AMD XC2VP40-7FFG1152C
- Part No.:
- XC2VP40-7FFG1152C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1152-BBGA, FCBGA
- Datasheet:
-
XC2VP40-7FFG1152C.pdf
- Description:
- IC FPGA 692 I/O 1152FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,171
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC2VP40-7FFG1152C from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, 3,456 Kb of Block SelectRAM+ memory, and up to 12 RocketIO transceivers (configurable per package). It operates at 400 MHz CPU frequency and 3.125 Gb/s transceiver data rate in -7 speed grade, targeting high-performance embedded computing and serial interconnect applications in telecom and networking systems.
For engineers reviewing the XC2VP40-7FFG1152C datasheet, pinout, applications, or equivalent options, key selection considerations include its flip-chip BGA-1152 package with 804 user I/Os, dual-processor capability, DCM-based clock management, SelectIO-Ultra I/O support (LVDS, SSTL, HSTL), and SRAM-based in-system reprogrammability.
Technical Context
The XC2VP40-7FFG1152C integrates two IBM PowerPC 405 cores with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - enabling full embedded Linux or real-time OS execution. Its FPGA fabric includes Configurable Logic Blocks (CLBs) with dual 4-input LUTs per slice, distributed RAM, and carry chains for arithmetic acceleration.
RocketIO transceivers operate at up to 3.125 Gb/s full-duplex with 8B/10B encoding, on-chip 50 Ω termination, programmable pre-emphasis, and channel bonding across 2–20 lanes. The Digital Clock Manager (DCM) provides jitter-free clock synthesis, phase shifting in 1/256 increments, and deskew for global clock distribution.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,632 - supports complex digital signal processing and protocol stack implementation |
| PowerPC Cores | 2 × PowerPC 405 - enables symmetric multiprocessing or asymmetric host/peripheral partitioning |
| Max Transceiver Rate | 3.125 Gb/s - meets Gigabit Ethernet, Fibre Channel, and XAUI physical layer requirements |
| User I/O Count | 804 - accommodates wide parallel buses and high-pin-count peripheral interfaces |
| Block RAM | 3,456 Kb (192 × 18 Kb blocks) - sufficient for frame buffers, packet buffering, or FFT coefficient storage |
| Speed Grade | -7 - guarantees 400 MHz PowerPC operation and 3.125 Gb/s transceiver performance at commercial temperature |
| Core Voltage | 1.5 V (VCCINT) - defines power delivery architecture and thermal design envelope |
Pinout & Package
XC2VP40-7FFG1152C uses a 1.0 mm pitch Flip-Chip Fine-Pitch BGA (FFG1152) package with 1152 balls, optimized for high I/O count and thermal dissipation. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V configurable), differential pairs, and transceiver lanes.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master serial or SelectMAP programming |
| DONE | Configuration Status Output | Signals successful bitstream loading and device readiness for user logic execution |
| M0–M2 | Mode Selection Inputs | Determine configuration mode (slave serial, master serial, slave SelectMAP, etc.) at power-up |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enable IEEE 1149.1-compliant testing, debugging, and partial reconfiguration |
| DXP/DXN | Differential Clock Input Pair | Accepts LVDS or LVPECL reference clocks for DCM synchronization and transceiver CDR |
| GTxP/GTxN | RocketIO Transceiver Lane | Carries serialized 3.125 Gb/s data; requires external AC coupling and proper PCB impedance control |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Enables concurrent real-time control and data plane processing without external microcontroller |
| 192 × 18×18 Multipliers | Accelerates FIR filters, FFTs, and matrix operations with single-cycle multiply-accumulate capability |
| SelectIO-Ultra I/O | Supports 22 single-ended and 10 differential standards including LVDS (840 Mb/s), SSTL, and HSTL with on-chip DCI termination |
| Digital Clock Manager (DCM) | Provides jitter-reduced clock outputs with ±150 ps phase shift resolution and integer/fractional frequency synthesis |
| SRAM-Based Configuration | Allows unlimited in-field reprogramming, partial reconfiguration, and encrypted bitstream loading via DES |
Applications
| Wireless Baseband Processing | Gigabit Ethernet Line Card |
|---|---|
Use Scenario: Real-time modulation/demodulation, channel coding, and MIMO signal processing in 3G/LTE infrastructure. IC Role / Device Role / Timing Role: FPGA fabric implements DSP pipelines while dual PowerPC cores run protocol stacks and system management firmware. Use Value: Eliminates need for separate DSP ASIC and microcontroller, reducing board area and inter-chip latency. |
Use Scenario: 10-Gigabit Ethernet switch fabric with MAC, PHY interface, and traffic shaping logic. IC Role / Device Role / Timing Role: RocketIO transceivers handle XAUI serdes; CLBs implement packet classification and QoS engines. Use Value: Integrates 10GbE PHY interface, switching logic, and control processor in one device, lowering component count. |
| Fibre Channel Storage Controller | Industrial Video Processing Hub |
Use Scenario: High-throughput storage array controller interfacing with FC-AL or FC-SW backplanes. IC Role / Device Role / Timing Role: RocketIO links to FC transceivers; Block RAM buffers SCSI commands and data frames. Use Value: Achieves sub-100 ns read/write latency with hardware-accelerated CRC and scatter-gather DMA. |
Use Scenario: Multi-channel HD video ingest, scaling, compression, and display output in broadcast equipment. IC Role / Device Role / Timing Role: SelectIO-Ultra drives HDMI and LVDS panels; PowerPC runs V4L2 drivers and RTOS. Use Value: Synchronizes video timing across 4+ channels using DCM-generated phase-aligned clocks. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP50-7FFG1152C | Higher logic density (53,136 cells), 232 multiplier blocks, 4,176 Kb Block RAM | Better suited for larger protocol stacks or multi-protocol line cards requiring more fabric resources | Select when XC2VP40-7FFG1152C resource utilization exceeds 85% in critical paths |
| XC2VP70-7FFG1152C | 20 RocketIO transceivers, 74,448 logic cells, 5,904 Kb Block RAM, same package | Required for 20-lane channel-bonded applications like OC-192 or InfiniBand DDR | Choose only if >12 transceiver lanes or >60K logic cells are needed; higher power and cost |
Compared with XC2VP40-7FFG1152C, XC2VP50-7FFG1152C offers scalable logic headroom without changing PCB layout, while XC2VP70-7FFG1152C adds transceiver bandwidth at the expense of thermal design complexity and supply sequencing rigor.
