AMD XC2VP40-6FFG1152C

Overview

XC2VP40-6FFG1152C from Xilinx is a high-density Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, up to 12 RocketIO multi-gigabit transceivers (in FF1152 package), 43,632 logic cells, 192 18×18-bit multipliers, and 8 Digital Clock Managers (DCMs). It operates at -6 speed grade with 1.5 V core voltage and targets high-throughput telecom, networking, and video processing systems requiring integrated processing and serial I/O.

For engineers reviewing the XC2VP40-6FFG1152C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, transceiver performance limits, PowerPC clocking constraints, DCM timing parameters, and package-specific I/O counts - all confirmed for the FF1152 flip-chip BGA variant.

Technical Context

The XC2VP40-6FFG1152C implements a dual-processor SoC-FPGA architecture: two independent PowerPC 405 cores each support 350 MHz operation (at -6 speed grade), 16 KB instruction/data caches, MMU with 64-entry TLB, and CoreConnect bus interface. Its RocketIO transceivers operate at up to 3.125 Gb/s per channel in full-duplex SERDES mode, with monolithic CDR, 8B/10B encoding, and programmable pre-emphasis.

FPGA fabric includes 19,392 CLB slices, 3,456 Kb distributed RAM, 8,040 Kb Block SelectRAM+ (18 Kb × 444), and 16 global clock buffers. The FF1152 package provides 804 user I/Os (excluding control pins and transceiver pads), with SelectIO-Ultra supporting LVDS, SSTL, HSTL, and PCI-X standards plus XCITE digitally controlled impedance (DCI) for on-die termination.

Key Specifications

Pinout & Package

XC2VP40-6FFG1152C uses a 1152-pin Flip-Chip Fine-Pitch BGA (FF1152) package with 1.0 mm pitch, 35 mm × 35 mm body size, and thermal-enhanced construction optimized for high I/O count and signal integrity. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCAUX (2.5 V), VCCO (1.5–3.3 V configurable), differential pairs, and MGT reference clocks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based SoC applications.

Compared with XC2VP40-6FFG1152C, XC2VP50-6FF1136C trades package compatibility for higher transceiver count, while XC2VP70-6FF1152C retains identical packaging but doubles logic and serial I/O capacity-making it a scalable upgrade path without PCB redesign.

Availability

XC2VP40-6FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and medical imaging systems requiring stable component supply and long-term obsolescence management.

Supply support for XC2VP40-6FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding system-on-chip applications.

The Virtex-II Pro product line was engineered to integrate embedded processors and high-speed serial I/O within FPGA fabric-enabling single-chip solutions for communications, defense, and scientific computing where flexibility and performance converge.

FAQ

What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP40-6FFG1152C?

The XC2VP40-6FFG1152C -6 speed grade guarantees 350 MHz operation for each PowerPC 405 core under commercial temperature conditions. This rating assumes proper decoupling, thermal management, and adherence to XAPP755 guidelines for dual-processor timing closure. The XC2VP40-6FFG1152C datasheet specifies this limit in Table 4 of DS083, and exceeding it risks setup/hold violations in the processor's internal pipeline.

Does XC2VP40-6FFG1152C support JTAG boundary-scan testing?

Yes, XC2VP40-6FFG1152C fully complies with IEEE 1149.1 and supports boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. The device implements EXTEST, INTEST, and HIGHZ instructions, enabling pin-level fault detection and interconnect verification. This capability is documented in Module 1 Section "Boundary Scan" of DS083 and validated in factory test procedures.

How many RocketIO transceivers are active in the XC2VP40-6FFG1152C FF1152 package?

The XC2VP40-6FFG1152C configured in the FF1152 package has 12 RocketIO transceivers enabled and bonded out. This is explicitly stated in Table 3 of DS083, which lists "804 / 0(3)" for XC2VP40 in FF1152 - where "0(3)" refers to absence of RocketIO X transceivers, not total RocketIO count. Confirmed RocketIO count for XC2VP40-6FFG1152C is 12, consistent with its placement in the Virtex-II Pro family hierarchy.

Can XC2VP40-6FFG1152C be configured using the Slave SelectMAP mode?

Yes, XC2VP40-6FFG1152C supports Slave SelectMAP configuration, allowing an external microcontroller or processor to load the bitstream via parallel bus (D0–D7, CCLK, WRITE, CS). This mode is detailed in Module 1 Section "Configuration" of DS083 and requires correct M0–M2 pin strapping. The XC2VP40-6FFG1152C implementation includes built-in CRC checking and DONE pin assertion upon successful load.

Is bitstream encryption supported on XC2VP40-6FFG1152C?

Yes, XC2VP40-6FFG1152C includes an on-chip DES decryptor enabling Triple-DES encryption of configuration bitstreams. Up to two key sets can be stored in non-volatile memory, providing secure IP protection against unauthorized readback or cloning. This feature is described in Module 1 Section "Configuration" of DS083 and requires Xilinx BitGen tools with encryption enabled during bitstream generation.