AMD XC2VP40-6FF1152C
- Part No.:
- XC2VP40-6FF1152C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2VP40-6FF1152C.pdf
- Description:
- IC FPGA 692 I/O 1152FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC2VP40-6FF1152C from Xilinx is a Virtex-II Pro platform FPGA with dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18 multipliers, and 804 user I/Os in an 1152-pin flip-chip BGA package. It delivers up to 350 MHz processor operation and supports 3.125 Gb/s RocketIO transceivers (8 or 12 channels depending on configuration), targeting high-performance telecom, networking, and video processing systems.
For engineers reviewing the XC2VP40-6FF1152C datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor integration, embedded SERDES bandwidth, DCM-based clock management, SelectIO-Ultra I/O flexibility, and compatibility with legacy Xilinx design flows and IP cores.
Technical Context
The XC2VP40-6FF1152C implements a hardened dual PowerPC 405 core architecture with 16 KB instruction and 16 KB data caches, MMU support, and dedicated OCM interfaces - enabling real-time embedded processing alongside programmable logic. Its FPGA fabric includes 192 Block SelectRAM+ modules (each 18 Kb), 192 dedicated 18×18 multipliers, and twelve Digital Clock Managers for precise phase-shifting and frequency synthesis.
This device uses Active Interconnect routing with hierarchical segmented resources, supporting predictable timing independent of fanout. The FF1152 package provides 804 user I/Os with SelectIO-Ultra support for LVDS (840 Mb/s), SSTL/HSTL, PCI-X, and digitally controlled impedance (DCI) termination - all operating from 1.5 V core, 2.5 V auxiliary, and configurable 1.5–3.3 V I/O supplies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,632 - defines maximum combinational/sequential logic capacity for custom RTL or IP integration |
| PowerPC Cores | 2 × PPC405 - enables symmetric multiprocessing or asymmetric control + signal processing partitioning |
| Block RAM | 804 Kb distributed + 3,456 Kb block SelectRAM+ - supports large on-chip buffers, FIFOs, and memory-mapped peripherals |
| Multipliers | 192 × 18-bit × 18-bit - accelerates DSP filtering, FFT, and matrix operations without LUT resource consumption |
| Digital Clock Managers | 12 × DCM - provides jitter-tolerant clock deskew, integer/fractional frequency synthesis, and 1/256-cycle phase resolution |
| User I/O Count | 804 - enables high-pin-count interface consolidation (e.g., DDR2 memory, multiple GigE PHYs, parallel video buses) |
| Transceiver Channels | 0 or 12 RocketIO - FF1152 package supports 12-channel 3.125 Gb/s SERDES or zero-transceiver mode for I/O-maximized designs |
| Process Technology | 0.13 µm copper CMOS - balances performance, power, and density for mid-2000s high-end embedded systems |
Pinout & Package
XC2VP40-6FF1152C is housed in a 35 mm × 35 mm, 1.0 mm pitch, flip-chip fine-pitch BGA (FF1152) package with 1152 balls. Of these, 804 are user-configurable I/Os; remaining balls allocate to power (VCCINT, VCCAUX, VCCO), ground, configuration (M0–M2, CCLK, DONE, PROG_B), JTAG (TCK/TMS/TDI/TDO), and reserved/HSWAP_EN/RSVD pins. RocketIO transceiver pins are not bonded out in this package variant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.5 V ±3% supply for FPGA fabric and PowerPC logic; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V ±3% supply for configuration logic, DCMs, SelectIO drivers, and JTAG circuitry |
| VCCO_0–VCCO_n | I/O bank power | Configurable 1.5 V / 1.8 V / 2.5 V / 3.3 V per bank; sets voltage standard for associated I/Os |
| M0–M2 | Configuration mode select | 3-bit strap defining startup mode (e.g., Master SelectMAP, Slave Serial); latched at power-on reset |
| CCLK | Configuration clock input | Drives internal configuration state machine; frequency ≤ 50 MHz in Master mode |
| DONE | Configuration status output | Open-drain active-high signal indicating successful bitstream loading and initialization |
| PROG_B | Program initiation | Active-low asynchronous reset that clears configuration memory and restarts loading sequence |
