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AMD XC2VP40-7FFG1152C

Part No.:
XC2VP40-7FFG1152C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
1152-BBGA, FCBGA
Datasheet:
AetrixXC2VP40-7FFG1152C.pdf
Description:
IC FPGA 692 I/O 1152FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,171

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Product details

Overview

XC2VP40-7FFG1152C from Xilinx is a Virtex-II Pro platform FPGA featuring dual PowerPC 405 RISC processor blocks, 43,632 logic cells, 192 18×18-bit multipliers, 3,456 Kb of Block SelectRAM+ memory, and up to 12 RocketIO transceivers (configurable per package). It operates at 400 MHz CPU frequency and 3.125 Gb/s transceiver data rate in -7 speed grade, targeting high-performance embedded computing and serial interconnect applications in telecom and networking systems.

For engineers reviewing the XC2VP40-7FFG1152C datasheet, pinout, applications, or equivalent options, key selection considerations include its flip-chip BGA-1152 package with 804 user I/Os, dual-processor capability, DCM-based clock management, SelectIO-Ultra I/O support (LVDS, SSTL, HSTL), and SRAM-based in-system reprogrammability.

Technical Context

The XC2VP40-7FFG1152C integrates two IBM PowerPC 405 cores with 16 KB instruction and 16 KB data caches, MMU, and OCM interface - enabling full embedded Linux or real-time OS execution. Its FPGA fabric includes Configurable Logic Blocks (CLBs) with dual 4-input LUTs per slice, distributed RAM, and carry chains for arithmetic acceleration.

RocketIO transceivers operate at up to 3.125 Gb/s full-duplex with 8B/10B encoding, on-chip 50 Ω termination, programmable pre-emphasis, and channel bonding across 2–20 lanes. The Digital Clock Manager (DCM) provides jitter-free clock synthesis, phase shifting in 1/256 increments, and deskew for global clock distribution.

Key Specifications

Parameter Value and Actual Design Meaning
Logic Cells43,632 - supports complex digital signal processing and protocol stack implementation
PowerPC Cores2 × PowerPC 405 - enables symmetric multiprocessing or asymmetric host/peripheral partitioning
Max Transceiver Rate3.125 Gb/s - meets Gigabit Ethernet, Fibre Channel, and XAUI physical layer requirements
User I/O Count804 - accommodates wide parallel buses and high-pin-count peripheral interfaces
Block RAM3,456 Kb (192 × 18 Kb blocks) - sufficient for frame buffers, packet buffering, or FFT coefficient storage
Speed Grade-7 - guarantees 400 MHz PowerPC operation and 3.125 Gb/s transceiver performance at commercial temperature
Core Voltage1.5 V (VCCINT) - defines power delivery architecture and thermal design envelope

Pinout & Package

XC2VP40-7FFG1152C uses a 1.0 mm pitch Flip-Chip Fine-Pitch BGA (FFG1152) package with 1152 balls, optimized for high I/O count and thermal dissipation. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V configurable), differential pairs, and transceiver lanes.

Pin/Terminal Circuit Role Design Meaning
CCLKConfiguration Clock InputDrives internal configuration state machine during master serial or SelectMAP programming
DONEConfiguration Status OutputSignals successful bitstream loading and device readiness for user logic execution
M0–M2Mode Selection InputsDetermine configuration mode (slave serial, master serial, slave SelectMAP, etc.) at power-up
TCK/TMS/TDI/TDOJTAG Boundary-Scan InterfaceEnable IEEE 1149.1-compliant testing, debugging, and partial reconfiguration
DXP/DXNDifferential Clock Input PairAccepts LVDS or LVPECL reference clocks for DCM synchronization and transceiver CDR
GTxP/GTxNRocketIO Transceiver LaneCarries serialized 3.125 Gb/s data; requires external AC coupling and proper PCB impedance control

Key Features

Feature Design Value
Dual PowerPC 405 CoresEnables concurrent real-time control and data plane processing without external microcontroller
192 × 18×18 MultipliersAccelerates FIR filters, FFTs, and matrix operations with single-cycle multiply-accumulate capability
SelectIO-Ultra I/OSupports 22 single-ended and 10 differential standards including LVDS (840 Mb/s), SSTL, and HSTL with on-chip DCI termination
Digital Clock Manager (DCM)Provides jitter-reduced clock outputs with ±150 ps phase shift resolution and integer/fractional frequency synthesis
SRAM-Based ConfigurationAllows unlimited in-field reprogramming, partial reconfiguration, and encrypted bitstream loading via DES

Applications

Wireless Baseband Processing Gigabit Ethernet Line Card

Use Scenario: Real-time modulation/demodulation, channel coding, and MIMO signal processing in 3G/LTE infrastructure.

IC Role / Device Role / Timing Role: FPGA fabric implements DSP pipelines while dual PowerPC cores run protocol stacks and system management firmware.

Use Value: Eliminates need for separate DSP ASIC and microcontroller, reducing board area and inter-chip latency.

Use Scenario: 10-Gigabit Ethernet switch fabric with MAC, PHY interface, and traffic shaping logic.

IC Role / Device Role / Timing Role: RocketIO transceivers handle XAUI serdes; CLBs implement packet classification and QoS engines.

Use Value: Integrates 10GbE PHY interface, switching logic, and control processor in one device, lowering component count.

