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AMD XC2VP40-6FGG676C
- Part No.:
- XC2VP40-6FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC2VP40-6FGG676C.pdf
- Description:
- IC FPGA 416 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,748
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Product details
Overview
XC2VP40-6FGG676C from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, 3,456 Kb of Block SelectRAM+ memory, and up to 12 RocketIO transceivers (configurable 0/8/12) in a 676-pin Fine-Pitch BGA (FGG676) package with 1.0 mm pitch. It targets high-bandwidth embedded processing in telecom backplanes and video infrastructure.
For engineers reviewing the XC2VP40-6FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include dual-processor integration, 3.125 Gb/s transceiver capability (when configured), DCM-based clock management, SelectIO-Ultra I/O support (LVDS, SSTL, HSTL), and 1.5 V core voltage operation.
Technical Context
The XC2VP40-6FGG676C implements a hardened dual PowerPC 405 core architecture with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - enabling real-time embedded software execution alongside programmable logic. Its FPGA fabric uses 0.13 µm nine-layer copper process with Active Interconnect routing and SRAM-based configuration.
It integrates twelve Digital Clock Managers (DCMs) supporting precise de-skew, integer/fractional frequency synthesis, and ±180° phase shifting; plus SelectIO-Ultra I/Os with Digitally Controlled Impedance (DCI), on-chip differential termination, and support for 22 single-ended and 10 differential standards including LVDS (840 Mb/s) and PCI-X.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,632 - determines maximum combinational/sequential logic capacity for custom RTL or IP integration |
| PowerPC Blocks | 2 × PowerPC 405 - enables dual-core embedded processing with Harvard architecture, caches, and MMU |
| Block RAM | 3,456 Kb (192 × 18 Kb blocks) - provides true dual-port, configurable-depth embedded memory for buffering or lookup tables |
| Multipliers | 192 × 18-bit × 18-bit - supports high-throughput DSP operations like FIR filtering and FFT without LUT resource consumption |
| DCMs | 12 × Digital Clock Manager - delivers jitter-tolerant clock synthesis, phase alignment, and frequency translation across domains |
| I/O Standards | LVDS, SSTL-2/18, HSTL-I/II/III/IV, LVTTL, LVCMOS (1.5–3.3 V), PCI-X - ensures interoperability with memory, processors, and serial interfaces |
| Transceivers | 0 / 8 / 12 RocketIO (3.125 Gb/s max) - selectable MGT count per device variant; FGG676 package supports up to 12 channels |
Pinout & Package
XC2VP40-6FGG676C uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 1.0 mm pitch, wire-bond construction, Pb-free finish, and thermal pad. Pin definitions are documented across 302 pages in DS083 Module 4, covering ball assignments, I/O bank groupings, power/ground distribution, and dedicated configuration/control pins (e.g., CCLK, DONE, M[0:2], PROG_B).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master/slave serial or SelectMAP programming |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading and initialization completion |
| M0–M2 | Mode Selection Inputs | Set configuration mode at power-up (e.g., slave serial, master serial, boundary scan) |
| PROG_B | Program Initiate Input | Active-low asynchronous reset that clears configuration memory and restarts loading sequence |
| VCCINT | Core Power Supply | 1.5 V ±3% supply for FPGA logic and PowerPC core; requires low-noise regulation |
| VCCAUX | Auxiliary Power Supply | 2.5 V ±3% supply for DCMs, SelectIO-Ultra drivers, and configuration circuitry |
| VCCO | I/O Bank Power Supply | Configurable per-bank (1.5 V to 3.3 V) to match connected interface voltage levels |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables symmetric multiprocessing or asymmetric task partitioning (e.g., control plane + data plane) with shared memory via OCM |
| SelectIO-Ultra with DCI | Eliminates external termination resistors by auto-calibrating on-die impedance to match trace Z₀ (50 Ω or 75 Ω) |
| 12 × Digital Clock Managers | Provides independent clock domain management - each supports input jitter filtering, multiplication/division, and fine-grained phase shift (1/256 period) |
| 18 Kb Block SelectRAM+ | True dual-port RAM with three read-during-write modes; supports cascading for >18 Kb buffers or FIFOs without external memory |
| SRAM-Based In-System Configuration | Allows unlimited reprogramming, partial reconfiguration, and bitstream encryption using Triple DES keys for IP protection |
Applications
| Telecom Backplane Interface | Video Processing Engine |
|---|---|
Use Scenario: High-speed interconnection between line cards and switch fabric in OC-48/STM-16 systems. IC Role / Device Role / Timing Role: FPGA fabric handles protocol mapping and framing; PowerPC cores run control-plane software; RocketIO transceivers serialize/deserialize data at 3.125 Gb/s. Use Value: Integrates SERDES, processor, and logic in one device - reducing board area, power, and inter-chip latency versus discrete solutions. |
Use Scenario: Real-time HD video scaling, color space conversion, and overlay compositing in broadcast encoders. IC Role / Device Role / Timing Role: CLBs implement pixel pipelines; Block RAM buffers frames; DCMs synchronize multiple video clocks (e.g., 74.25 MHz, 148.5 MHz). Use Value: On-chip memory bandwidth (up to 12.8 GB/s aggregate) avoids external DDR bottlenecks for multi-stream processing. |
| Industrial Control System | Medical Imaging Subsystem |