Availability
XC2VP40-7FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, and high-speed storage controller designs requiring stable component supply and long-term lifecycle support.
Supply support for XC2VP40-7FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, now part of AMD, pioneered programmable logic solutions with industry-leading FPGA architectures, tools, and IP ecosystems for high-performance digital systems.
The Virtex-II Pro family was designed to unify hard processor subsystems with flexible FPGA fabric, targeting embedded applications where software-defined functionality and hardware acceleration coexist.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC2VP40-7FFG1152C?
The XC2VP40-7FFG1152C supports 400 MHz PowerPC 405 core operation in -7 speed grade under commercial temperature conditions. This requires adherence to XAPP755 guidelines for dual-processor timing closure. The XC2VP40-7FFG1152C datasheet specifies that exceeding 350 MHz in dual-core configurations mandates specific clock macro implementation to maintain stability.
Does XC2VP40-7FFG1152C include on-chip termination for differential I/O standards?
Yes, XC2VP40-7FFG1152C provides on-chip differential termination for LVDS, Extended LVDS, ULVDS, and LDT standards. Each differential pair uses two adjacent pads, and termination is programmable per I/O bank. This eliminates external resistors and improves signal integrity for high-speed interfaces like XAUI or Fibre Channel.
How many RocketIO transceivers are implemented in XC2VP40-7FFG1152C?
The XC2VP40-7FFG1152C supports up to 12 RocketIO transceivers depending on package configuration. In the FFG1152 package, all 12 transceivers are bonded out. The device can also be ordered in configurations with 0 or 8 transceivers, but XC2VP40-7FFG1152C specifically delivers 12 functional lanes at 3.125 Gb/s full-duplex.
Is XC2VP40-7FFG1152C compatible with partial reconfiguration workflows?
Yes, XC2VP40-7FFG1152C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated ICAP (Internal Configuration Access Port). Users can dynamically reload logic regions without resetting the PowerPC cores or disrupting active transceiver links, enabling field-upgradable functions in deployed systems.
What configuration modes does XC2VP40-7FFG1152C support?
XC2VP40-7FFG1152C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. The mode is selected by M0–M2 pins at power-up. Master SelectMAP allows autonomous boot from external PROM, while boundary-scan enables JTAG-based programming and verification.
XC2VP40-7FFG1152C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 1152-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4848
- Number of Logic Elements/Cells:
- 43632
- Total RAM Bits:
- 3538944
- Number of I/O:
- 692
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1152-FCBGA (35x35)
XC2VP40-7FFG1152C FAQ
1.How can I place an order for XC2VP40-7FFG1152C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP40-7FFG1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP40-7FFG1152C reliable?
The price and inventory of XC2VP40-7FFG1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP40-7FFG1152C is usually 5 days.
3.What payment methods are accepted for XC2VP40-7FFG1152C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP40-7FFG1152C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP40-7FFG1152C?
XC2VP40-7FFG1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP40-7FFG1152C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP40-7FFG1152C?
For technical support, including XC2VP40-7FFG1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP40-7FFG1152C requirements.
6.How does Aetrix verify that XC2VP40-7FFG1152C is sourced from the original manufacturer or authorized distributors?
All XC2VP40-7FFG1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP40-7FFG1152C meets industry standards.
7.What is the process for return or replacement of XC2VP40-7FFG1152C?
All XC2VP40-7FFG1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP40-7FFG1152C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP40-7FFG1152C part is unused and in its original packaging.
Return procedure for XC2VP40-7FFG1152C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC2VP40-7FFG1152C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
