5FG676C Supplier
  • XC2VP40-5FG676C Wholesale
Related Products
ICE40LP384-SG32
ICE40LP384-SG32

Lattice Semiconductor Corporation

ICE40UL640-CM36AI
ICE40UL640-CM36AI

Lattice Semiconductor Corporation

ICE40UL1K-CM36AI
ICE40UL1K-CM36AI

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG32C
LCMXO2-256HC-4SG32C

Lattice Semiconductor Corporation

10M02DCV36C8G
10M02DCV36C8G

Intel

LCMXO2-256HC-4SG32I
LCMXO2-256HC-4SG32I

Lattice Semiconductor Corporation

ICE5LP1K-SG48ITR
ICE5LP1K-SG48ITR

Lattice Semiconductor Corporation

ICE40LP1K-CM36
ICE40LP1K-CM36

Lattice Semiconductor Corporation

LCMXO2-256ZE-1SG32I
LCMXO2-256ZE-1SG32I

Lattice Semiconductor Corporation

LCMXO2-256HC-4SG48I
LCMXO2-256HC-4SG48I

Lattice Semiconductor Corporation

ICE40LP1K-CM81
ICE40LP1K-CM81

Lattice Semiconductor Corporation

T20W80I4
T20W80I4

Efinix, Inc.

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER