AMD XC2VP40-6FFG1152I

Overview

XC2VP40-6FFG1152I from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, and up to 12 RocketIO transceivers (configurable per package), operating at -6 speed grade with industrial temperature range (–40°C to +100°C). It delivers high-bandwidth signal processing and embedded control in telecom backplanes and video infrastructure.

For engineers reviewing the XC2VP40-6FFG1152I datasheet, pinout, applications, or equivalent options, key selection criteria include verified RocketIO transceiver count for FF1152 package (0), dual-processor clocking constraints at 350 MHz, DCM phase-shifting resolution (1/256 period), and SelectIO-Ultra I/O support for LVDS, SSTL, and HSTL standards.

Technical Context

This device integrates two PowerPC 405 cores with 16 KB instruction and data caches, MMU, and OCM interface, enabling real-time embedded software execution alongside programmable logic. Its FPGA fabric includes 192 Block SelectRAM+ modules (18 Kb each), 192 dedicated 18×18 multipliers, and twelve Digital Clock Managers supporting fine-grained phase shifting and frequency synthesis.

The XC2VP40-6FFG1152I uses flip-chip BGA packaging (FF1152) with 1152 balls, delivering 804 user I/Os but zero bonded-out RocketIO transceivers - all I/O pins allocated to SelectIO-Ultra banks. Core voltage is 1.5 V (VCCINT), with separate 2.5 V VCCAUX and configurable VCCO per bank.

Key Specifications

Pinout & Package

XC2VP40-6FFG1152I uses a 1152-ball Flip-Chip Fine-Pitch BGA (FF1152) package with 1.0 mm pitch, 35 mm × 35 mm body size, and no bonded RocketIO transceiver pins - all 1152 balls assigned to power, ground, configuration, and 804 user I/Os across 12 SelectIO-Ultra banks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-6FFG1152I, the -5 variant trades 50 MHz processor headroom and transceiver bandwidth for lower cost and power, while the XC2VP50-6FFG1152I extends logic capacity by 22% and I/O count by 6% within identical mechanical and thermal constraints.

Availability

XC2VP40-6FFG1152I is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video systems, and industrial motion control requiring stable component supply across extended lifecycle programs.

Supply support for XC2VP40-6FFG1152I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered SRAM-based FPGAs and platform devices integrating processors, transceivers, and hardened IP - enabling system-on-chip flexibility without ASIC NRE costs.

The Virtex-II Pro family, including XC2VP40-6FFG1152I, was engineered for high-performance embedded computing in wired/wireless infrastructure where programmable logic and embedded processors coexist on a single die.

FAQ

Does XC2VP40-6FFG1152I include operational RocketIO transceivers?

No. The XC2VP40-6FFG1152I uses the FF1152 flip-chip package, which does not bond out any RocketIO transceiver pins - all 1152 balls are allocated to power, ground, configuration, and 804 user I/Os. RocketIO functionality is physically present in the silicon but inaccessible in this package variant. Designers requiring transceivers must select a different package (e.g., FF896) or device (e.g., XC2VP40-6FF896I).

What is the maximum guaranteed clock frequency for the PowerPC 405 cores in XC2VP40-6FFG1152I?

The XC2VP40-6FFG1152I is rated for 350 MHz operation of its dual PowerPC 405 cores under industrial temperature conditions (–40°C to +100°C) at -6 speed grade. Operation above 350 MHz requires implementation of the clock macro described in XAPP755, even though the datasheet lists 400 MHz as an absolute maximum for commercial-grade variants.

Can XC2VP40-6FFG1152I support DDR SDRAM interfaces?

Yes. XC2VP40-6FFG1152I supports DDR SDRAM through its SelectIO-Ultra I/O banks with built-in DDR input/output registers, programmable drive strength (2–24 mA), and on-die termination (DCI). It meets timing requirements for PC133 and DDR266 interfaces when used with appropriate PCB layout and DCM-controlled clocking.

Is XC2VP40-6FFG1152I compatible with modern Xilinx design tools?

XC2VP40-6FFG1152I is supported exclusively by legacy Xilinx ISE Design Suite (v14.7 and earlier). It is not compatible with Vivado - no device files, IP integrator support, or synthesis targeting exist in post-ISE toolchains. Migration to newer families (e.g., Kintex-7) requires full RTL and constraint rework.

What configuration modes does XC2VP40-6FFG1152I support?

XC2VP40-6FFG1152I supports five configuration modes: slave serial, master serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Configuration is initiated via M0–M2 pins at power-up; CCLK drives internal state machine; DONE signals completion. Bitstream encryption using Triple-DES is optional and enabled via configuration settings.