Fibre Channel Storage Controller Industrial Video Processing Hub

Use Scenario: High-throughput storage array controller interfacing with FC-AL or FC-SW backplanes.

IC Role / Device Role / Timing Role: RocketIO links to FC transceivers; Block RAM buffers SCSI commands and data frames.

Use Value: Achieves sub-100 ns read/write latency with hardware-accelerated CRC and scatter-gather DMA.

Use Scenario: Multi-channel HD video ingest, scaling, compression, and display output in broadcast equipment.

IC Role / Device Role / Timing Role: SelectIO-Ultra drives HDMI and LVDS panels; PowerPC runs V4L2 drivers and RTOS.

Use Value: Synchronizes video timing across 4+ channels using DCM-generated phase-aligned clocks.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Alternative Part Technical Difference Application Difference Selection Advice
XC2VP50-7FFG1152CHigher logic density (53,136 cells), 232 multiplier blocks, 4,176 Kb Block RAMBetter suited for larger protocol stacks or multi-protocol line cards requiring more fabric resourcesSelect when XC2VP40-7FFG1152C resource utilization exceeds 85% in critical paths
XC2VP70-7FFG1152C20 RocketIO transceivers, 74,448 logic cells, 5,904 Kb Block RAM, same packageRequired for 20-lane channel-bonded applications like OC-192 or InfiniBand DDRChoose only if >12 transceiver lanes or >60K logic cells are needed; higher power and cost

Compared with XC2VP40-7FFG1152C, XC2VP50-7FFG1152C offers scalable logic headroom without changing PCB layout, while XC2VP70-7FFG1152C adds transceiver bandwidth at the expense of thermal design complexity and supply sequencing rigor.

Availability

XC2VP40-7FFG1152C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial video processing, and high-speed storage controller designs requiring stable component supply and long-term lifecycle support.

Supply support for XC2VP40-7FFG1152C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, pioneered programmable logic solutions with industry-leading FPGA architectures, tools, and IP ecosystems for high-performance digital systems.

The Virtex-II Pro family was designed to unify hard processor subsystems with flexible FPGA fabric, targeting embedded applications where software-defined functionality and hardware acceleration coexist.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP40-7FFG1152C?

The XC2VP40-7FFG1152C supports 400 MHz PowerPC 405 core operation in -7 speed grade under commercial temperature conditions. This requires adherence to XAPP755 guidelines for dual-processor timing closure. The XC2VP40-7FFG1152C datasheet specifies that exceeding 350 MHz in dual-core configurations mandates specific clock macro implementation to maintain stability.

Does XC2VP40-7FFG1152C include on-chip termination for differential I/O standards?

Yes, XC2VP40-7FFG1152C provides on-chip differential termination for LVDS, Extended LVDS, ULVDS, and LDT standards. Each differential pair uses two adjacent pads, and termination is programmable per I/O bank. This eliminates external resistors and improves signal integrity for high-speed interfaces like XAUI or Fibre Channel.

How many RocketIO transceivers are implemented in XC2VP40-7FFG1152C?

The XC2VP40-7FFG1152C supports up to 12 RocketIO transceivers depending on package configuration. In the FFG1152 package, all 12 transceivers are bonded out. The device can also be ordered in configurations with 0 or 8 transceivers, but XC2VP40-7FFG1152C specifically delivers 12 functional lanes at 3.125 Gb/s full-duplex.

Is XC2VP40-7FFG1152C compatible with partial reconfiguration workflows?

Yes, XC2VP40-7FFG1152C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated ICAP (Internal Configuration Access Port). Users can dynamically reload logic regions without resetting the PowerPC cores or disrupting active transceiver links, enabling field-upgradable functions in deployed systems.

What configuration modes does XC2VP40-7FFG1152C support?

XC2VP40-7FFG1152C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. The mode is selected by M0–M2 pins at power-up. Master SelectMAP allows autonomous boot from external PROM, while boundary-scan enables JTAG-based programming and verification.

XC2VP40-7FFG1152C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-II Pro
Package/Case:
1152-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
4848
Number of Logic Elements/Cells:
43632
Total RAM Bits:
3538944
Number of I/O:
692
Number of Gates:
-
Voltage - Supply:
1.425V ~ 1.575V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
1152-FCBGA (35x35)

XC2VP40-7FFG1152C FAQ

1.How can I place an order for XC2VP40-7FFG1152C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC2VP40-7FFG1152C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC2VP40-7FFG1152C reliable?

The price and inventory of XC2VP40-7FFG1152C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP40-7FFG1152C is usually 5 days.

3.What payment methods are accepted for XC2VP40-7FFG1152C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP40-7FFG1152C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC2VP40-7FFG1152C?

XC2VP40-7FFG1152C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC2VP40-7FFG1152C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC2VP40-7FFG1152C?

For technical support, including XC2VP40-7FFG1152C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP40-7FFG1152C requirements.

6.How does Aetrix verify that XC2VP40-7FFG1152C is sourced from the original manufacturer or authorized distributors?

All XC2VP40-7FFG1152C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP40-7FFG1152C meets industry standards.

7.What is the process for return or replacement of XC2VP40-7FFG1152C?

All XC2VP40-7FFG1152C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP40-7FFG1152C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC2VP40-7FFG1152C part is unused and in its original packaging.

Return procedure for XC2VP40-7FFG1152C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC2VP40-7FFG1152C Tags

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