| TCK/TMS/TDI/TDO | JTAG boundary-scan interface | IEEE 1149.1-compliant test and debug access; supports programming, readback, and ChipScope ILA control |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 cores | Enables tightly coupled software-defined hardware acceleration - e.g., one core running Linux for control, second executing real-time DSP firmware |
| SelectIO-Ultra with DCI | Eliminates external termination resistors for single-ended standards (LVCMOS, SSTL, HSTL), reducing BOM count and PCB area |
| 12 × Digital Clock Manager (DCM) | Allows independent clock domain management per subsystem - e.g., 100 MHz for Ethernet MAC, 148.5 MHz for HDMI video, 200 MHz for DDR2 controller |
| 192 × 18×18 multipliers | Supports concurrent execution of >100 MAC operations per clock cycle - critical for radar beamforming or channelized modems |
| Block SelectRAM+ (18 Kb × 192) | Provides true dual-port RAM with three read-during-write modes - ideal for ping-pong buffering in video frame pipelines or packet reordering engines |
| SRAM-based in-system configuration | Enables field-upgradable functionality via JTAG or serial PROM; supports partial reconfiguration for dynamic function swapping |
Applications
| Telecom Line Card | High-Speed Video Processing |
|---|---|
Use Scenario: Aggregating and grooming OC-48/STM-16 traffic across multiple TDM and packet interfaces in central office equipment. IC Role / Device Role / Timing Role: XC2VP40-6FF1152C serves as the system-on-chip fabric - integrating RocketIO transceivers for SONET framer interfacing, PowerPC cores for OAM&P processing, and CLBs for HDLC/PPP protocol offload. Use Value: Eliminates discrete framer, microcontroller, and glue logic; reduces latency by implementing time-critical framing logic in deterministic FPGA fabric. |
Use Scenario: Real-time 1080p60 video scaling, color space conversion, and overlay compositing in broadcast production switchers. IC Role / Device Role / Timing Role: XC2VP40-6FF1152C acts as the video pipeline engine - using Block SelectRAM+ for line buffers, multipliers for chroma resampling, and DCMs to synchronize HDMI, SDI, and DDR2 memory clocks. Use Value: Achieves sub-frame latency (<1 ms) through parallelized pixel processing and eliminates external video RAM chips via integrated 3.5 Mb block RAM. |
| Industrial Protocol Gateway | Radar Signal Processor |
Use Scenario: Bridging EtherCAT, Profibus, and Modbus TCP networks in factory automation controllers with deterministic cycle times. IC Role / Device Role / Timing Role: XC2VP40-6FF1152C functions as a protocol translation hub - PowerPC cores run real-time OS stacks and protocol stacks, while FPGA fabric implements hardware-accelerated CRC, Manchester encoding, and timestamped I/O capture. Use Value: Guarantees <1 µs jitter on EtherCAT outputs via hardware-synchronized GPIO and eliminates software stack bottlenecks in multi-protocol routing. |
Use Scenario: Pulse-Doppler radar front-end performing CFAR detection, beamforming, and pulse compression in airborne surveillance systems. IC Role / Device Role / Timing Role: XC2VP40-6FF1152C operates as the digital back-end processor - using 192 multipliers for FIR filter banks, DCMs to align ADC sampling clocks with RF LO, and PowerPC cores for track-before-detect decision logic. Use Value: Delivers >2 GOPS sustained compute throughput within 12 W TDP, enabling SWaP-constrained deployment without external DSP chips. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP50-6FF1152C | Higher logic density (53,136 cells), 232 multipliers, 852 I/Os; same package and speed grade | Better suited for designs requiring larger control logic footprint or additional SERDES channels (up to 16 RocketIO) | Select when XC2VP40-6FF1152C resource utilization exceeds 90% in place-and-route - no PCB change required |
| XC2VP70-6FF1152C | 74,448 logic cells, 328 multipliers, 996 I/Os, 16–20 RocketIO transceivers; same FF1152 package | Targeted at full-line-card consolidation with multiple 10G interfaces and complex packet classification engines | Choose for new designs needing >2× the DSP slice count or native 10Gbps backplane connectivity - identical footprint but higher cost and power |
Compared with XC2VP40-6FF1152C, XC2VP50-6FF1152C offers headroom for feature expansion without layout changes, while XC2VP70-6FF1152C enables next-generation bandwidth and processing scale - both retain identical thermal profile and JTAG/debug infrastructure.
