AMD XC2VP40-6FG676C

Overview

XC2VP40-6FG676C from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, and up to 12 RocketIO transceivers (configurable in FG676 package). It operates at -6 speed grade with 350 MHz PowerPC clock and supports 2.5 Gb/s serial transceiver rates for telecom and networking systems.

For engineers reviewing the XC2VP40-6FG676C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture details, I/O configuration limits, DCM timing parameters, SelectIO-Ultra voltage support, and RocketIO transceiver compatibility with Fibre Channel and Gigabit Ethernet protocols.

Technical Context

The XC2VP40-6FG676C integrates two IBM PowerPC 405 cores with 16 KB instruction and data caches, MMU, and OCM interface - enabling embedded Linux or real-time OS execution. Its FPGA fabric includes 192 Block SelectRAM+ modules (18 Kb each), 192 dedicated 18×18 multipliers, and twelve Digital Clock Managers supporting fine-grained phase shifting (1/256 period) and frequency synthesis.

This device uses a 0.13 µm nine-layer copper process with 1.5 V core (VCCINT), 2.5 V auxiliary (VCCAUX), and programmable 1.5–3.3 V I/O (VCCO). In the FG676 wire-bond BGA package, it provides 692 user I/Os and supports LVDS, SSTL, HSTL, PCI-X, and DCI-terminated single-ended standards.

Key Specifications

Pinout & Package

XC2VP40-6FG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FG676) wire-bond package with 1.0 mm pitch, 26 mm × 26 mm body size, and Pb-free option (FGG676). The package supports 692 user I/Os plus dedicated configuration, JTAG, and power pins.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-6FG676C, XC2VP50-6FF1152C offers higher logic capacity and transceiver count but demands flip-chip assembly and tighter power delivery; XC2VP70-6FF1148C trades transceiver availability for extreme I/O scalability, making it suitable for legacy parallel bus bridging rather than serial interconnect.

Availability

XC2VP40-6FG676C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, industrial video, and high-channel data acquisition requiring stable component supply across long-lifecycle deployments.

Supply support for XC2VP40-6FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and IP-based platform solutions for high-performance digital systems.

The Virtex-II Pro family was designed for embedded system-on-chip integration - combining hardened processor cores, high-speed serial I/O, and flexible logic fabric to replace ASICs in telecom, aerospace, and test equipment.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP40-6FG676C?

The XC2VP40-6FG676C supports a maximum PowerPC 405 clock frequency of 350 MHz under -6 speed grade at commercial temperature range. This rating assumes proper decoupling, thermal management, and adherence to VCCINT = 1.5 V ±3%. Operation above 350 MHz requires implementation of the CPMC405CLOCK macro per XAPP755 for dual-processor timing closure.

Does XC2VP40-6FG676C support LVDS I/O at 840 Mb/s?

Yes, XC2VP40-6FG676C supports LVDS I/O at up to 840 Mb/s using its SelectIO-Ultra technology. This capability is validated in DS083 Module 1 and applies to differential pairs routed through dedicated LVDS-capable IOBs with on-chip 100 Ω differential termination enabled. Signal integrity requires controlled-impedance PCB routing and proper termination at the receiver.

How many RocketIO transceivers are available in the FG676 package for XC2VP40-6FG676C?

The XC2VP40-6FG676C in the FG676 wire-bond package supports up to 12 RocketIO transceivers, as confirmed in Table 3 of DS083. This configuration is distinct from flip-chip variants (e.g., FF1148), which bond out zero transceivers. The 12-channel capability enables multi-lane protocols like XAUI or bonded Fibre Channel links.

Is XC2VP40-6FG676C compatible with partial reconfiguration workflows?

Yes, XC2VP40-6FG676C supports partial reconfiguration via its SRAM-based configuration architecture. The device allows dynamic loading of logic modules into defined regions without resetting the entire FPGA or PowerPC subsystem. This feature is documented in DS083 Module 1 under "SRAM-Based In-System Configuration" and requires Xilinx ISE 10.1 or later toolchain support.

What is the total Block SelectRAM+ capacity in XC2VP40-6FG676C?

The XC2VP40-6FG676C contains 44 Block SelectRAM+ modules, each 18 Kb, delivering a total of 804 Kb of true dual-port RAM. This memory is configurable from 16K×1 to 512×36 bits per block and supports three read-during-write modes. It is accessible independently by FPGA logic and PowerPC via OCM controllers for low-latency data exchange.