AMD XC2VP40-6FGG676I

Overview

XC2VP40-6FGG676I from Xilinx is a Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, up to 12 RocketIO multi-gigabit transceivers (in FGG676 package), 43,632 logic cells, and 8 Digital Clock Managers (DCMs). It operates at -6 speed grade with industrial temperature range (–40°C to +100°C) and targets high-bandwidth telecom, networking, and video processing systems requiring integrated processing and serial I/O.

For engineers reviewing the XC2VP40-6FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual PowerPC 405 core support, 2.5 Gb/s RocketIO transceiver capability in wire-bond BGA, 804 maximum user I/Os in FGG676, and compatibility with SelectIO-Ultra, DCI, and DCM-based clock management for deterministic timing closure.

Technical Context

This device integrates hard PowerPC 405 cores with full MMU, 16 KB instruction and data caches, and dedicated OCM interface - enabling real-time embedded software execution alongside programmable logic. Its RocketIO transceivers support 600 Mb/s to 3.125 Gb/s per channel with 8B/10B encoding, channel bonding, and on-chip 50 Ω termination.

The FPGA fabric delivers 19,392 CLB slices, 192 18×18 multipliers, 3,456 Kb block RAM (192 × 18 Kb SelectRAM+), and 12 DCMs with fine-grained phase shifting (1/256 period resolution) and frequency synthesis - all built on a 0.13 µm copper process with 1.5 V core supply and 2.5 V auxiliary I/O rails.

Key Specifications

Pinout & Package

XC2VP40-6FGG676I uses a 676-ball Fine-Pitch Ball Grid Array (FGG676) wire-bond package with 1.0 mm pitch, 26 mm × 26 mm body size, and Pb-free construction. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCO, VCCAUX, VRP/VRN reference, JTAG, configuration, and RocketIO differential pairs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-with-embedded-processor applications.

Compared with XC2VP40-6FGG676I, XC2VP50-6FF1152I offers higher transceiver count and I/O but sacrifices DCI and increases package complexity, while XC2VP7-6FG456I trades logic capacity and transceiver count for lower cost and footprint - making XC2VP40-6FGG676I the balanced choice for mid-scale integrated processing and serial I/O.

Availability

XC2VP40-6FGG676I is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video systems, and avionics data concentrators requiring stable component supply over extended product lifecycles.

Supply support for XC2VP40-6FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered FPGA technology and developed the Virtex family as high-performance programmable logic platforms for demanding system-level applications.

The Virtex-II Pro product line was designed to integrate hardened processor cores and multi-gigabit transceivers into a single FPGA fabric - targeting applications where software-defined functionality, real-time processing, and high-speed serial connectivity must coexist on one die.

FAQ

What is the maximum RocketIO transceiver count supported by XC2VP40-6FGG676I?

XC2VP40-6FGG676I supports up to 12 RocketIO transceivers when configured in the FGG676 wire-bond package. This is confirmed in Table 1 and Table 3 of DS083 (v5.0), where "XC2VP40" lists "0(3), 8, or 12" transceivers and FGG676 yields "692 / 12" in the I/O/transceiver column. The -6 speed grade limits operation to 2.5 Gb/s per channel in this package.

Does XC2VP40-6FGG676I include hard PowerPC processor cores?

Yes, XC2VP40-6FGG676I integrates two hard PowerPC 405 RISC processor blocks, each with 16 KB instruction and data caches, MMU, and OCM interface. This is explicitly stated in Table 1 and the "PowerPC RISC Processor Block Features" section of DS083, which confirms dual-core support for all XC2VP40 devices regardless of package.

What I/O standards does XC2VP40-6FGG676I support via SelectIO-Ultra?

XC2VP40-6FGG676I supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, GTL) and 10 differential standards (LVDS, BLVDS, LVPECL, HSTL, SSTL) via SelectIO-Ultra. DCI enables automatic on-chip termination for single-ended I/Os, and on-chip differential termination is available for LVDS, ULVDS, and LDT - all documented in Module 1, page 3.

Is XC2VP40-6FGG676I suitable for industrial temperature applications?

Yes, the "I" suffix in XC2VP40-6FGG676I denotes Industrial temperature grade (–40°C to +100°C), and the -6 speed grade is qualified for this range. DS083 Section "Maximum RocketIO / RocketIO X Transceiver and Processor Block Performance" confirms -6 grade operation at 350 MHz for PowerPC cores under industrial conditions.

What configuration modes are supported by XC2VP40-6FGG676I?

XC2VP40-6FGG676I supports five configuration modes: Slave-Serial, Master-Serial, Slave SelectMAP, Master SelectMAP, and Boundary-Scan (IEEE 1532). Configuration is SRAM-based and in-system reprogrammable, with optional Triple-DES bitstream encryption enabled via on-chip decryptor - as detailed in the "Configuration" section of DS083 Module 1.