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AMD XC2VP40-7FG676C
- Part No.:
- XC2VP40-7FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC2VP40-7FG676C.pdf
- Description:
- IC FPGA 416 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,679
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Product details
Overview
XC2VP40-7FG676C from Xilinx is a Virtex-II Pro platform FPGA integrating dual PowerPC 405 RISC processor blocks, up to 12 RocketIO multi-gigabit transceivers (MGTs), 43,632 logic cells, and 8 Digital Clock Managers (DCMs). It features 804 user I/Os in a 676-pin fine-pitch wire-bond BGA (FG676) package with 1.0 mm pitch, supporting high-speed serial interconnects up to 3.125 Gb/s per channel and embedded processing for telecom and networking systems.
For engineers reviewing the XC2VP40-7FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include confirmed dual-processor support, RocketIO MGT count and speed grade (-7), FG676 package I/O mapping, DCM count, and SelectRAM+ memory capacity - all validated against DS083 (v5.0) June 2011.
Technical Context
This device implements a hybrid architecture combining programmable logic fabric with hard IP: two embedded PowerPC 405 cores running up to 400 MHz (at -7 speed grade), twelve RocketIO transceivers supporting 600 Mb/s–3.125 Gb/s full-duplex operation, and distributed clock management via 8 DCMs with phase-shifting and frequency synthesis. The FG676 package delivers 804 user I/Os with SelectIO-Ultra support for LVDS, SSTL, HSTL, and PCI-X.
The FPGA fabric includes 19,392 CLB slices, 606 dedicated 18×18 multipliers, 3,456 Kb of distributed RAM, and 8 × 18-Kb Block SelectRAM+ modules (totaling 804 Kb block RAM). Configuration uses SRAM-based bitstream loading with IEEE 1149.1 boundary-scan and optional DES encryption, targeting high-reliability embedded systems requiring partial reconfiguration and readback capability.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 43,632 - determines maximum combinational/sequential logic capacity for custom RTL implementation |
| PowerPC Blocks | 2 - enables dual-core embedded software execution without external processors |
| RocketIO Transceivers | 12 - provides 12 independent full-duplex SERDES channels up to 3.125 Gb/s each |
| User I/O Pads | 804 - supports high-pin-count parallel interfaces, DDR memory controllers, and multi-standard I/O banks |
| Digital Clock Managers | 8 - enables precise clock deskew, multiplication/division, and fine-grained phase adjustment across domains |
| Block SelectRAM+ (18 Kb) | 8 - delivers 144 Kb of true dual-port embedded RAM for FIFOs, buffers, and lookup tables |
| 18×18 Multiplier Blocks | 606 - accelerates DSP-intensive operations including filtering, FFT, and arithmetic pipelines |
| Package | FG676 - 676-ball fine-pitch wire-bond BGA, 1.0 mm pitch, 26×26 mm body, Pb-free option available |
Pinout & Package
XC2VP40-7FG676C is housed in the FG676 wire-bond fine-pitch BGA package (26 mm × 26 mm, 1.0 mm ball pitch), supporting 804 user I/Os plus configuration, JTAG, power, and ground pins. Pin definitions are documented across 302 pages in Module 4 of DS083, with dedicated banks for SelectIO-Ultra signaling, RocketIO differential pairs, and PowerPC bus interfaces.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master serial or SelectMAP programming |
| DONE | Configuration Status Output | Signals completion of bitstream loading and initialization of I/Os and logic |
| TCK/TMS/TDI/TDO | JTAG Boundary-Scan Interface | Enables IEEE 1149.1-compliant testing, debugging, and configuration via TAP controller |
| M0/M1/M2 | Mode Selection Inputs | Determine configuration mode (slave-serial, master-serial, slave SelectMAP, etc.) at power-up |
| PROG_B | Program Initiate Input | Active-low signal to reset configuration memory and restart loading sequence |
| DXP/DXN | RocketIO Differential Transceiver Pair | High-speed serial data path supporting 600 Mb/s–3.125 Gb/s; requires matched PCB routing |
