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AMD XC2VP40-6FG676I
- Part No.:
- XC2VP40-6FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC2VP40-6FG676I.pdf
- Description:
- IC FPGA 416 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
XC2VP40-6FG676I from Xilinx is a Virtex-II Pro platform FPGA with dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, and up to 12 RocketIO transceivers (configurable 0/8/12). It features 8 Digital Clock Managers (DCMs), 804 user I/Os in a 676-pin Fine-Pitch BGA (FG676) package, and operates at -6 speed grade (350 MHz PowerPC, 2.5 Gb/s transceivers) for industrial temperature range (–40°C to +100°C). It targets high-reliability telecom backplane interfaces and embedded signal processing systems.
For engineers reviewing the XC2VP40-6FG676I datasheet, pinout, applications, or equivalent options, key selection considerations include verified dual-processor support, RocketIO transceiver count configuration (0/8/12), FG676 package I/O count (692 max), DCM count (8), and industrial-grade thermal performance under sustained 350 MHz CPU operation.
Technical Context
This device integrates two IBM PowerPC 405 cores with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - enabling real-time embedded control alongside programmable logic. Its RocketIO transceivers support full-duplex operation from 600 Mb/s to 3.125 Gb/s (wire-bond FG676 package), with 8B/10B encoding, channel bonding (2–20 channels), and on-chip 50Ω/75Ω termination.
The FPGA fabric delivers 43,632 logic cells (≈19,392 CLB slices), 192 dedicated 18×18-bit multipliers, 3,456 Kb block RAM (192 × 18 Kb SelectRAM+), and 8 DCMs offering precise clock deskew, integer/fractional frequency synthesis, and ±1/256-cycle phase shifting - all implemented in 0.13 µm nine-layer copper process with 1.5 V core supply.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,632 - determines maximum combinational/sequential logic capacity for custom HDL implementations |
| PowerPC Cores | 2 × PowerPC 405 - enables symmetric multiprocessing or asymmetric control + acceleration partitioning |
| RocketIO Transceivers | Configurable 0 / 8 / 12 - defines serial interconnect scalability for backplane or chip-to-chip links |
| User I/O Pads | 692 - supports high-pin-count parallel buses, DDR memory interfaces, and multi-standard I/O banks |
| Digital Clock Managers | 8 × DCM - provides independent clock domain management for mixed-speed subsystems |
| Block RAM | 3,456 Kb (192 × 18 Kb) - enables large FIFOs, coefficient tables, or frame buffers without external memory |
| Speed Grade | -6 - guarantees 350 MHz PowerPC operation and 2.5 Gb/s RocketIO performance at industrial temperature |
| Package | FG676 - 26 mm × 26 mm wire-bond fine-pitch BGA with 1.0 mm pitch and Pb-free option available |
Pinout & Package
XC2VP40-6FG676I uses the FG676 wire-bond fine-pitch BGA package (26 mm × 26 mm, 1.0 mm pitch), qualified for industrial temperature operation (–40°C to +100°C). Pin definitions are fully documented in DS083 Module 4 (302 pages), covering I/O standards, configuration pins (M0/M1/M2, CCLK, DONE, PROG_B), JTAG boundary-scan (TCK/TDI/TDO/TMS), and dedicated RocketIO differential pairs (RXN/RXP, TXN/TXP).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master/slave serial or SelectMAP loading |
| DONE | Configuration Status Output | Open-drain active-high signal indicating successful bitstream load and initialization completion |
| M0/M1/M2 | Mode Selection Inputs | Set configuration mode (slave-serial, master-serial, slave SelectMAP, etc.) at power-up |
| TCK/TDI/TDO/TMS | JTAG Boundary-Scan Interface | Enable IEEE 1149.1-compliant testing, programming, and debug access to internal logic and I/Os |
| RXP/RXN | RocketIO Receiver Differential Pair | AC-coupled high-speed serial input supporting 600 Mb/s–3.125 Gb/s with internal equalization |
| TXP/TXN | RocketIO Transmitter Differential Pair | Differential output with programmable swing (200–1600 mVpp) and pre-emphasis (0–500%) |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables hard real-time OS execution alongside FPGA-accelerated datapaths without external microprocessor |
| Configurable RocketIO Count | Supports design reuse across variants: 0-transceiver for pure logic/control, 8/12 for multi-protocol serial interconnect |
| Digitally Controlled Impedance (DCI) | Automatically matches on-die termination to trace impedance (50–75 Ω), eliminating external resistors for single-ended I/O |
| SelectIO-Ultra I/O Standards | Supports 22 single-ended (LVCMOS 1.5/1.8/2.5/3.3 V, PCI-X) and 10 differential (LVDS, BLVDS, LVPECL) standards in same bank |
| 12 Global Clock MUX Buffers | Provides glitch-free clock multiplexing and fanout to critical timing domains including PowerPC and RocketIO blocks |
| Triple-DES Bitstream Encryption | Protects intellectual property by decrypting encrypted configuration bitstreams using on-chip hardware DES engine |
Applications
| Telecom Backplane Interface | Industrial Video Processing |
|---|---|
Use Scenario: High-density line cards in carrier-grade routers requiring protocol-agnostic serial interconnect between FPGA-based packet processors and PHY layers. IC Role / Device Role / Timing Role: XC2VP40-6FG676I serves as the central protocol translation and traffic management hub, with RocketIO handling 2.5 Gb/s SONET/SDH or Gigabit Ethernet lanes and PowerPC managing control plane tasks. Use Value: Eliminates need for discrete serializer/deserializer and microcontroller, reducing BOM count and board area while maintaining deterministic latency via on-chip clock domain synchronization. | Use Scenario: Real-time video analytics edge node performing H.264 encode/decode, motion detection, and metadata tagging in factory automation cameras. IC Role / Device Role / Timing Role: XC2VP40-6FG676I executes video pipeline in FPGA fabric (pixel filtering, compression) while dual PowerPC cores run Linux-based application stack and sensor fusion algorithms. Use Value: Achieves sub-10 ms end-to-end latency by tightly coupling hardware accelerators with embedded software - no PCIe bottleneck or external DRAM round-trip delay. |
