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AMD XC2VP40-6FF1152C

Part No.:
XC2VP40-6FF1152C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1152-BBGA, FCBGA
Datasheet:
AetrixXC2VP40-6FF1152C.pdf
Description:
IC FPGA 692 I/O 1152FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,040

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Product details

Overview

XC2VP40-6FF1152C from Xilinx is a Virtex-II Pro platform FPGA with dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18 multipliers, and 804 user I/Os in an 1152-pin flip-chip BGA package. It delivers up to 350 MHz processor operation and supports 3.125 Gb/s RocketIO transceivers (8 or 12 channels depending on configuration), targeting high-performance telecom, networking, and video processing systems.

For engineers reviewing the XC2VP40-6FF1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor integration, embedded SERDES bandwidth, DCM-based clock management, SelectIO-Ultra I/O flexibility, and compatibility with legacy Xilinx design flows and IP cores.

Technical Context

The XC2VP40-6FF1152C implements a hardened dual PowerPC 405 core architecture with 16 KB instruction and 16 KB data caches, MMU support, and dedicated OCM interfaces - enabling real-time embedded processing alongside programmable logic. Its FPGA fabric includes 192 Block SelectRAM+ modules (each 18 Kb), 192 dedicated 18×18 multipliers, and twelve Digital Clock Managers for precise phase-shifting and frequency synthesis.

This device uses Active Interconnect routing with hierarchical segmented resources, supporting predictable timing independent of fanout. The FF1152 package provides 804 user I/Os with SelectIO-Ultra support for LVDS (840 Mb/s), SSTL/HSTL, PCI-X, and digitally controlled impedance (DCI) termination - all operating from 1.5 V core, 2.5 V auxiliary, and configurable 1.5–3.3 V I/O supplies.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells43,632 - defines maximum combinational/sequential logic capacity for custom RTL or IP integration
PowerPC Cores2 × PPC405 - enables symmetric multiprocessing or asymmetric control + signal processing partitioning
Block RAM804 Kb distributed + 3,456 Kb block SelectRAM+ - supports large on-chip buffers, FIFOs, and memory-mapped peripherals
Multipliers192 × 18-bit × 18-bit - accelerates DSP filtering, FFT, and matrix operations without LUT resource consumption
Digital Clock Managers12 × DCM - provides jitter-tolerant clock deskew, integer/fractional frequency synthesis, and 1/256-cycle phase resolution
User I/O Count804 - enables high-pin-count interface consolidation (e.g., DDR2 memory, multiple GigE PHYs, parallel video buses)
Transceiver Channels0 or 12 RocketIO - FF1152 package supports 12-channel 3.125 Gb/s SERDES or zero-transceiver mode for I/O-maximized designs
Process Technology0.13 µm copper CMOS - balances performance, power, and density for mid-2000s high-end embedded systems

Pinout & Package

XC2VP40-6FF1152C is housed in a 35 mm × 35 mm, 1.0 mm pitch, flip-chip fine-pitch BGA (FF1152) package with 1152 balls. Of these, 804 are user-configurable I/Os; remaining balls allocate to power (VCCINT, VCCAUX, VCCO), ground, configuration (M0–M2, CCLK, DONE, PROG_B), JTAG (TCK/TMS/TDI/TDO), and reserved/HSWAP_EN/RSVD pins. RocketIO transceiver pins are not bonded out in this package variant.

Pin/Terminal Circuit Role Design Meaning
VCCINTCore power supply1.5 V ±3% supply for FPGA fabric and PowerPC logic; requires low-noise regulation and local decoupling
VCCAUXAuxiliary power supply2.5 V ±3% supply for configuration logic, DCMs, SelectIO drivers, and JTAG circuitry
VCCO_0–VCCO_nI/O bank powerConfigurable 1.5 V / 1.8 V / 2.5 V / 3.3 V per bank; sets voltage standard for associated I/Os
M0–M2Configuration mode select3-bit strap defining startup mode (e.g., Master SelectMAP, Slave Serial); latched at power-on reset
CCLKConfiguration clock inputDrives internal configuration state machine; frequency ≤ 50 MHz in Master mode
DONEConfiguration status outputOpen-drain active-high signal indicating successful bitstream loading and initialization
PROG_BProgram initiationActive-low asynchronous reset that clears configuration memory and restarts loading sequence
TCK/TMS/TDI/TDOJTAG boundary-scan interfaceIEEE 1149.1-compliant test and debug access; supports programming, readback, and ChipScope ILA control

