AMD XC2VP40-7FGG676C

Overview

XC2VP40-7FGG676C from Xilinx is a Virtex-II Pro platform FPGA featuring two embedded PowerPC 405 RISC processor blocks, up to 12 RocketIO multi-gigabit transceivers (in FGG676 package), 43,632 logic cells, and 804 user I/Os in a 676-pin fine-pitch wire-bond BGA. It delivers 400 MHz processor operation and supports 2.5 Gb/s transceiver data rates for telecom and networking systems requiring integrated processing and high-speed serial I/O.

For engineers reviewing the XC2VP40-7FGG676C datasheet, pinout, applications, or equivalent options, key selection considerations include dual PowerPC 405 core support, RocketIO transceiver count per package variant, DCM-based clock management, SelectIO-Ultra I/O flexibility, and compatibility with legacy Xilinx Virtex-II Pro design flows and IP cores.

Technical Context

The XC2VP40-7FGG676C implements a hybrid architecture combining programmable logic fabric with hard IP: two PowerPC 405 cores operate at up to 400 MHz (speed grade -7), each with 16 KB instruction and data caches and MMU support; its RocketIO transceivers are configurable for 600 Mb/s to 3.125 Gb/s full-duplex operation, with on-chip 50 Ω termination and 8B/10B encoding.

Logic resources include 19,392 CLB slices, 192 18×18 multipliers, 3,456 Kb of Block SelectRAM+ memory, and twelve Digital Clock Managers (DCMs) enabling precise phase shifting, frequency synthesis, and deskew - all built on a 0.13 µm nine-layer copper process with 1.5 V core voltage and 2.5 V auxiliary supplies.

Key Specifications

Pinout & Package

XC2VP40-7FGG676C uses a 676-ball fine-pitch wire-bond BGA (FGG676) with 1.0 mm pitch, 26 mm × 26 mm body size, and Pb-free construction. Pin definitions follow Xilinx DS083 Module 4, covering configuration, JTAG, power, ground, I/O banks, and dedicated transceiver lanes.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP40-7FGG676C, XC2VP50-7FF1152C offers more transceivers and I/Os in a larger flip-chip package, while XC2VP70-7FF896C provides significantly higher logic capacity and transceiver count - both demand revised PCB layout, power delivery, and thermal management versus the wire-bond FGG676 form factor.

Availability

XC2VP40-7FGG676C is available at Aetrix Electronics and suitable for telecom infrastructure, industrial protocol gateways, medical imaging backplanes, and defense radar signal processors requiring stable component supply and long-term obsolescence planning.

Supply support for XC2VP40-7FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, now part of AMD, is a pioneer in programmable logic technology, delivering FPGA, SoC, and adaptive compute acceleration solutions since 1984.

The Virtex-II Pro family, including XC2VP40-7FGG676C, was engineered for high-performance embedded systems integrating processor cores, high-speed serial I/O, and configurable logic - targeting telecom, aerospace, and industrial applications demanding hardware-software co-design.

FAQ

What is the maximum operating frequency of the PowerPC 405 cores in XC2VP40-7FGG676C?

The XC2VP40-7FGG676C supports PowerPC 405 core operation at up to 400 MHz under commercial temperature conditions (speed grade -7). This rating assumes proper board-level decoupling, thermal management, and adherence to Xilinx's recommended power sequencing. The actual achievable frequency depends on cache hit rate, bus contention, and peripheral interface timing - verified using Xilinx EDK tools and timing analysis reports for the XC2VP40-7FGG676C design.

Does XC2VP40-7FGG676C support DDR2 memory interfaces?

XC2VP40-7FGG676C does not natively support DDR2 SDRAM interfaces. Its SelectIO-Ultra I/O blocks support DDR (not DDR2) signaling with built-in DDR input/output registers, and it complies with SSTL-2 Class II for 2.5 V DDR memory. For DDR2, external PHY or migration to Virtex-4 or later families is required - the XC2VP40-7FGG676C datasheet explicitly lists only DDR, not DDR2, among supported memory standards.

How many RocketIO transceivers are active in XC2VP40-7FGG676C with the FGG676 package?

In the XC2VP40-7FGG676C, the FGG676 wire-bond package enables 12 RocketIO transceivers. This is confirmed in Table 3 of DS083 (v5.0), which lists "804 / 0" for FF1148 (no transceivers bonded out) but "692 / 12" for FGG676 - meaning 692 user I/Os and 12 RocketIO transceivers. The "0(3), 8, or 12" notation in Table 1 refers to device-level capability; the FGG676 package variant realizes the 12-transceiver configuration.

Is XC2VP40-7FGG676C pin-compatible with other Virtex-II Pro devices in the FGG676 package?

No, XC2VP40-7FGG676C is not pin-compatible with other Virtex-II Pro devices in the FGG676 package. While the FGG676 mechanical footprint is shared, pin functions differ across devices due to varying resource allocation - e.g., XC2VP30-7FGG676C has 644 user I/Os and 8 transceivers, whereas XC2VP40-7FGG676C has 804 user I/Os and 12 transceivers. Pin assignments for configuration, power, and I/O banks are device-specific and defined in DS083 Module 4.

What configuration modes does XC2VP40-7FGG676C support?

XC2VP40-7FGG676C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is determined by M0–M2 pin states at power-up. Master modes use internal oscillators to drive configuration clocks; slave modes rely on external controllers. All modes support bitstream encryption via on-chip DES decryptor, and configuration readback is available for verification and debug of the XC2VP40-7FGG676C.