| Avionics Data Concentrator | Medical Imaging Controller |
Use Scenario: ARINC 664 (AFDX) end-system in flight control computers aggregating sensor data from multiple LRUs over deterministic switched Ethernet. IC Role / Device Role / Timing Role: XC2VP40-6FG676I implements AFDX endpoint logic (virtual link scheduling, redundancy management) and runs DO-178C-certifiable RTOS on PowerPC cores. Use Value: Meets AFDX jitter requirements (< 15 µs) using DCM-based deterministic clocking and avoids certification overhead of multi-chip solutions. | Use Scenario: Ultrasound beamformer controller synchronizing 128-channel analog front-end, digital demodulation, and image reconstruction pipelines. IC Role / Device Role / Timing Role: XC2VP40-6FG676I configures ADC sampling clocks, manages DMA transfers to block RAM, and runs real-time beam steering calculations on PowerPC cores. Use Value: Enables 4K-resolution real-time imaging at 60 fps by leveraging 192 multipliers for parallel FIR filtering and 3,456 Kb on-chip RAM for line buffering - no external memory bandwidth constraint. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA with embedded processor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP40-6FF896I | Flip-chip FF896 package (31 mm × 31 mm); 996 user I/Os; no RocketIO bonded out; higher thermal dissipation | Suitable for I/O-bound control applications requiring maximum parallel bus width, not serial interconnect | Select when system needs >800 I/Os and can accommodate larger footprint; avoid if RocketIO transceivers are required |
| XC2VP70-6FF1152I | Higher-density variant (74,448 logic cells, 20 RocketIO, 996 I/Os); FF1152 package (35 mm × 35 mm); same -6 speed grade | Targets multi-protocol line cards needing simultaneous 10GbE, Fibre Channel, and CPRI interfaces | Choose for scalability beyond XC2VP40 capacity; verify PCB space and power delivery for larger package |
Compared with XC2VP40-6FG676I, XC2VP40-6FF896I trades transceiver capability for I/O count and thermal headroom, while XC2VP70-6FF1152I extends both logic density and serial bandwidth - making the XC2VP40-6FG676I optimal for balanced compute+interconnect workloads in constrained industrial form factors.
Availability
XC2VP40-6FG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video analytics, avionics data concentrators, and medical imaging controllers requiring stable component supply across extended product lifecycles.
Supply support for XC2VP40-6FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered SRAM-based platform FPGAs with integrated hard IP, targeting high-performance embedded systems before acquisition in 2022.
The Virtex-II Pro family - including XC2VP40-6FG676I - was engineered for systems demanding co-integrated processing, high-speed serial I/O, and reconfigurable logic in a single die, especially in telecom, defense, and industrial automation.
FAQ
What is the maximum guaranteed operating frequency of the PowerPC 405 cores in XC2VP40-6FG676I?
The XC2VP40-6FG676I is rated at -6 speed grade, guaranteeing 350 MHz operation of both PowerPC 405 cores across the full industrial temperature range (–40°C to +100°C), provided the CPMC405CLOCK macro is used per XAPP755 for dual-core timing closure.
Does XC2VP40-6FG676I support on-chip termination for single-ended I/O standards?
Yes, XC2VP40-6FG676I implements XCITE Digitally Controlled Impedance (DCI) that automatically configures on-die series or parallel termination matching 50 Ω or 75 Ω trace impedances for LVCMOS, SSTL, and HSTL standards - eliminating external termination resistors.
How many RocketIO transceivers are physically present and bond-out enabled in XC2VP40-6FG676I?
XC2VP40-6FG676I contains 12 RocketIO transceiver blocks, all bond-out enabled in the FG676 package per Table 3 of DS083, supporting up to 12 full-duplex 2.5 Gb/s serial channels with 8B/10B encoding and channel bonding.
What configuration modes does XC2VP40-6FG676I support, and which pins control them?
XC2VP40-6FG676I supports slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan configuration. The M0, M1, and M2 pins set the mode at power-up; CCLK drives configuration clock; DONE signals completion; and PROG_B initiates reconfiguration.
Is XC2VP40-6FG676I suitable for new designs, and what is its lifecycle status?
No - XC2VP40-6FG676I is marked "Product Not Recommended For New Designs" in DS083 (v5.0, June 2011). It remains available for legacy support and obsolescence management, but Xilinx recommends Virtex-5 or newer families for new projects requiring long-term supply assurance.
XC2VP40-6FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4848
- Number of Logic Elements/Cells:
- 43632
- Total RAM Bits:
- 3538944
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC2VP40-6FG676I FAQ
1.How can I place an order for XC2VP40-6FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP40-6FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP40-6FG676I reliable?
The price and inventory of XC2VP40-6FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP40-6FG676I is usually 5 days.
3.What payment methods are accepted for XC2VP40-6FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP40-6FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP40-6FG676I?
XC2VP40-6FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP40-6FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP40-6FG676I?
For technical support, including XC2VP40-6FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP40-6FG676I requirements.
6.How does Aetrix verify that XC2VP40-6FG676I is sourced from the original manufacturer or authorized distributors?
All XC2VP40-6FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP40-6FG676I meets industry standards.
7.What is the process for return or replacement of XC2VP40-6FG676I?
All XC2VP40-6FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP40-6FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP40-6FG676I part is unused and in its original packaging.
Return procedure for XC2VP40-6FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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