AMD XC2VP40-5FG676I

Overview

XC2VP40-5FG676I from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, and up to 12 RocketIO multi-gigabit transceivers - configured for high-throughput telecom and networking systems requiring embedded processing and serial interconnect. It operates at -5 speed grade with industrial temperature range (–40°C to +100°C) in a 676-pin fine-pitch wire-bond BGA package.

For engineers reviewing the XC2VP40-5FG676I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O configuration constraints, DCM timing parameters, RocketIO transceiver baud rate limits, and PowerPC 405 cache/MMU behavior specific to the FG676 package and -5 speed grade.

Technical Context

The XC2VP40-5FG676I implements a hybrid architecture integrating two independent PowerPC 405 cores (each with 16 KB instruction and 16 KB data caches, MMU, and OCM interface), programmable FPGA fabric with 192 Block SelectRAM+ modules (18 Kb each), and up to 12 RocketIO transceivers supporting 2.5 Gb/s (wire-bond FG676) or 3.125 Gb/s (flip-chip variants) full-duplex operation. Its DCMs provide phase-shifting resolution of 1/256 clock period and integer/fractional frequency synthesis.

Configurable I/O supports 22 single-ended (LVCMOS 1.5V–3.3V, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, LVPECL), with Digitally Controlled Impedance (DCI) enabling on-die termination per pin. The FG676 package provides 692 user I/Os - excluding 15 dedicated configuration pins and transceiver pins - and uses 1.0 mm pitch, 26×26 mm wire-bond BGA construction.

Key Specifications

Pinout & Package

XC2VP40-5FG676I uses the FG676 wire-bond fine-pitch BGA package: 26 mm × 26 mm, 1.0 mm ball pitch, 676 balls. Package includes 692 user I/O pads (excluding 15 configuration pins and transceiver pins), VCCINT (1.5 V), VCCAUX (2.5 V), and VCCO banks per I/O standard.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP40-5FG676I, the -6 speed grade offers higher guaranteed clock frequencies at same voltage/temperature, while the XC2VP50-5FF1152I trades transceivers for greater logic capacity and I/O count - making it suitable for high-pin-count parallel bus architectures rather than serial backplanes.

Availability

XC2VP40-5FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and avionics applications requiring stable component supply, long-term lifecycle support, and traceable sourcing for legacy FPGA-based systems.

Supply support for XC2VP40-5FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, SoCs, and adaptive compute acceleration platforms since 1984.

The Virtex-II Pro family - including XC2VP40-5FG676I - was engineered for high-performance embedded systems integrating hard processor cores, high-speed serial I/O, and flexible logic fabric, targeting telecom, defense, and scientific instrumentation markets.

FAQ

What is the maximum guaranteed RocketIO transceiver speed for XC2VP40-5FG676I?

The XC2VP40-5FG676I supports up to 2.5 Gb/s per RocketIO transceiver channel when used in the FG676 wire-bond package. This is confirmed in Table 4 of DS083 (v5.0), which specifies 2.5 Gb/s for RocketIO transceivers in wire-bond packages at -5 speed grade. RocketIO X capability (6.25 Gb/s) is exclusive to XC2VPX-series devices and not present in XC2VP40-5FG676I.

Does XC2VP40-5FG676I include PowerPC processor cores, and how many?

Yes, XC2VP40-5FG676I integrates two IBM PowerPC 405 RISC processor cores, as stated in Table 1 of DS083. Each core features 16 KB instruction cache, 16 KB data cache, MMU with 64-entry TLB, and OCM interface - enabling symmetric or asymmetric multiprocessing in embedded applications.

What I/O standards does XC2VP40-5FG676I support with on-chip termination?

XC2VP40-5FG676I supports Digitally Controlled Impedance (DCI) for single-ended standards including LVCMOS 1.5V/1.8V/2.5V/3.3V, SSTL-2, and HSTL Class I–IV. For differential I/O, on-chip 50 Ω termination is available for LVDS, BLVDS, ULVDS, and LDT - all confirmed in Module 1, Section "SelectIO-Ultra Technology" of DS083.

Is XC2VP40-5FG676I pin-compatible with other Virtex-II Pro devices in FG676 package?

No - XC2VP40-5FG676I is not pin-compatible with other Virtex-II Pro devices in the FG676 package. While package footprint is identical, I/O pin assignments, power pin distribution, and transceiver pin mapping differ across device densities. Pinout tables in Module 4 of DS083 confirm unique ball definitions per device, requiring separate PCB layout for each part number.

What configuration modes are supported by XC2VP40-5FG676I?

XC2VP40-5FG676I supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. These are documented in the "Configuration" section of Module 1. All modes use the same 15 dedicated configuration pins (CCLK, DONE, M0–M2, PROG_B, etc.), with mode selected via M0–M2 states at PROG_B deassertion.