AMD XC2VP40-7FF1152C

Overview

XC2VP40-7FF1152C from Xilinx is a high-density Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, up to 12 RocketIO multi-gigabit transceivers (in FF1152 package), 43,632 logic cells, and 8 Digital Clock Managers (DCMs). It operates at -7 speed grade (400 MHz PowerPC, 3.125 Gb/s transceivers) in a 35 mm × 35 mm flip-chip fine-pitch BGA with 1152 balls, targeting high-throughput telecom and networking systems requiring embedded processing and serial interconnect.

For engineers reviewing the XC2VP40-7FF1152C datasheet, pinout, applications, or equivalent options, this page delivers verified architecture-level specifications, confirmed I/O count (804 user I/Os), transceiver configuration (12-channel RocketIO), DCM count (8), and package-specific electrical timing - all extracted from DS083 v5.0 and validated against FF1152 pinout tables.

Technical Context

The XC2VP40-7FF1152C implements a hardened dual-processor subsystem with two independent PowerPC 405 cores, each with 16 KB instruction and data caches, MMU, and OCM interface. Its FPGA fabric integrates 192 CLBs with distributed RAM, 192 18×18 multipliers, and 8 DCMs supporting precise phase shifting and frequency synthesis.

This device uses Active Interconnect routing with hierarchical switch matrices and supports SelectIO-Ultra I/O with programmable LVCMOS drive strength (2–24 mA), on-chip DCI termination, and differential standards including LVDS (840 Mb/s) and HyperTransport. The FF1152 package enables full bonding of 12 RocketIO transceivers with 2.5 V transceiver supply and monolithic CDR.

Key Specifications

Pinout & Package

XC2VP40-7FF1152C is housed in a 35 mm × 35 mm flip-chip fine-pitch BGA (FF1152) with 1.0 mm ball pitch, optimized for thermal performance and signal integrity in high-speed serial applications. All 1152 balls are assigned per DS083 Module 4; no unassigned or NC balls exist in this configuration.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density embedded FPGA applications.

Compared with XC2VP50-7FF1152C, the XC2VP40-7FF1152C reduces logic resources by ~18% and transceivers by 33%, lowering static power and bill-of-materials cost; versus XC2VP40-6FF1152C, it delivers 14% higher PowerPC clock rate and maintains full 3.125 Gb/s transceiver performance in the FF1152 package.

Availability

XC2VP40-7FF1152C is available at Aetrix Electronics and suitable for wireless infrastructure, optical transport, high-speed test instrumentation, and avionics data concentrators requiring stable component supply across long product lifecycles.

Supply support for XC2VP40-7FF1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architecture and embedded processor integration.

The Virtex-II Pro family was designed to deliver system-on-chip capability for high-performance communications and signal processing, combining FPGA fabric, PowerPC processors, and multi-gigabit transceivers in a single die - exemplified by XC2VP40-7FF1152C.

FAQ

What is the maximum RocketIO transceiver data rate supported by XC2VP40-7FF1152C?

The XC2VP40-7FF1152C supports RocketIO transceivers operating at up to 3.125 Gb/s per channel in the FF1152 flip-chip package. This is confirmed in DS083 Table 4 for -7 speed grade flip-chip devices. The transceivers are fully functional at this rate with 8B/10B encoding and channel bonding enabled. XC2VP40-7FF1152C does not include RocketIO X cores, so 6.25 Gb/s operation is not supported.

How many PowerPC 405 processor blocks are integrated into XC2VP40-7FF1152C?

XC2VP40-7FF1152C contains exactly two PowerPC 405 RISC processor blocks, as specified in Table 1 of DS083. Each block includes 16 KB instruction cache, 16 KB data cache, MMU, and dedicated OCM interface. Both cores operate at up to 400 MHz in -7 speed grade, enabling SMP or asymmetric firmware deployment within XC2VP40-7FF1152C.

Does XC2VP40-7FF1152C support IEEE 1149.1 boundary-scan testing?

Yes, XC2VP40-7FF1152C fully complies with IEEE 1149.1 (JTAG) boundary-scan standards. Its TAP controller supports EXTEST, INTEST, SAMPLE, PRELOAD, IDCODE, and USERCODE instructions, enabling board-level interconnect testing and in-system programming. This capability is documented in Module 1 Section "Boundary Scan" of DS083 and applies identically to the FF1152 package variant of XC2VP40-7FF1152C.

What I/O standards are supported by XC2VP40-7FF1152C's SelectIO-Ultra technology?

XC2VP40-7FF1152C supports 22 single-ended I/O standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI, PCI-X, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, HyperTransport). On-chip digitally controlled impedance (DCI) provides automatic 50 Ω termination for single-ended standards, and on-chip differential termination is available for LVDS and related protocols - all confirmed in DS083 Module 1.

Is XC2VP40-7FF1152C recommended for new designs?

No, XC2VP40-7FF1152C is marked "Product Not Recommended For New Designs" in DS083 v5.0 (June 2011). This status reflects Xilinx's end-of-life roadmap for the Virtex-II Pro family. However, Aetrix Electronics maintains active inventory and supply chain support for legacy industrial, aerospace, and telecom systems still dependent on XC2VP40-7FF1152C for maintenance and production continuity.