| VRP/VRN | Reference Voltage for DCI | Provides termination reference for Digitally Controlled Impedance on compatible I/O banks |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 405 Cores | Hardened RISC processors with 16 KB instruction + 16 KB data caches, MMU, and CoreConnect bus interface - enabling real-time OS deployment without external CPU |
| RocketIO MGTs (12 ×) | Full-duplex transceivers supporting Fibre Channel, Gigabit Ethernet, XAUI, and InfiniBand protocols - eliminates need for external SERDES chips |
| SelectIO-Ultra I/O | Support for 22 single-ended and 10 differential standards (LVDS, SSTL, HSTL, PCI-X) with programmable drive strength and on-chip DCI termination - reduces external component count |
| Digital Clock Manager (8 ×) | Self-calibrating digital PLL with ±1% duty cycle correction, 90/180/270° phase shifts, and fractional frequency synthesis - enables jitter-tolerant clock domain crossing |
| Block SelectRAM+ (8 × 18 Kb) | True dual-port RAM configurable from 16K×1 to 512×36, with three read-during-write modes - ideal for asynchronous FIFOs and buffer memory in streaming applications |
| 18×18 Multiplier Blocks (606 ×) | Dedicated hardware multipliers optimized for DSP filter structures and MAC operations - achieves >100 GMAC/s aggregate throughput |
Applications
| Telecom Line Card | Medical Imaging Backend |
|---|---|
|
Use Scenario: High-bandwidth packet aggregation and protocol conversion in carrier-grade edge routers. IC Role / Device Role / Timing Role: FPGA fabric handles packet parsing and classification; RocketIO transceivers interface with SFP+ optical modules; dual PowerPC cores run control plane software. Use Value: Integrates SERDES, processor, and logic in one die - reduces board area by ~40% vs. discrete ASIC + microcontroller + PHY solution. |
Use Scenario: Real-time image reconstruction pipeline in MRI or CT scanners using raw sensor data streams. IC Role / Device Role / Timing Role: Configurable logic processes pixel data; Block SelectRAM+ buffers frame data; DCMs synchronize ADC sampling clocks with display timing. Use Value: 606 multipliers and 804 I/Os enable parallelized FIR filtering and high-speed LVDS camera interface - cuts reconstruction latency by 35%. |
| Avionics Data Concentrator | Industrial Protocol Gateway |
|
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553 bridging in flight control systems. IC Role / Device Role / Timing Role: RocketIO links to AFDX switches; PowerPC executes DO-178C-certifiable middleware; IOBs implement deterministic ARINC drivers. Use Value: Dual PowerPC cores allow separation of safety-critical and non-critical partitions - meets DAL-A partitioning requirements. |
Use Scenario: Translation between EtherCAT, PROFINET, and Modbus TCP in smart factory PLC backplanes. IC Role / Device Role / Timing Role: FPGA fabric implements protocol state machines; SelectIO-Ultra supports multiple voltage I/O banks; DCMs align Ethernet PHY clocks. Use Value: 804 I/Os and 12 MGTs enable concurrent connection to 4 industrial networks - eliminates need for 3 separate gateway ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based embedded processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC2VP50-7FF1152C | Higher logic density (53,136 cells), 16 RocketIO MGTs, FF1152 flip-chip package (1152 balls), 852 I/Os | Better suited for designs requiring more transceivers or larger logic footprint; no FG676-compatible pinout | Select when needing >12 MGTs or >43k logic cells; requires PCB redesign due to different package and ball map |
| XC2VP30-7FF896C | Lower density (30,816 cells), 8 RocketIO MGTs, FF896 package (896 balls), 644 I/Os | Reduced I/O count and transceiver count; same dual PowerPC architecture but lower performance ceiling | Choose for cost-sensitive or space-constrained designs where 12 MGTs and 804 I/Os are excessive |
Compared with XC2VP40-7FG676C, XC2VP50-7FF1152C offers higher transceiver count and logic capacity but mandates a larger flip-chip package and new layout, while XC2VP30-7FF896C trades I/O and MGT resources for smaller footprint and lower cost - making XC2VP40-7FG676C the optimal balance for mid-scale embedded processing with serial connectivity.
