AMD XC2VP4-5FF672C

Overview

XC2VP4-5FF672C from Xilinx is a Virtex-II Pro platform FPGA integrating one PowerPC 405 RISC processor core, four RocketIO multi-gigabit transceivers (up to 3.125 Gb/s), 6,768 logic cells, and 504 Kb of Block SelectRAM+ memory in a 672-pin flip-chip fine-pitch BGA package. It targets high-speed serial interconnect and embedded processing applications such as telecom line cards and network interface modules.

For engineers reviewing the XC2VP4-5FF672C datasheet, pinout, applications, or equivalent options, key selection criteria include its -5 speed grade (300 MHz PowerPC, 2.0 Gb/s RocketIO), FF672 package I/O count (348 user I/Os), and integrated DCM-based clock management for deterministic timing closure in mixed-signal systems.

Technical Context

The XC2VP4-5FF672C implements a hybrid architecture combining programmable logic fabric with hard IP blocks: a single 300 MHz PowerPC 405 core with 16 KB instruction and 16 KB data cache, four RocketIO transceivers supporting 600 Mb/s–3.125 Gb/s full-duplex SERDES, and twelve Digital Clock Manager (DCM) modules for phase-aligned clock synthesis and deskew.

Its logic fabric includes Configurable Logic Blocks (CLBs) with dual 4-input LUTs per slice, 18×18-bit dedicated multipliers, and Block SelectRAM+ modules configurable as 16K×1 to 512×36 true dual-port RAM - all interconnected via Active Interconnect routing with predictable delay independent of fanout.

Key Specifications

Pinout & Package

XC2VP4-5FF672C is housed in a 672-ball flip-chip fine-pitch BGA (FF672) package with 1.0 mm pitch, optimized for signal integrity and thermal dissipation in high-density PCB layouts. Pin definitions follow Xilinx DS083 Module 4, with dedicated banks for VCCAUX (2.5 V), VCCO (1.5/1.8/2.5/3.3 V configurable), and transceiver reference clocks.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based embedded processing applications.

Compared with XC2VP4-5FF672C, the XC2VP4-6FF672C delivers higher clock rates without changing PCB layout, while the XC2VP7-5FF676C increases system bandwidth and logic headroom at the cost of larger footprint and higher power - making XC2VP4-5FF672C optimal for cost-sensitive, mid-density embedded platforms.

Availability

XC2VP4-5FF672C is available at Aetrix Electronics and suitable for telecom line cards, network interface modules, video processing engines, and industrial protocol gateways requiring stable component supply throughout extended product lifecycles.

Supply support for XC2VP4-5FF672C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Xilinx, Inc. is a semiconductor company specializing in programmable logic devices, acquired by AMD in 2022. It pioneered FPGA architectures with embedded processors and high-speed transceivers.

The Virtex-II Pro family, including XC2VP4-5FF672C, was designed for high-performance embedded systems requiring integrated processing, serial connectivity, and flexible logic - targeting telecom, networking, and video infrastructure markets.

FAQ

What is the maximum operating frequency of the PowerPC 405 core in XC2VP4-5FF672C?

The XC2VP4-5FF672C PowerPC 405 core operates at a maximum frequency of 300 MHz, as defined by its -5 speed grade. This rating applies under commercial temperature conditions and assumes proper decoupling, voltage regulation, and thermal management. The XC2VP4-5FF672C datasheet specifies this limit in Table 4 of DS083 (v5.0), and exceeding it may result in timing violations or functional failure.

Does XC2VP4-5FF672C support JTAG boundary-scan testing?

Yes, XC2VP4-5FF672C fully supports IEEE 1149.1-compliant boundary-scan testing via dedicated TCK, TMS, TDI, and TDO pins. These pins enable in-circuit testing, device programming, and debug access without requiring physical probes. The boundary-scan logic is factory-tested and documented in Module 1 of DS083, confirming operational compliance for production test environments.

What I/O standards are supported by XC2VP4-5FF672C's SelectIO-Ultra technology?

XC2VP4-5FF672C supports 22 single-ended standards (including LVCMOS 1.5/1.8/2.5/3.3 V, SSTL, HSTL, PCI, GTL) and 10 differential standards (LVDS, BLVDS, ULVDS, LVPECL, LDT). Its Digitally Controlled Impedance (DCI) feature provides on-die termination for single-ended I/Os, and on-chip differential termination is available for LVDS and related standards - all confirmed in DS083 Module 1 Section "SelectIO-Ultra Technology".

Is XC2VP4-5FF672C pin-compatible with other Virtex-II Pro devices in FF672 package?

No, XC2VP4-5FF672C is not pin-compatible with other Virtex-II Pro devices in the FF672 package, such as XC2VP2-5FF672C or XC2VP7-5FF672C. While they share the same package outline and ball pitch, the assignment of I/O banks, transceiver pairs, and power/ground balls differs per device density and resource allocation - as specified in DS083 Module 4 pinout tables.

What configuration modes does XC2VP4-5FF672C support?

XC2VP4-5FF672C supports five configuration modes: slave-serial, master-serial, slave SelectMAP, master SelectMAP, and IEEE 1532 boundary-scan. Mode selection is controlled by M0–M2 pins at power-up. Configuration bitstreams can be loaded via JTAG, PROM, or microprocessor interface, and optional DES encryption secures bitstream content - details are in DS083 Module 1 "Configuration" section.