Key Features

Feature Design Value
Dual PowerPC 405 coresEnables tightly coupled software-defined hardware acceleration - e.g., one core running Linux for control, second executing real-time DSP firmware
SelectIO-Ultra with DCIEliminates external termination resistors for single-ended standards (LVCMOS, SSTL, HSTL), reducing BOM count and PCB area
12 × Digital Clock Manager (DCM)Allows independent clock domain management per subsystem - e.g., 100 MHz for Ethernet MAC, 148.5 MHz for HDMI video, 200 MHz for DDR2 controller
192 × 18×18 multipliersSupports concurrent execution of >100 MAC operations per clock cycle - critical for radar beamforming or channelized modems
Block SelectRAM+ (18 Kb × 192)Provides true dual-port RAM with three read-during-write modes - ideal for ping-pong buffering in video frame pipelines or packet reordering engines
SRAM-based in-system configurationEnables field-upgradable functionality via JTAG or serial PROM; supports partial reconfiguration for dynamic function swapping

Applications

Telecom Line Card High-Speed Video Processing

Use Scenario: Aggregating and grooming OC-48/STM-16 traffic across multiple TDM and packet interfaces in central office equipment.

IC Role / Device Role / Timing Role: XC2VP40-6FF1152C serves as the system-on-chip fabric - integrating RocketIO transceivers for SONET framer interfacing, PowerPC cores for OAM&P processing, and CLBs for HDLC/PPP protocol offload.

Use Value: Eliminates discrete framer, microcontroller, and glue logic; reduces latency by implementing time-critical framing logic in deterministic FPGA fabric.

Use Scenario: Real-time 1080p60 video scaling, color space conversion, and overlay compositing in broadcast production switchers.

IC Role / Device Role / Timing Role: XC2VP40-6FF1152C acts as the video pipeline engine - using Block SelectRAM+ for line buffers, multipliers for chroma resampling, and DCMs to synchronize HDMI, SDI, and DDR2 memory clocks.

Use Value: Achieves sub-frame latency (<1 ms) through parallelized pixel processing and eliminates external video RAM chips via integrated 3.5 Mb block RAM.

Industrial Protocol Gateway Radar Signal Processor

Use Scenario: Bridging EtherCAT, Profibus, and Modbus TCP networks in factory automation controllers with deterministic cycle times.

IC Role / Device Role / Timing Role: XC2VP40-6FF1152C functions as a protocol translation hub - PowerPC cores run real-time OS stacks and protocol stacks, while FPGA fabric implements hardware-accelerated CRC, Manchester encoding, and timestamped I/O capture.

Use Value: Guarantees <1 µs jitter on EtherCAT outputs via hardware-synchronized GPIO and eliminates software stack bottlenecks in multi-protocol routing.

Use Scenario: Pulse-Doppler radar front-end performing CFAR detection, beamforming, and pulse compression in airborne surveillance systems.

IC Role / Device Role / Timing Role: XC2VP40-6FF1152C operates as the digital back-end processor - using 192 multipliers for FIR filter banks, DCMs to align ADC sampling clocks with RF LO, and PowerPC cores for track-before-detect decision logic.

Use Value: Delivers >2 GOPS sustained compute throughput within 12 W TDP, enabling SWaP-constrained deployment without external DSP chips.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2VP50-6FF1152CHigher logic density (53,136 cells), 232 multipliers, 852 I/Os; same package and speed gradeBetter suited for designs requiring larger control logic footprint or additional SERDES channels (up to 16 RocketIO)Select when XC2VP40-6FF1152C resource utilization exceeds 90% in place-and-route - no PCB change required
XC2VP70-6FF1152C74,448 logic cells, 328 multipliers, 996 I/Os, 16–20 RocketIO transceivers; same FF1152 packageTargeted at full-line-card consolidation with multiple 10G interfaces and complex packet classification enginesChoose for new designs needing >2× the DSP slice count or native 10Gbps backplane connectivity - identical footprint but higher cost and power

Compared with XC2VP40-6FF1152C, XC2VP50-6FF1152C offers headroom for feature expansion without layout changes, while XC2VP70-6FF1152C enables next-generation bandwidth and processing scale - both retain identical thermal profile and JTAG/debug infrastructure.