Use Scenario: Deterministic motion control with synchronized I/O, encoder feedback, and safety monitoring. IC Role / Device Role / Timing Role: PowerPC executes real-time OS and PLC logic; FPGA fabric implements hardware timers, PWM generators, and isolated I/O interfaces. Use Value: Tight coupling between processor and logic enables sub-microsecond response to hardware events - critical for servo loop closure. |
Use Scenario: CT/MRI image reconstruction pipeline requiring parallel FFT and convolution operations. IC Role / Device Role / Timing Role: 192 multipliers execute fixed-point arithmetic; Block RAM stores coefficient tables; DCMs align ADC sampling clocks to reconstruction timing. Use Value: Dedicated multiplier resources deliver 384 MAC/cycle throughput - accelerating reconstruction without offloading to GPU or ASIC. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP50-6FF1152C | Higher density (53,136 logic cells), 16 RocketIO transceivers, flip-chip FF1152 package (1152 balls) | Supports larger designs with more I/O and higher transceiver count; requires different PCB layout and thermal management | Choose when needing >43K logic cells or ≥16 transceivers; not pin-compatible with FGG676 |
| XC2VP70-6FF1148C | 74,448 logic cells, 20 RocketIO transceivers, FF1148 package (1148 balls), no bonded-out transceivers in this package variant | Optimized for maximum I/O count (996 user I/Os); transceivers disabled in FF1148 - use only for logic-intensive, non-serial applications | Prefer for high-pin-count logic-only designs; incompatible pinout and transceiver availability vs. XC2VP40-6FGG676C |
Compared with XC2VP40-6FGG676C, XC2VP50-6FF1152C offers greater logic capacity and transceiver count but demands larger PCB area and higher power; XC2VP70-6FF1148C trades transceiver functionality for extreme I/O density - making XC2VP40-6FGG676C the balanced choice for dual-processor + moderate serial I/O embedded systems.
Availability
XC2VP40-6FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, broadcast video equipment, and industrial automation systems requiring stable component supply and long-term lifecycle support.
Supply support for XC2VP40-6FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGAs, adaptive SoCs, and design tools since 1984.
The Virtex-II Pro family was designed to integrate hard processor cores and high-speed serial I/O into high-density FPGAs - targeting embedded computing applications where software flexibility and hardware acceleration coexist.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC2VP40-6FGG676C?
The XC2VP40-6FGG676C speed grade -6 supports up to 350 MHz for each PowerPC 405 core under commercial conditions. This assumes proper decoupling, thermal management, and adherence to voltage tolerances (VCCINT = 1.5 V ±3%). Performance may be reduced in industrial temperature ranges or with aggressive power gating.
Does XC2VP40-6FGG676C support partial reconfiguration?
Yes, XC2VP40-6FGG676C supports partial reconfiguration through its SRAM-based configuration architecture. Users can dynamically reload specific logic regions without disrupting active functions elsewhere in the device - enabled via Xilinx ISE toolflow and configuration port access.
What I/O standards are supported by the SelectIO-Ultra blocks in XC2VP40-6FGG676C?
XC2VP40-6FGG676C supports 22 single-ended standards (including LVCMOS 1.5/1.8/2.5/3.3 V, LVTTL, PCI, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Each I/O bank is independently configurable for voltage and standard.
Is XC2VP40-6FGG676C pin-compatible with other Virtex-II Pro devices in the FGG676 package?
No - XC2VP40-6FGG676C is not pin-compatible with other Virtex-II Pro devices in the FGG676 package. While all share the same physical footprint and ball count, I/O bank assignments, power pin locations, and transceiver pinouts differ across device densities per Table 3 in DS083.
What configuration modes does XC2VP40-6FGG676C support?
XC2VP40-6FGG676C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by M0–M2 pins at power-up, and configuration data can be encrypted using on-chip Triple DES decryption.
XC2VP40-6FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4848
- Number of Logic Elements/Cells:
- 43632
- Total RAM Bits:
- 3538944
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC2VP40-6FGG676C FAQ
1.How can I place an order for XC2VP40-6FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP40-6FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP40-6FGG676C reliable?
The price and inventory of XC2VP40-6FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP40-6FGG676C is usually 5 days.
3.What payment methods are accepted for XC2VP40-6FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP40-6FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP40-6FGG676C?
XC2VP40-6FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP40-6FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP40-6FGG676C?
For technical support, including XC2VP40-6FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP40-6FGG676C requirements.
6.How does Aetrix verify that XC2VP40-6FGG676C is sourced from the original manufacturer or authorized distributors?
All XC2VP40-6FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP40-6FGG676C meets industry standards.
7.What is the process for return or replacement of XC2VP40-6FGG676C?
All XC2VP40-6FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP40-6FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP40-6FGG676C part is unused and in its original packaging.
Return procedure for XC2VP40-6FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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