Availability
XC2VP40-6FF1152C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, industrial protocol gateways, and radar signal processors requiring stable component supply and long-term obsolescence management.
Supply support for XC2VP40-6FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a pioneering semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It developed the Virtex family as the industry's first high-performance FPGA platform for system-level integration.
The Virtex-II Pro family was engineered to unify hard processor cores, high-speed serial I/O, and flexible logic in a single die - specifically addressing the convergence of communications, computing, and signal processing in early-2000s infrastructure systems.
FAQ
What is the maximum operating frequency of the PowerPC cores in XC2VP40-6FF1152C?
The XC2VP40-6FF1152C supports up to 350 MHz PowerPC 405 core operation in -6 speed grade commercial devices. This rating assumes proper thermal management and adherence to XAPP755 guidelines for dual-core timing closure. The actual achievable frequency depends on cache hit rate, bus contention, and clock domain crossings within the user design.
Does XC2VP40-6FF1152C include RocketIO transceivers in the FF1152 package?
No. According to Table 3 in DS083 v5.0, the XC2VP40-6FF1152C variant in the FF1152 package has zero bonded-out RocketIO transceivers. All 804 I/O pins are allocated to SelectIO-Ultra banks, enabling maximum parallel interface capability - unlike FG or FF672 variants which route transceiver signals to package balls.
What I/O standards are supported by XC2VP40-6FF1152C?
XC2VP40-6FF1152C supports 22 single-ended (LVCMOS 1.5/1.8/2.5/3.3 V, PCI/PCI-X, GTL, HSTL, SSTL) and 10 differential (LVDS, BLVDS, ULVDS, LDT, LVPECL) standards. Digitally Controlled Impedance (DCI) provides on-die termination for all single-ended standards, eliminating external resistors for stub-matched routing.
Can XC2VP40-6FF1152C be configured via JTAG only, or are other methods supported?
XC2VP40-6FF1152C supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 JTAG. JTAG is fully functional for programming, readback, and debugging - but production systems typically use Master SelectMAP with external PROM for autonomous boot. Boundary-scan is IEEE 1149.1 compliant.
Is XC2VP40-6FF1152C still recommended for new designs?
No. Xilinx explicitly marks XC2VP40-6FF1152C as "Product Not Recommended For New Designs" in DS083 v5.0 (June 2011). It remains available for legacy support and repair, but new projects should evaluate Spartan-7, Artix-7, or Kintex UltraScale+ families for improved power efficiency, security, and toolchain support.
XC2VP40-6FF1152C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4848
- Number of Logic Elements/Cells:
- 43632
- Total RAM Bits:
- 3538944
- Number of I/O:
- 692
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2VP40-6FF1152C FAQ
1.How can I place an order for XC2VP40-6FF1152C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP40-6FF1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP40-6FF1152C reliable?
The price and inventory of XC2VP40-6FF1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP40-6FF1152C is usually 5 days.
3.What payment methods are accepted for XC2VP40-6FF1152C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP40-6FF1152C transactions.
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XC2VP40-6FF1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP40-6FF1152C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP40-6FF1152C?
For technical support, including XC2VP40-6FF1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP40-6FF1152C requirements.
6.How does Aetrix verify that XC2VP40-6FF1152C is sourced from the original manufacturer or authorized distributors?
All XC2VP40-6FF1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP40-6FF1152C meets industry standards.
7.What is the process for return or replacement of XC2VP40-6FF1152C?
All XC2VP40-6FF1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP40-6FF1152C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP40-6FF1152C part is unused and in its original packaging.
Return procedure for XC2VP40-6FF1152C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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