Availability

XC2VP40-6FF1152C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial protocol gateways, and radar signal processors requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP40-6FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as the industry's first high-performance FPGA platform for system-level integration.

The Virtex-II Pro family was engineered to unify hard processor cores, high-speed serial I/O, and flexible logic in a single die - specifically addressing the convergence of communications, computing, and signal processing in early-2000s infrastructure systems.

FAQ

What is the maximum operating frequency of the PowerPC cores in XC2VP40-6FF1152C?

The XC2VP40-6FF1152C supports up to 350 MHz PowerPC 405 core operation in -6 speed grade commercial devices. This rating assumes proper thermal management and adherence to XAPP755 guidelines for dual-core timing closure. The actual achievable frequency depends on cache hit rate, bus contention, and clock domain crossings within the user design.

Does XC2VP40-6FF1152C include RocketIO transceivers in the FF1152 package?

No. According to Table 3 in DS083 v5.0, the XC2VP40-6FF1152C variant in the FF1152 package has zero bonded-out RocketIO transceivers. All 804 I/O pins are allocated to SelectIO-Ultra banks, enabling maximum parallel interface capability - unlike FG or FF672 variants which route transceiver signals to package balls.

What I/O standards are supported by XC2VP40-6FF1152C?

XC2VP40-6FF1152C supports 22 single-ended (LVCMOS 1.5/1.8/2.5/3.3 V, PCI/PCI-X, GTL, HSTL, SSTL) and 10 differential (LVDS, BLVDS, ULVDS, LDT, LVPECL) standards. Digitally Controlled Impedance (DCI) provides on-die termination for all single-ended standards, eliminating external resistors for stub-matched routing.

Can XC2VP40-6FF1152C be configured via JTAG only, or are other methods supported?

XC2VP40-6FF1152C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 JTAG. JTAG is fully functional for programming, readback, and debugging - but production systems typically use Master SelectMAP with external PROM for autonomous boot. Boundary-scan is IEEE 1149.1 compliant.

Is XC2VP40-6FF1152C still recommended for new designs?

No. Xilinx explicitly marks XC2VP40-6FF1152C as "Product Not Recommended For New Designs" in DS083 v5.0 (June 2011). It remains available for legacy support and repair, but new projects should evaluate Spartan-7, Artix-7, or Kintex UltraScale+ families for improved power efficiency, security, and toolchain support.

XC2VP40-6FF1152C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II Pro
Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
4848
Number of Logic Elements/Cells:
43632
Total RAM Bits:
3538944
Number of I/O:
692
Number of Gates:
-
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1152-FCBGA (35x35)

XC2VP40-6FF1152C FAQ

1.How can I place an order for XC2VP40-6FF1152C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2VP40-6FF1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2VP40-6FF1152C reliable?

The price and inventory of XC2VP40-6FF1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP40-6FF1152C is usually 5 days.

3.What payment methods are accepted for XC2VP40-6FF1152C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP40-6FF1152C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2VP40-6FF1152C?

XC2VP40-6FF1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2VP40-6FF1152C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2VP40-6FF1152C?

For technical support, including XC2VP40-6FF1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP40-6FF1152C requirements.

6.How does Aetrix verify that XC2VP40-6FF1152C is sourced from the original manufacturer or authorized distributors?

All XC2VP40-6FF1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP40-6FF1152C meets industry standards.

7.What is the process for return or replacement of XC2VP40-6FF1152C?

All XC2VP40-6FF1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP40-6FF1152C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2VP40-6FF1152C part is unused and in its original packaging.

Return procedure for XC2VP40-6FF1152C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2VP40-6FF1152C Tags

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