AMD XC2VP40-6FF1152I

Overview

XC2VP40-6FF1152I from Xilinx is a high-density Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, and up to 12 RocketIO multi-gigabit transceivers (depending on package configuration). It operates at -6 speed grade with industrial temperature range (–40°C to +100°C) and uses a 1.5V core supply, targeting high-performance telecom, networking, and video processing systems requiring integrated processing and serial I/O.

For engineers reviewing the XC2VP40-6FF1152I datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, confirmed I/O count (804 user I/Os in FF1152), RocketIO transceiver capability (3.125 Gb/s per channel), DCM clock management specs, and real-world substitution guidance - all grounded in DS083 (v5.0) June 2011 official documentation.

Technical Context

The XC2VP40-6FF1152I implements a dual-processor FPGA architecture with two independent PowerPC 405 cores running up to 350 MHz (–6 speed grade, industrial), each backed by 16 KB instruction and 16 KB data caches plus MMU support. Its fabric includes 192 Block SelectRAM+ modules (18 Kb each), 192 dedicated 18×18 multipliers, and twelve Digital Clock Managers (DCMs) enabling precise phase shifting, frequency synthesis, and deskew.

This device uses flip-chip fine-pitch BGA packaging (FF1152, 1.0 mm pitch, 35×35 mm), with all 12 RocketIO transceivers unbonded in this specific package variant - freeing pins for 804 user I/Os compliant with LVDS, SSTL, HSTL, PCI-X, and DCI-terminated standards. Configuration occurs via SelectMAP or JTAG, supporting bitstream encryption and partial reconfiguration.

Key Specifications

Pinout & Package

XC2VP40-6FF1152I uses the FF1152 flip-chip fine-pitch BGA package: 1.0 mm pitch, 35×35 mm body, 1152 balls. All 12 RocketIO transceivers are unbonded in this configuration, maximizing general-purpose I/O count to 804. Pin definitions follow Xilinx DS083 Module 4 (FF1152 Pinout Tables), with dedicated banks for VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V), and configuration signals (CCLK, DONE, M[0:2], PROG_B).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-6FF1152I, XC2VP50-6FF1152I extends I/O count and logic capacity within identical mechanical and thermal constraints, while XC4VLX60-11FF668C trades embedded processors for higher DSP density and modern 90 nm process benefits - making it suitable only where PowerPC migration is feasible.

Availability

XC2VP40-6FF1152I is available at Aetrix Electronics and suitable for wireless infrastructure, industrial automation, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC2VP40-6FF1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions and developed the Virtex family as high-end FPGAs for demanding system-on-chip applications.

The Virtex-II Pro series was designed specifically to integrate hardened PowerPC processors and multi-gigabit transceivers into FPGA fabric, targeting telecom, defense, and high-performance computing where software-defined hardware acceleration is critical.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP40-6FF1152I?

The XC2VP40-6FF1152I supports PowerPC 405 cores up to 350 MHz under industrial temperature conditions (–40°C to +100°C) at –6 speed grade, as specified in DS083 Table 4. This frequency assumes proper decoupling, thermal management, and adherence to voltage tolerances (1.5 V ±3% for VCCINT). The XC2VP40-6FF1152I achieves this performance without requiring special clock macros, unlike higher-speed -7 grade dual-processor variants.

Does XC2VP40-6FF1152I include RocketIO transceivers in the FF1152 package?

No - according to DS083 Table 3, the XC2VP40-6FF1152I variant has zero bonded RocketIO transceivers in the FF1152 package. All 12 transceiver channels are unbonded, allowing the full 1152-ball array to be allocated to 804 user I/Os and power/ground connections. This configuration prioritizes parallel interface bandwidth over serial connectivity.

What I/O standards are supported by XC2VP40-6FF1152I with DCI enabled?

XC2VP40-6FF1152I supports Digitally Controlled Impedance (DCI) for single-ended standards including LVCMOS (1.5V/1.8V/2.5V/3.3V), SSTL (1.8V/2.5V Class I/II), and HSTL (1.5V/1.8V Class I–IV), automatically matching 50 Ω or 75 Ω termination without external resistors. DCI does not apply to differential standards like LVDS, which use separate on-chip differential termination.

Can XC2VP40-6FF1152I perform partial reconfiguration in the field?

Yes - XC2VP40-6FF1152I supports partial reconfiguration as documented in DS083 Module 2. This allows dynamic swapping of logic modules (e.g., changing encryption algorithms or PHY interface parameters) while keeping the PowerPC subsystem and other fabric regions operational. Implementation requires Xilinx ISE 10.1+ and careful floorplanning using modular design methodology.

What configuration modes does XC2VP40-6FF1152I support?

XC2VP40-6FF1152I supports five configuration modes: Slave Serial, Master Serial, Slave SelectMAP, Master SelectMAP, and IEEE 1532 JTAG Boundary-Scan. Master SelectMAP is commonly used for fast parallel loading from flash, while JTAG enables debugging and in-system programming without dedicated configuration controllers.