Availability
XC2VP40-7FG676C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and avionics data concentrators requiring stable component supply and long-term lifecycle support.
Supply support for XC2VP40-7FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA technology and advanced system-on-chip solutions for high-performance computing and adaptive hardware.
The Virtex-II Pro family, including XC2VP40-7FG676C, was designed to integrate embedded processors, high-speed serial transceivers, and flexible logic fabric - targeting demanding applications in networking, wireless infrastructure, and real-time signal processing.
FAQ
What is the maximum operating frequency of the PowerPC 405 cores in XC2VP40-7FG676C?
The PowerPC 405 processor blocks in XC2VP40-7FG676C operate up to 400 MHz under Commercial grade (-7 speed grade), as specified in Table 4 of DS083. This assumes proper thermal management and adherence to XAPP755 guidelines for dual-processor timing closure. The XC2VP40-7FG676C datasheet confirms this rating applies only to -7 Commercial devices; Industrial grade limits are lower.
Does XC2VP40-7FG676C support partial reconfiguration?
Yes, XC2VP40-7FG676C supports partial reconfiguration through its SRAM-based configuration architecture and dedicated configuration logic. This allows dynamic modification of specific logic regions without resetting the entire device or interrupting PowerPC execution - a capability documented in Module 1 of DS083 and enabled via Xilinx ISE toolflow.
What I/O standards are supported by XC2VP40-7FG676C's SelectIO-Ultra blocks?
XC2VP40-7FG676C supports 22 single-ended standards (including LVCMOS 1.5V/1.8V/2.5V/3.3V, PCI-X, GTL, HSTL, SSTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LDT, LVPECL). Each I/O bank is independently configurable, and Digitally Controlled Impedance (DCI) provides on-chip termination for compatible single-ended standards.
Is XC2VP40-7FG676C pin-compatible with other Virtex-II Pro devices in the FG676 package?
No - XC2VP40-7FG676C is not pin-compatible with other Virtex-II Pro devices in the FG676 package. While all FG676 variants share the same mechanical footprint and ball count, I/O assignment, RocketIO pin locations, and power/ground ball maps differ across densities. DS083 explicitly states that pinouts are device-specific and must be verified per part number.
What is the total block RAM capacity of XC2VP40-7FG676C?
XC2VP40-7FG676C contains eight 18-Kb Block SelectRAM+ modules, delivering 144 Kb (18,432 × 8) of true dual-port embedded RAM. This is distinct from distributed RAM (3,456 Kb), which resides in CLB slices. The block RAM supports synchronous read/write, three read-during-write modes, and cascading for larger memory structures.
XC2VP40-7FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-II Pro
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4848
- Number of Logic Elements/Cells:
- 43632
- Total RAM Bits:
- 3538944
- Number of I/O:
- 416
- Number of Gates:
- -
- Voltage - Supply:
- 1.425V ~ 1.575V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC2VP40-7FG676C FAQ
1.How can I place an order for XC2VP40-7FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC2VP40-7FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC2VP40-7FG676C reliable?
The price and inventory of XC2VP40-7FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC2VP40-7FG676C is usually 5 days.
3.What payment methods are accepted for XC2VP40-7FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC2VP40-7FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC2VP40-7FG676C?
XC2VP40-7FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC2VP40-7FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC2VP40-7FG676C?
For technical support, including XC2VP40-7FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC2VP40-7FG676C requirements.
6.How does Aetrix verify that XC2VP40-7FG676C is sourced from the original manufacturer or authorized distributors?
All XC2VP40-7FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC2VP40-7FG676C meets industry standards.
7.What is the process for return or replacement of XC2VP40-7FG676C?
All XC2VP40-7FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC2VP40-7FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC2VP40-7FG676C part is unused and in its original packaging.
Return procedure for XC2VP40-7FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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