AMD XC2VP40-5FGG676C

Overview

XC2VP40-5FGG676C from Xilinx is a Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, 3,456 Kb of Block SelectRAM+ memory, and up to 12 RocketIO multi-gigabit transceivers - configured here in the FGG676 wire-bond fine-pitch BGA package with 676 pins and -5 speed grade. It targets high-performance telecom, networking, and video processing systems requiring integrated processing, high-speed serial I/O, and reconfigurable logic.

For engineers reviewing the XC2VP40-5FGG676C datasheet, pinout, applications, or equivalent options, key selection considerations include its dual PowerPC 405 cores (300 MHz at -5 grade), RocketIO transceiver count and baud rate (2.5 Gb/s for wire-bond), DCM-based clock management, SelectIO-Ultra I/O support (LVDS, SSTL, HSTL), and 1.5V core voltage compliance.

Technical Context

The XC2VP40-5FGG676C implements a hybrid architecture combining hard IP (dual PowerPC 405 cores with 16 KB instruction/data caches and MMU) with programmable fabric (CLBs, Block RAM, multipliers). Its RocketIO transceivers operate at up to 2.5 Gb/s in this wire-bond configuration, supporting Fibre Channel, Gigabit Ethernet, and XAUI protocols via 8B/10B encoding and channel bonding.

Digital Clock Manager (DCM) modules provide precise clock deskew, integer/fractional frequency synthesis, and ±1/256-cycle phase shifting. The device uses active interconnect routing with hierarchical switch matrices and supports partial reconfiguration, bitstream encryption (triple-DES), and IEEE 1149.1 boundary-scan testing.

Key Specifications

Pinout & Package

XC2VP40-5FGG676C is housed in a 676-ball wire-bond fine-pitch BGA (FGG676) package with 1.0 mm pitch, 26 mm × 26 mm body size, and Pb-free construction. It supports 804 user I/Os (excluding control, power, and transceiver pins) and integrates on-die termination (DCI) for single-ended standards and on-chip differential termination for LVDS/ULVDS.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-5FGG676C, the -6 speed grade offers improved timing headroom for PowerPC and fabric logic but identical transceiver capability; the XC2VP50-5FF1136C trades transceivers for significantly more I/O and logic resources in a larger flip-chip package - making it appropriate for parallel-data-centric rather than serial-interconnect-focused designs.

Availability

XC2VP40-5FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging equipment, and avionics subsystems requiring stable component supply across extended product lifecycles.

Supply support for XC2VP40-5FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed transceivers.

The Virtex-II Pro family was designed to integrate hard processor subsystems and multi-gigabit serial I/O into high-density FPGAs for bandwidth-constrained, compute-intensive applications in communications and defense.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP40-5FGG676C?

The XC2VP40-5FGG676C PowerPC 405 cores operate at up to 300 MHz under the -5 speed grade specification. This rating applies across commercial temperature range (0°C to 85°C) with proper 1.5 V VCCINT supply and cooling. Higher frequencies require the -6 or -7 speed grades, and dual-core operation at 300 MHz is fully supported per DS083 timing models. The XC2VP40-5FGG676C datasheet confirms this limit in Table 4 of Module 1.

Does XC2VP40-5FGG676C include on-chip termination for differential I/O standards?

Yes, XC2VP40-5FGG676C provides on-chip differential termination for LVDS, Extended LVDS, ULVDS, and LDT standards. Each differential pair uses two adjacent I/O pads, and internal 100 Ω termination is configurable per bank. This eliminates external resistors for point-to-point links and reduces PCB routing complexity. Termination control is managed through configuration bits and DCI logic, as documented in the Virtex-II Pro SelectIO-Ultra section of DS083.

How many RocketIO transceivers are active in XC2VP40-5FGG676C, and what is their maximum data rate?

XC2VP40-5FGG676C has 12 RocketIO transceivers enabled in the FGG676 wire-bond package. Their maximum data rate is 2.5 Gb/s per channel, compliant with Fibre Channel, Gigabit Ethernet, and XAUI standards. This rate is fixed for wire-bond packages per DS083 Table 4; RocketIO X variants (e.g., XC2VPX20) offer higher rates but are not implemented in this specific part. The XC2VP40-5FGG676C pinout allocates dedicated transceiver banks with dedicated reference clocks and power rails.

Can XC2VP40-5FGG676C perform partial reconfiguration, and what tools support it?

Yes, XC2VP40-5FGG676C supports partial reconfiguration using Xilinx ISE Design Suite 12.x and later. This allows dynamic swapping of logic modules (e.g., modems, codecs) without resetting the PowerPC cores or disrupting active I/O. Implementation requires modular design partitioning, configuration port access, and use of the ICAP (Internal Configuration Access Port). The XC2VP40-5FGG676C functional description confirms ICAP availability and partial bitstream loading capability in Module 2 of DS083.

Is triple-DES bitstream encryption available on XC2VP40-5FGG676C, and how is it enabled?

Yes, XC2VP40-5FGG676C includes an on-chip triple-DES decryptor for securing configuration bitstreams. Encryption is enabled during bitstream generation in Xilinx ISE using the "Enable Bitstream Encryption" option and loading of one or two 168-bit DES keys into the device's eFUSE or external PROM. The XC2VP40-5FGG676C must be configured in master mode with encrypted bitstream; unencrypted reads are blocked. This feature is specified in the Configuration section of DS083 Module 1.